This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
IEC 61188-5-4-2007由国际电工委员会 IX-IEC 发布于 2007-10。
IEC 61188-5-4-2007 在中国标准分类中归属于: L30 印制电路,在国际标准分类中归属于: 31.180 印制电路和印制电路板。
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