This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
IEC 60068-2-69-2007由国际电工委员会 IX-IEC 发布于 2007-05。
IEC 60068-2-69-2007 在中国标准分类中归属于: L04 基础标准与通用方法,在国际标准分类中归属于: 19.040 环境试验,31.190 电子元器件组件。
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