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semiconductor chip
semiconductor chip, Total:56 items.
In the international standard classification, semiconductor chip involves: Integrated circuits. Microelectronics, Semiconductor devices, Cutting tools, Insulating materials, Semiconducting materials, Character sets and information coding, Applications of information technology.
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, semiconductor chip
- GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation
- GB/T 35010.2-2018 Semiconductor die products—Part 2: Exchange data formats
- GB/T 35010.5-2018 Semiconductor die products—Part 5：Requirements for concerning electrical simulation
- GB/T 35010.1-2018 Semiconductor die products—Part 1：Requirements for procurement and use
- GB/T 35010.7-2018 Semiconductor die products—Part 7: XML schema for data exchange
- GB/T 35010.8-2018 Semiconductor die products—Part8: EXPRESS model schema for data exchange
- GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
- GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage
Danish Standards Foundation, semiconductor chip
- DS/EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
- DS/EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
- DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
- DS/CLC/TR 62258-7:2008 Semiconductor die products - Part 7: XML schema for data exchange
- DS/CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
- DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
- DS/ES 59008-4-1:2001 Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality
- DS/CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
Association Francaise de Normalisation, semiconductor chip
- NF EN 62258-1:2011 Produits de puces de semiconducteurs - Partie 1 : approvisionnement et utilisation
- NF EN 62258-2:2011 Produits de puces de semiconducteurs - Partie 2 : formats d'échange de données
ES-UNE, semiconductor chip
- UNE-EN 62258-1:2010 Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)
- UNE-EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)
- UNE-EN 62258-6:2006 Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation(IEC 62258-6:2006) (Endorsed by AENOR in January of 2007.)
- UNE-EN 62258-5:2006 Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006) (Endorsed by AENOR in January of 2007.)
CENELEC - European Committee for Electrotechnical Standardization, semiconductor chip
- EN 62258-2:2005 Semiconductor die products Part 2: Exchange data formats
- EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
- ES 59008-4-3-1999 Data Requirements for Semiconductor Die Part 4-3: Specific Requirements and Recommendations - Thermal
- ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
- ES 59008-4-4-1999 Data Requirements for Semiconductor Die Part 4-4: Specific Requirements and Recommendations Electrical Simulation
- ES 59008-4-2-2000 2001 Data Requirements for Semiconductor Die - Part 4-2: Specific Requirements and Recommendations Handling and Storage
- ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
German Institute for Standardization, semiconductor chip
- DIN EN 62258-2:2011-12 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 / Note: DIN EN 62258-2 (2005-12) remains valid alongside this standard until 2014-06-29.
- DIN EN 62258-6:2007-02 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
- DIN EN 62258-5:2007-02 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
- DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
- DIN EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011
British Standards Institution (BSI), semiconductor chip
- PD IEC/TR 62258-7:2007 Semiconductor die products. XML schema for data exchange
- PD IEC/TR 62258-8:2008 Semiconductor die products. EXPRESS model schema for data exchange
- BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
- PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
- PD CLC/TR 62258-3:2007 Semiconductor die products. Recommendations for good practice in handling, packing and storage
- PD ES 59008-6-2:2001 Data requirements for semiconductor die. Exchange data formats and data dictionary. Data dictionary
- PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
- PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, semiconductor chip
- GB/T 43136-2023 Superabrasive products: grinding wheels for precision scribing of semiconductor chips
SE-SIS, semiconductor chip
Association of German Mechanical Engineers, semiconductor chip
European Committee for Electrotechnical Standardization（CENELEC）, semiconductor chip
- CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
- CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
- CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
- CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
- CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
Lithuanian Standards Office , semiconductor chip
- LST EN 62258-2-2011 Semiconductor die products -- Part 2: Exchange data formats (IEC 62258-2:2011)
PT-IPQ, semiconductor chip
未注明发布机构, semiconductor chip
- BS CECC 13:1985(1999) Harmonized system of quality assessment for electronic components : Basic specification : Scanning electron microscope inspection of semiconductor dice
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, semiconductor chip
- JEDEC JESD49A.01-2013 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD) (Minor Revision of JESD49, SEPTEMBER 2005, Reaffirmed January 2009)
Group Standards of the People's Republic of China, semiconductor chip
Professional Standard - Electron, semiconductor chip
- SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices