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Semiconductor Chip Machinery

Semiconductor Chip Machinery, Total:499 items.

In the international standard classification, Semiconductor Chip Machinery involves: Optoelectronics. Laser equipment, Semiconductor devices, Applications of information technology, Integrated circuits. Microelectronics, Fibre optic communications, Cutting tools, Insulating materials, Semiconducting materials, Graphical symbols, Safety of machinery, Industrial automation systems, Electrical engineering in general, Audio, video and audiovisual engineering, Mechanical structures for electronic equipment, Transformers. Reactors, Electromechanical components for electronic and telecommunications equipment, Electronic components in general, Technical drawings, Character sets and information coding, Printed circuits and boards, Acoustics and acoustic measurements.

Fujian Provincial Standard of the People's Republic of China, Semiconductor Chip Machinery

DB35/T 1193-2011 Semiconductor LED chip

Professional Standard - Electron, Semiconductor Chip Machinery

SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
SJ/T 11398-2009 Technical specification for power light-emitting diode chips
SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources
SJ/Z 9021.1-1987 Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
SJ/Z 9016-1987 Semiconductor devices--Mechanical and climatic test methods
SJ 2073-1982 Cores for IF transformers and medium wave oscillator coil of transistor radio receivers
SJ/T 10745-1996 Mechanical and climatic test methods for semiconductor integrated circuits
SJ/Z 9021.2-1987 Mechanical standardization of semiconductor devices--Part 2:Dimensions
SJ 2072-1982 Cores for IF transformers of transistor and for short wave oscillator coils of radio receivers
SJ/Z 9021.4-1987 Mechanical standardization of semiconductor components Part 4 Classification and coding system for package outlines of semiconductor components

国家市场监督管理总局、中国国家标准化管理委员会, Semiconductor Chip Machinery

GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation

AENOR, Semiconductor Chip Machinery

UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
UNE-EN 60749-8:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE-EN 60749-1:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
UNE-EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere.
UNE-EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
UNE-EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 17: Neutron irradiation
UNE-EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
UNE-EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
UNE-EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency.
UNE-EN 60191-6-10:2004 Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
UNE-EN 60749-36:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state

Danish Standards Foundation, Semiconductor Chip Machinery

DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DS/EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
DS/EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
DS/CLC/TR 62258-7:2008 Semiconductor die products - Part 7: XML schema for data exchange
DS/CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
DS/ES 59008-4-1:2001 Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality
DS/EN 60749-10/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
DS/CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
DS/IEC 749:1986 Semiconductor devices. Mechanical and climatic test methods
DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DS/EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
DS/EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
DS/EN 60749-8+Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
DS/EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
DS/EN 60749-2/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-13/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-2:2003 Semiconductor Devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DS/EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
DS/EN 60749-22+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght
DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
DS/EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
DS/EN 60749-6/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-12/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
DS/EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DS/EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

German Institute for Standardization, Semiconductor Chip Machinery

DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
DIN EN 62258-2:2011-12 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 / Note: DIN EN 62258-2 (2005-12) remains valid alongside this standard until 2014-06-29.
DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
DIN EN 62258-6:2007-02 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
DIN EN 62258-5:2007-02 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
DIN EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002
DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
DIN EN 60749-10:2003-04 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-07-01.
DIN EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
DIN EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011
DIN EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...
DIN EN 60191-6-16:2007-11 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 / Note: To be replaced by DIN EN 60191-6-16 (2013-...
DIN EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
DIN EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
DIN EN 60749-8:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standa...
DIN EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2002); German version EN 60749-13:2002
DIN EN 60191-6-1:2002-08 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60...
DIN EN 60191-6-5:2002-05 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German vers...
DIN EN 60191-6-3:2001-06 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...
DIN EN 60191-6-6:2002-02 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German vers...
DIN EN 60191-6-8:2002-05 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Ge...
DIN EN 60191-6-2:2002-09 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal package...
DIN EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
DIN EN IEC 60749-13:2018-10 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018 / Note: DIN EN 60749-13 (2003-04) remains valid alongside this standard until 2021-03-22.
DIN EN 60749-21:2012-01 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 / Note: DIN EN 60749-21 (2005-06) remains valid alongside this standard until 2014-05-12.
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
DIN EN 60749-44:2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
DIN EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
DIN EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003
DIN EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
DIN EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
DIN EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002); German version EN 60749-6:2003
DIN EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002
DIN EN 60749-22:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard unti...
DIN EN IEC 60749-12:2018-07 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018 / Note: DIN EN 60749-12 (2003-04) remains valid alongside this standard until 2021-01-17.
DIN EN 60749-25:2004-04 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-0...
DIN EN 60749-27:2013-04 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012 / Note: DIN EN 60749-27 (2007-01) re...
DIN EN 60749-29:2012-01 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2011); German version EN 60749-29:2011 / Note: DIN EN 60749-29 (2004-07) remains valid alongside this standard until 2014-05-12.
DIN EN 60749-6:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017 / Note: DIN EN 60749-6 (2003-04) remains valid alongside this standard until 2020-04-07.
DIN EN 60749-34:2011-05 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010 / Note: DIN EN 60749-34 (2004-10) remains valid alongside this standard until 2013-12-01.
DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
DIN EN 60749-38:2008-10 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN IEC 60749-10:2023-06 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022 / Note: Date of issue 2023-05-19*Intended as replacement for DIN EN 60749-10 (200...

Group Standards of the People's Republic of China, Semiconductor Chip Machinery

T/QGCML 2041-2023

British Standards Institution (BSI), Semiconductor Chip Machinery

BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
PD IEC/TR 62258-7:2007 Semiconductor die products. XML schema for data exchange
PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
PD IEC/TR 62258-8:2008 Semiconductor die products. EXPRESS model schema for data exchange
PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
BS EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Mechanical shock
BS IEC 60191-2:1966+A21:2020 Mechanical standardization of semiconductor devices. Dimensions
PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
BS EN 60749:1999 Semiconductor devices - Mechanical and climatic test methods
BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
PD CLC/TR 62258-3:2007 Semiconductor die products. Recommendations for good practice in handling, packing and storage
BS EN 60204-33:2011 Safety of machinery. Electrical equipment of machines. Requirements for semiconductor fabrication equipment
BS IEC 60191-2:1966+A18:2011 Mechanical standardization of semiconductor devices. Dimensions
BS EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - General
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
PD ES 59008-6-2:2001 Data requirements for semiconductor die. Exchange data formats and data dictionary. Data dictionary
BS EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Low air pressure
BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Salt atmosphere
BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
BS EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Bond strength
BS EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Acceleration, steady state
BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
BS EN 60749-29:2004 Semiconductor devices - Mechanical and climatic test methods - Latch-up test
BS EN 60749-29:2003 Semiconductor devices - Mechanical and climatic test methods - Part 29:Latch-up test
BS EN 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Power cycling
BS EN 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Solderability
BS EN 60749-34:2010 Semiconductor devices. Mechanical and climatic test methods. Power cycling
BS EN IEC 60749-13:2018 Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
BS EN 60749-6:2017 Semiconductor devices. Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Vibration, variable frequency
BS EN 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking
BS EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Die shear strength
BS EN 60749-19:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Die shear strength
BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BS EN IEC 60749-10:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Mechanical shock. device and subassembly
BS EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - High temperature operating life
BS EN 60749-21:2011 Semiconductor devices. Mechanical and climatic test methods. Solderability
BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
BS EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)
BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
BS EN 60749-9:2017 Semiconductor devices. Mechanical and climatic test methods - Permanence of marking
BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods - External visual examination
BS EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Rapid change of temperature - Two-fluid-bath method
BS EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10:General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
BS EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Ionizing radiation (total dose)
BS EN 60749-42:2014 Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
15/30328077 DC BS EN 60191-2. Mechanical standardization of semiconductor devices. Part 2. Dimensions
BS EN IEC 60749-39:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
22/30443678 DC BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods - Part 34-1. Power cycling test for power semiconductor module
BS EN IEC 60749-17:2019 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation
13/30284029 DC BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
21/30435579 DC BS EN 60749-10. Semiconductor devices. Mechanical and climatic test methods. Part 10. Mechanical shock. Device and subassembly
BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)

IPC - Association Connecting Electronics Industries, Semiconductor Chip Machinery

IPC/EIA J-STD-026 CD-1999 Semiconductor Design Standard for Flip Chip Applications
IPC/EIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Semiconductor Chip Machinery

GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation
GB/T 35010.2-2018 Semiconductor die products—Part 2: Exchange data formats
GB/T 35010.5-2018 Semiconductor die products—Part 5：Requirements for concerning electrical simulation
GB/T 35010.1-2018 Semiconductor die products—Part 1：Requirements for procurement and use
GB/T 35010.7-2018 Semiconductor die products—Part 7: XML schema for data exchange
GB/T 35010.8-2018 Semiconductor die products—Part8: EXPRESS model schema for data exchange
GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage
GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment

European Committee for Electrotechnical Standardization（CENELEC）, Semiconductor Chip Machinery

CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60749-10:2002 Semiconductor Devices - Mechanical and Climatic Test Methods Part 10: Mechanical Shock
EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration@ variable frequency
EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

Lithuanian Standards Office , Semiconductor Chip Machinery

LST EN 60749-19+AC-2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2002)
LST EN 60749-19+AC-2003/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)
LST EN 62258-2-2011 Semiconductor die products -- Part 2: Exchange data formats (IEC 62258-2:2011)
LST EN 60749-10-2003 Semiconductor devices. Mechanical and climatic test methods. Part 10: Mechanical shock (IEC 60749-10:2002)
LST EN 60191-4+A1-2002 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999+A1:2001)
LST EN 60191-4+A1-2002/A2-2002 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999/A2:2002)
LST EN 60191-6-2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
LST EN 60191-4-2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013)
LST EN 60191-6-16-2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007)
LST EN 60749-38-2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008)
LST EN 60204-33-2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (IEC 60204-33:2009, modified)

CENELEC - European Committee for Electrotechnical Standardization, Semiconductor Chip Machinery

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
EN 62258-2:2005 Semiconductor die products Part 2: Exchange data formats
EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
ES 59008-4-3-1999 Data Requirements for Semiconductor Die Part 4-3: Specific Requirements and Recommendations - Thermal
ES 59008-4-2-2000 2001 Data Requirements for Semiconductor Die - Part 4-2: Specific Requirements and Recommendations Handling and Storage
ES 59008-4-4-1999 Data Requirements for Semiconductor Die Part 4-4: Specific Requirements and Recommendations Electrical Simulation
EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Incorporates Amendment A1: 2018)
EN 60749-21:2005 Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
EN 60749-29:2003 Semiconductor devices Mechanical and climatic test methods Part 29: Latch-up test
EN 60749-34:2004 Semiconductor devices Mechanical and climatic test methods Part 34: Power Cycling

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Semiconductor Chip Machinery

GB/T 36356-2018 Technical specification for power light-emitting diode chips
GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
GB/T 43136-2023 Superabrasive products: grinding wheels for precision scribing of semiconductor chips
GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
GB/T 42709.19-2023 Semiconductor devices microelectromechanical devices Part 19: Electronic compass
GB/T 42709.5-2023 Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches
GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure
GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Semiconductor Chip Machinery

JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
JEDEC JESD49A.01-2013 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD) (Minor Revision of JESD49, SEPTEMBER 2005, Reaffirmed January 2009)

Association Francaise de Normalisation, Semiconductor Chip Machinery

NF EN 62258-1:2011 Produits de puces de semiconducteurs - Partie 1 : approvisionnement et utilisation
NF EN 62258-2:2011 Produits de puces de semiconducteurs - Partie 2 : formats d'échange de données
NF C96-022-10*NF EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
NF C96-009:1989 Electronic Components Semiconductor devices Mechanical and climatic test methods
NF C79-130-33*NF EN 60204-33:2012 Safety of machinery - Electrical equipment of machines - Part 33 : requirements for semiconductor fabrication equipment.
NF C96-022-38*NF EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38 : soft error test method for semiconductor devices with memory.
NF EN 60191-4/A1:2018 Normalisation mécanique des dispositifs à semiconducteurs - Partie 4 : système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs
NF EN 60191-4:2014 Normalisation mécanique des dispositifs à semiconducteurs - Partie 4 : système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs
NF C96-022-19/A1*NF EN 60749-19/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF EN 60191-6:2011 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6 : règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semiconducteurs pour montage en surface
NF C96-013-4*NF EN 60191-4:2000 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF C96-013-4/A1*NF EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF EN IEC 60749-10:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10 : Chocs mécaniques - Dispositif et sous-ensemble
NF C96-022-1*NF EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1 : general
NF C96-022-8*NF EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing
NF EN 60749-8:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8 : étanchéité
NF EN 60749-1:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 1 : généralités
NF C96-013-6:2005 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages.
NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
NF C96-013-4/A1*NF EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF EN 60749-44:2016 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 44 : méthode d'essai des effets d'un événement isolé (SEE) irradié par un faisceau de neutrons pour des dispositifs à semiconducteurs
NF EN 60749-38:2008 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 38 : méthode d'essai des erreurs logicielles pour les dispositifs à semiconducteurs avec mémoire
NF C96-013-6-6*NF EN 60191-6-6:2002 Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
NF C96-022-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability.
NF C96-022-21*NF EN 60749-21:2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability
NF C96-022-2*NF EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure
NF C96-022-13*NF EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
NF EN 60749-21:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21 : brasabilité
NF EN 60749-2:2002 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 2 : basse pression atmosphérique
NF C96-050-9*NF EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
NF EN 60204-33:2012 Sécurité des machines - Équipement électrique des machines - Partie 33 : exigences pour les équipements de fabrication des semi-conducteurs
NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-34:2005 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling.
NF C96-022-17*NF EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17 : neutron irradiation.
NF C96-022-22*NF EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength.
NF C96-022-25*NF EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling.
NF C96-022-29*NF EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test
NF C96-022-34*NF EN 60749-34:2011 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling
NF C96-022-36*NF EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state
NF C96-022-12*NF EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
NF C96-022-6*NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
NF EN 60749-6:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 6 : stockage à haute température
NF EN 60749-25:2003 Dispositifs de semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 25 : cycles de température
NF EN 60749-34:2011 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 34 : cycles en puissance
NF EN IEC 60749-13:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 13 : atmosphère saline
NF EN IEC 60749-17:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 17 : irradiation aux neutrons
NF EN 60749-29:2012 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 29 : essai de verrouillage
NF C96-022-44*NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
NF EN IEC 60749-39:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39 : mesure de la diffusivité d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs
NF C96-013-6-10*NF EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
NF EN 60191-6-6:2002 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-6 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception des dispositifs FLGA
NF EN 60191-6-12:2012 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12 : règles générales pour la préparation des dessins d'encombrement des boîtiers des dispositifs à semiconducteurs à montage en surface - Lignes drectrices de conception po...
NF EN 60191-6-10:2004 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-10 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON
NF C96-022-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature.

ES-UNE, Semiconductor Chip Machinery

UNE-EN 62258-1:2010 Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)
UNE-EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)
UNE-EN 62258-6:2006 Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation(IEC 62258-6:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 62258-5:2006 Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 60204-33:2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (Endorsed by AENOR in December of 2011.)
UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)
UNE-EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
UNE-EN 60191-4:2014/A1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN 60749-38:2008 Semiconductor devices- Mechanical and climatic test methods- Part 38: Soft error test method for semiconductor devices with memory (Endorsed by AENOR in September of 2008.)
UNE-EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)
UNE-EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
UNE-EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
UNE-EN 300386 V1.5.1:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
UNE-EN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)
UNE-EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (Endorsed by Asociación Española de Normalización in June of 2019.)
UNE-EN 60191-6-16:2007 Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007). (Endorsed by AENOR in October of 2007.)

(U.S.) Telecommunications Industries Association , Semiconductor Chip Machinery

TIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

SE-SIS, Semiconductor Chip Machinery

SIS SS CECC 00013-1985 Basic specification: Scanning electron microscope inspection of semiconductor dice
SIS SS-IEC 749:1991 Semiconductor devices - Mechanical and climatic test methods

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Semiconductor Chip Machinery

IPC J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

TIA - Telecommunications Industry Association, Semiconductor Chip Machinery

J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications (IPC/EIA J-STD-026)

Association of German Mechanical Engineers, Semiconductor Chip Machinery

VDI/VDE 3713 Blatt 8-1995 Technical procurement specification - Epoxy encapsulants for semiconductor chips

RU-GOST R, Semiconductor Chip Machinery

GOST 28578-1990 Semiconductor devices. Mechanical and climatic test methods

International Electrotechnical Commission (IEC), Semiconductor Chip Machinery

IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods
IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
IEC 60191-1A:1969 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD5:2002 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-2-DB:2012 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD18:2011 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices
IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC 60191-2Y:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions (23rd Supplement to Publication 60191-2:1966)
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-1:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-8:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60191-2:1966/AMD2:2001 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 2
IEC 60191-2U:1997 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 19
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60191-2T:1996 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 18
IEC 60191-2Z:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 24
IEC 60191-2X:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22
IEC 60191-2W:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 21
IEC 60191-2V:1998 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 20
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2X/COR1:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22; Corrigendum 1
IEC 60191-2:1966/AMD10:2004 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 10
IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60191-2:1966/AMD21:2020 Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD17:2008 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 17
IEC 60191-2:1966/AMD8:2003 Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
IEC 60749-2:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60191-2:1966/AMD12:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 12
IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60191-2:1966/AMD7:2002 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 7
IEC 60191-2:1966/AMD4:2001 Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD14:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 14
IEC 60191-2:1966/AMD9:2003 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 9
IEC 60191-2:1966/AMD16:2007 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 16
IEC 60191-2X:1999/COR1:2000 Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD1:2001 Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD15:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 15
IEC 60191-2:1966/AMD3:2001 Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD11:2004 Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD13:2006 Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD20:2018 Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-2:1966/AMD6:2002 Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 60204-33:2009 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
IEC 60191-4/AMD1:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
IEC 60191-4/AMD2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 2
IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
IEC 60749-34:2005 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-13:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60191-6/AMD1:1999 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1
IEC 60191-4:2013/AMD1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

Hebei Provincial Standard of the People's Republic of China, Semiconductor Chip Machinery

DB13/T 5120-2019 Specifications for DC performance test of FP and DFB semiconductor laser chips for optical communication

CZ-CSN, Semiconductor Chip Machinery

CSN IEC 749:1994 Semiconductor devices.Mechanical and climatic test methods

Korean Agency for Technology and Standards (KATS), Semiconductor Chip Machinery

KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-2004(2020) Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-10:2004 Semiconductor devices－Mechanical and climatic test methods－Part 10：Mechanical shock
KS C IEC 60749-10:2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-1:2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-1-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-1-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-2:2004 Semiconductor devices－Mechanical and climatic test methods－Part 2：Low air pressure
KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
KS C IEC 60749-21:2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
KS C IEC 60749-2:2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
KS C IEC 60749-13:2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
KS C IEC 60204-33:2010 Safety guideline for semiconductor fabrication equipment
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-13:2002 Semiconductor devices-Mechanical and climatic test methods-Part 13:Salt atmosphere
KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength
KS C IEC 60749-34:2006 Semiconductor devices-Mechanical and climatic test methods-Part 34:Power cycling
KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination
KS C IEC 60749-17:2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-6:2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
KS C IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-22:2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
KS C IEC 60749-17-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-34:2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-12:2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-34-2017(2022) Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking

Japanese Industrial Standards Committee (JISC), Semiconductor Chip Machinery

JIS C 7040:1969 General rules for mechanical standardization of semiconductor integrated circuits
JIS B 9960-33:2012 Safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment

PT-IPQ, Semiconductor Chip Machinery

NP 3081-1985

KR-KS, Semiconductor Chip Machinery

KS C IEC 60749-10-2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-2-2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
KS C IEC 60749-21-2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
KS C IEC 60749-13-2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
KS C IEC 60749-22-2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
KS C IEC 60749-6-2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
KS C IEC 60749-17-2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-34-2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-12-2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency

Defense Logistics Agency, Semiconductor Chip Machinery

DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
DLA MIL-PRF-19500/657 B-2011 SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE, N AND P-CHANNEL, SILICON VARIOUS TYPES JANHC AND JANKC
DLA SMD-5962-87685-1987 MICROCIRCUITS, 8-BIT MICROPROCESSOR CPU, NMOS, MONOLITHIC SILICON
DLA SMD-5962-96665 REV D-2005 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX VOLTAGE LEVEL SHIFTER FOR TTL-TO-CMOS OR CMOS-TO- CMOS OPERATION, MONOLITHIC SILICON
DLA SMD-5962-06208-2006 MICROCIRCUIT, DIGITAL, CMOS, DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON
DLA SMD-5962-91566 REV C-1996 MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-79018 REV C-2006 MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128 X 8-BIT RANDOM ACCESS MEMORY (RAM), MONOLITHIC SILICON
DLA SMD-5962-04227 REV B-2005 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K X 32-BIT (16 M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE

PH-BPS, Semiconductor Chip Machinery

PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
PNS IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

RO-ASRO, Semiconductor Chip Machinery

STAS CEI 191-4-1992 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor devices

未注明发布机构, Semiconductor Chip Machinery

BS CECC 13:1985(1999) Harmonized system of quality assessment for electronic components : Basic specification : Scanning electron microscope inspection of semiconductor dice

PL-PKN, Semiconductor Chip Machinery

PN T01101-1987 Semiconductor devices Mechanical and climatic test methods [Translation of Publication IEC 749 (1984)]