ZH
RU
ES

IEC60749

IEC60749, Total:303 items.

In the international standard classification, IEC60749 involves: Semiconductor devices, Mechanical structures for electronic equipment.


International Electrotechnical Commission (IEC), IEC60749

  • IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods
  • IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
  • IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
  • IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  • IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
  • IEC 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
  • IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  • IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
  • IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
  • IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
  • IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
  • IEC 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
  • IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
  • IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
  • IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
  • IEC 60749-18:2002 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
  • IEC 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
  • IEC 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
  • IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
  • IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • IEC 60749-34:2005 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  • IEC 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
  • IEC 60749-24:2005 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
  • IEC 60749-30:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
  • IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
  • IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
  • IEC 60749-27:2003 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM)
  • IEC 60749-26:2003 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM)
  • IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
  • IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
  • IEC 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  • IEC 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
  • IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • IEC 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
  • IEC 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
  • IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  • IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
  • IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
  • IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
  • IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
  • IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
  • IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
  • IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
  • IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (Edition 1.0; Replaces IEC PAS 62172:2000)
  • IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
  • IEC 60749-19:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
  • IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
  • IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
  • IEC 60749-28:2022 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  • IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  • IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
  • IEC 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
  • IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
  • IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
  • IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
  • IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
  • IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
  • IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
  • IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (Edition 1.0; Replaces IEC PAS 62336:2002)
  • IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
  • IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
  • IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
  • IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
  • IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
  • IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
  • IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
  • IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
  • IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
  • IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • IEC 60749-27:2012 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
  • IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
  • IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
  • IEC 60749/AMD1:1991 Semiconductor devices; mechanical and climatic test methods; amendment 1
  • IEC 60749/AMD2:1993 Semiconductor devices; mechanical and climatic test methods; amendment 2
  • IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
  • IEC 60749-30:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-18:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
  • IEC 60749-20:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • IEC 60749-15:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
  • IEC 60749-28:2022 RLV Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  • IEC 60749-37:2022 RLV Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • IEC 60749-20-1:2019 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering
  • IEC 60749-5:2023 PRV
  • IEC 60749-20-1:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering
  • IEC 60749-20/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
  • IEC 60749-7/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
  • IEC 60749-32:2002/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
  • IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
  • IEC 60749-9:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
  • IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  • IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
  • IEC 60749-12:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
  • IEC 60749-13:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
  • IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
  • IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
  • IEC 60749-19:2003/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
  • IEC 60749-30:2005/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
  • IEC 60749-11:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method; Corrigendum 2
  • IEC 60749-1:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
  • IEC 60749-8:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
  • IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
  • IEC 60749-2:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
  • IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
  • IEC 60749-11:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
  • IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
  • IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
  • IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
  • IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
  • IEC 60749-32:2002+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC - International Electrotechnical Commission, IEC60749

  • IEC 60749-29:2003 Dispositifs à semiconducteurs Méthodes d?essais mécaniques et climatiques Partie 29: Essai de verrouillage (Edition 1.0; Replaces IEC PAS 62181)
  • IEC 60749-15:2003 Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices (Edition 1.0; Replaces IEC/PAS 62174: 2000; Together with IEC 60749-14:2003@ IEC 60749-3:2002 And IEC 60749-31:200
  • IEC 60749-19:2003 Dispositifs à semiconducteurs Méthodes d?essais mécaniques et climatiques Partie 19: Résistance de la pastille au cisaillement (Edition 1.0)
  • IEC 60749-43:2017 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Lignes directrices concernant les plans de qualification de la fiabilité des CI (Edition 1.0)
  • IEC 60749-17:2019 Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques – Partie 17: Irradiation aux neutrons (Edition 2.0)
  • IEC 60749-4:2002/COR1:2003 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat@ Steady State@ Highly Accelerated Stress Test (HAST) CORRIGENDUM 1 (Edition 1.0)

Korean Agency for Technology and Standards (KATS), IEC60749

  • KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
  • KS C IEC 60749-1:2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General
  • KS C IEC 60749-12:2004 Semiconductor devices-Mechanical and climatictest methods-Part 12:Vibration, variable frequency
  • KS C IEC 60749-13:2002 Semiconductor devices-Mechanical and climatic test methods-Part 13:Salt atmosphere
  • KS C IEC 60749-14:2006 Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
  • KS C IEC 60749-18:2006 Semiconductor devices-Mechanical and climatic test methods-Part 18:Ionizing radiation(total dose)
  • KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength
  • KS C IEC 60749-23:2006 Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
  • KS C IEC 60749-24:2006 Semiconductor devices-Mechanical and climatic test methods-Part 24:Accelerated moisture resistance-Unbiased HAST
  • KS C IEC 60749-31:2006 Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of plastic-encapsulated devices(internally induced)
  • KS C IEC 60749-34:2006 Semiconductor devices-Mechanical and climatic test methods-Part 34:Power cycling
  • KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
  • KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
  • KS C IEC 60749-9:2003 Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking
  • KS C IEC 60749-7:2004 Semiconductor devices－Mechanical and climatic test methods－Part 7：Internal moisture content measurement and the analysis of other residual gases
  • KS C IEC 60749-2:2004 Semiconductor devices－Mechanical and climatic test methods－Part 2：Low air pressure
  • KS C IEC 60749-10:2004 Semiconductor devices－Mechanical and climatic test methods－Part 10：Mechanical shock
  • KS C IEC 60749-11:2002 Semiconductor devices－Mechanical and climatic test methods－Part 11：Rapid change of temperature－Two－fluid－bath method
  • KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination
  • KS C IEC 60749-19:2005 Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength
  • KS C IEC 60749-20:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 20：Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
  • KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
  • KS C IEC 60749-16:2006 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
  • KS C IEC 60749-17:2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
  • KS C IEC 60749-32:2006 Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
  • KS C IEC 60749-4:2003 Semiconductor devices－Mechanical and climatic test methods－Part 4：Damp heat, steady state, highly accelerated stress test(HAST)
  • KS C IEC 60749-42:2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
  • KS C IEC 60749-23:2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
  • KS C IEC 60749-6:2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
  • KS C IEC 60749-3:2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
  • KS C IEC 60749-32:2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
  • KS C IEC 60749-4:2020 Semiconductor devices — Mechanical and climatic test methods — Part 4: Damp heat, steady state,highly accelerated stress test(HAST)
  • KS C IEC 60749-11:2020 Semiconductor devices — Mechanical and climatic test methods —Part 11: Rapid change of temperature — Two-fluid-bath method
  • KS C IEC 60749-10:2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
  • KS C IEC 60749-3:2019 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
  • KS C IEC 60749-7:2020 Semiconductor devices — Mechanical and climatic test methods —Part 7: Internal moisture content measurement and the analysis of other residual gases
  • KS C IEC 60749-19:2020 Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
  • KS C IEC 60749-2004(2020) Semiconductor devices－Mechanical and climate test methods
  • KS C IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
  • KS C IEC 60749-20:2020 Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • KS C IEC 60749-22:2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
  • KS C IEC 60749-21:2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
  • KS C IEC 60749-34:2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
  • KS C IEC 60749-18:2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
  • KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
  • KS C IEC 60749-12:2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
  • KS C IEC 60749-2:2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
  • KS C IEC 60749-13:2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
  • KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
  • KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • KS C IEC 60749-16-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
  • KS C IEC 60749-31-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
  • KS C IEC 60749-14-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
  • KS C IEC 60749-32-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)
  • KS C IEC 60749-1-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
  • KS C IEC 60749-1-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
  • KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
  • KS C IEC 60749-24-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
  • KS C IEC 60749-17-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
  • KS C IEC 60749-23-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 23：High temperature operating life
  • KS C IEC 60749-14-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)
  • KS C IEC 60749-18-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 18：Ionizing radiation(total dose)
  • KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • KS C IEC 60749-16-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
  • KS C IEC 60749-31-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 31：Flammability of plastic-encapsulated devices(internally induced)
  • KS C IEC 60749-24-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
  • KS C IEC 60749-42-2016(2021) Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
  • KS C IEC 60749-34-2017(2022) Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling

PH-BPS, IEC60749

  • PNS IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
  • PNS IEC 60749-28:2021 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  • PNS IEC 60749-30:2021 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • PNS IEC 60749-41:2021 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
  • PNS IEC 60749-42:2021 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
  • PNS IEC 60749-43:2021 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
  • PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

European Committee for Electrotechnical Standardization（CENELEC）, IEC60749

  • EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
  • EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration@ variable frequency
  • EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
  • EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • EN IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
  • EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
  • EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • EN IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • EN IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
  • EN IEC 60749-28:2022 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  • prEN IEC 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
  • EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

CENELEC - European Committee for Electrotechnical Standardization, IEC60749

  • EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

AT-OVE/ON, IEC60749

  • OVE EN IEC 60749-10:2021 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (IEC 47/2692/CDV) (english version)
  • OVE EN IEC 60749-39:2020 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)
  • OVE EN IEC 60749-37:2020 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV) (english version)

Lithuanian Standards Office , IEC60749

  • LST EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
  • LST EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
  • LST EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020)
  • LST EN IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)

German Institute for Standardization, IEC60749

  • DIN EN IEC 60749-37:2023 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
  • DIN EN IEC 60749-20:2019 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
  • DIN EN IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020
  • DIN EN IEC 60749-20-1:2018 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version
  • DIN EN IEC 60749-18:2020-02 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019 / Note: DIN EN 60749-18 (2003-09) remains valid alongside this standard until 2022-05-15.
  • DIN EN IEC 60749-41:2023-03 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
  • DIN EN IEC 60749-15:2022-05 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020 / Note: DIN EN 60749-15 (2011-06) remains valid alongs...
  • DIN EN IEC 60749-30:2023-02 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...
  • DIN EN IEC 60749-37:2023-02 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020 / Note: Date of issue 2023-01-20*Intended as replaceme...
  • DIN EN IEC 60749-13:2018-10 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018 / Note: DIN EN 60749-13 (2003-04) remains valid alongside this standard until 2021-03-22.
  • DIN EN IEC 60749-12:2018-07 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018 / Note: DIN EN 60749-12 (2003-04) remains valid alongside this standard until 2021-01-17.
  • DIN EN IEC 60749-20:2023-07 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020 / Note: DIN EN 60749-20 (2010...
  • DIN EN IEC 60749-39:2021-07 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020 / Not...
  • DIN EN IEC 60749-10:2023-06 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022); German version EN IEC 60749-10:2022 / Note: Date of issue 2023-05-19*Intended as replacement for DIN EN 60749-10 (200...
  • DIN EN IEC 60749-39:2023-10 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022 / Note: DIN...
  • DIN EN IEC 60749-20-1:2018-11 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English vers...

KR-KS, IEC60749

  • KS C IEC 60749-20-2020 Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • KS C IEC 60749-22-2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
  • KS C IEC 60749-7-2020 Semiconductor devices — Mechanical and climatic test methods —Part 7: Internal moisture content measurement and the analysis of other residual gases
  • KS C IEC 60749-23-2021 Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
  • KS C IEC 60749-18-2021 Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
  • KS C IEC 60749-11-2020 Semiconductor devices — Mechanical and climatic test methods —Part 11: Rapid change of temperature — Two-fluid-bath method
  • KS C IEC 60749-2-2020 Semiconductor devices — Mechanical and climatic test methods — Part 2: Low air pressure
  • KS C IEC 60749-42-2016 Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage
  • KS C IEC 60749-19-2020 Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
  • KS C IEC 60749-9-2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
  • KS C IEC 60749-6-2020 Semiconductor devices — Mechanical and climatic test methods — Part 6: Storage at high temperature
  • KS C IEC 60749-17-2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
  • KS C IEC 60749-10-2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
  • KS C IEC 60749-4-2020 Semiconductor devices — Mechanical and climatic test methods — Part 4: Damp heat, steady state,highly accelerated stress test(HAST)
  • KS C IEC 60749-3-2021 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
  • KS C IEC 60749-21-2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
  • KS C IEC 60749-3-2019 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
  • KS C IEC 60749-34-2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
  • KS C IEC 60749-13-2020 Semiconductor devices — Mechanical and climatic test methods — Part 13: Salt atmosphere
  • KS C IEC 60749-32-2021 Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
  • KS C IEC 60749-12-2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency

British Standards Institution (BSI), IEC60749

  • BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
  • BS EN IEC 60749-13:2018 Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
  • BS EN IEC 60749-15:2020 Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
  • BS EN IEC 60749-20:2020 Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  • BS EN IEC 60749-18:2019 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose)
  • BS EN IEC 60749-10:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Mechanical shock. device and subassembly
  • BS EN IEC 60749-37:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer
  • BS EN IEC 60749-39:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • BS EN IEC 60749-28:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
  • BS EN IEC 60749-30:2020 Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • BS EN IEC 60749-26:2018 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
  • BS EN IEC 60749-41:2020 Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices
  • BS EN IEC 60749-17:2019 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation

Association Francaise de Normalisation, IEC60749

  • NF EN IEC 60749-37:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37 : Méthode d'essai de chute au niveau de la carte avec utilisation d'un accéléromètre
  • NF EN IEC 60749-41:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 41 : méthodes d'essai normalisées pour la fiabilité des dispositifs à mémoire non volatile
  • NF EN IEC 60749-30:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30 : préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité
  • NF EN IEC 60749-20:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : résistance des CMS à boîtier plastique à l'effet combiné de l'humidité et de la chaleur de brasage
  • NF EN IEC 60749-10:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10 : Chocs mécaniques - Dispositif et sous-ensemble
  • NF EN IEC 60749-13:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 13 : atmosphère saline
  • NF EN IEC 60749-17:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 17 : irradiation aux neutrons
  • NF EN IEC 60749-12:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 12 : vibrations, fréquences variables
  • NF EN IEC 60749-18:2019 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 18 : rayonnements ionisants (dose totale)
  • NF EN IEC 60749-26:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26 : essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)
  • NF EN IEC 60749-39:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39 : mesure de la diffusivité d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs
  • NF EN IEC 60749-28:2022 Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 28 : Essai de sensibilité aux décharges électrostatiques (DES) - Modèle de dispositif chargé (CDM) - niveau du dispositif
  • NF EN IEC 60749-15:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15 : résistance à la température de brasage pour dispositifs par trous traversants

ES-UNE, IEC60749

  • UNE-EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (Endorsed by Asociación Española de Normalización in June of 2019.)
  • UNE-EN IEC 60749-28:2022 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in May of 2022.)
  • UNE-EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)
  • UNE-EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
  • UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
  • UNE-EN IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by Asociación Española de Normalización in November of 2020.)
  • UNE-EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)
  • UNE-EN IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (Endorsed by Asociación Española de Normalización in May of 2018.)
  • UNE-EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
  • UNE-EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
  • UNE-EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (Endorsed by Asociación Española de Normalización in November of 2020.)
  • UNE-EN IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (Endorsed by Asociación Española de Normalización in July of 2019.)
  • UNE-EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (Endorsed by Asociación Española de Normalización in October of 2020.)

PL-PKN, IEC60749

  • PN-EN IEC 60749-15-2021-04 E Semiconductor devices--Mechanical and climatic test methods--Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
  • PN-EN IEC 60749-41-2021-04 E Semiconductor devices -- Mechanical and climatic test methods -- Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020)
  • PN-EN IEC 60749-20-2021-06 E Semiconductor devices -- Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)
  • PN-EN IEC 60749-30-2021-05 E Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)

未注明发布机构, IEC60749

  IEC60749, iec60749 26, iec60749 12, iec60749 23, temperature iec60749, iec60749 25, IEC607496.

 



Copyright ©2007-2023 ANTPEDIA, All Rights Reserved