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Film bending test

Film bending test, Total:5 items.

In the international standard classification, Film bending test involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment.

British Standards Institution (BSI), Film bending test

• BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
• BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials

ES-UNE, Film bending test

• UNE-EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

German Institute for Standardization, Film bending test

• DIN EN 62047-18:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013

International Electrotechnical Commission (IEC), Film bending test

• IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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