IEC 60749-35:2006
半导体器件.机械和气候试验方法.第35部分:塑封电子器件的超声显微检测方法
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
哪些标准引用了IEC 60749-35:2006
- 标准号
- IEC 60749-35:2006
- 发布
- 2006年
- 发布单位
- 国际电工委员会
- 当前最新
- IEC 60749-35:2006
- 被代替标准
- IEC 47/1863/FDIS:2006 IEC/PAS 62191:2000
- 适用范围
- This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.