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Semiconductor Test Equipment Models

Semiconductor Test Equipment Models, Total:183 items.

In the international standard classification, Semiconductor Test Equipment Models involves: Components for electrical equipment, Linear and angular measurements, Semiconductor devices, Electricity. Magnetism. Electrical and magnetic measurements, Testing of metals, Semiconducting materials, Optoelectronics. Laser equipment, Electromechanical components for electronic and telecommunications equipment, Integrated circuits. Microelectronics, Power transmission and distribution networks, Shipbuilding and marine structures in general, Industrial automation systems, Vacuum technology, Languages used in information technology, Air quality, Technical drawings, Mechanical structures for electronic equipment, Interface and interconnection equipment.

Professional Standard - Machinery, Semiconductor Test Equipment Models

JB/T 4219-1999 Type designation of measuring equipments for power semiconductor devices
JB/T 6307.4-1992 Test method for power semiconductor module Arm and pair of arms of bipolar transistor
JB/T 6307.5-1994 Power Semiconductor Module Test Methods Bipolar Transistors Single-Phase Bridge and Three-Phase Bridge

Group Standards of the People's Republic of China, Semiconductor Test Equipment Models

T/ZACA 041-2022 Mixed signal semiconductor device test equipment
T/ZAQ 10113-2022 Intermittent working life test equipment for semiconductor devices
T/CZSBDTHYXH 001-2023 Wafer defects Automatic optical inspection equipment
T/GVS 005-2022 Testing specification for contrast method of absolute pressure capacitance diaphragm vacuum gauge in the semiconductor equipment

YU-JUS, Semiconductor Test Equipment Models

JUS N.A3.500-1980 Semiconductor devices. Graphical symbols

RO-ASRO, Semiconductor Test Equipment Models

STAS 7128/2-1986 LETTER SYMBOLS FOR SEMI- ONDUCTOR DEVICES AND INTE- RATED MICROCIRCUITS ymbols for bipolar transistors
STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties
STAS 7128/6-1986 LETTER SYMBOLS FOR SEMI- CONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for thyristors
STAS 7128/9-1980 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for unijonction transistors
STAS 7128/8-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for field effect transitors
STAS 7128/5-1985 LETTER SYMBOLS FOR SEMICON- DUCTOR DEVICES AND INTEGRA- TED NICROCIRCUITS Symbols for rectifier diodes
STAS 7128/1-1985 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS General rules
STAS 7128/11-1985 T.ETTJ?R SYMBOLS FOR EMICONDUCTOR DEVICES ND INTHGRATED CIRCUITS Symbols fur digital integrated eircuits
STAS 7128/4-1971 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for lunnel diodes
STAS 7128/3-1985 LETTER SYMBOI.S FOR SEM1- ONDUCR DEVICES AND INTE- RATED M SOROC IRCUTS Symbols for low-powr signal dides
STAS 7128/10-1984 LETTER SIMBOLS FOR SEMICON- DUCTOR DEVICES ANI) INTF.GHA- TED CIRCU1TS Sinibols for analoguc inlcgnated circuits
STAS 7128/7-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED C1RCUITS Symbols for variable capacitance diodes and mixer diodes
STAS 12124/1-1982 Semiconductor devices BIPOLAR TRANZISTORS Methods for measuring electrical static parameters
STAS 7128/12-1985 LETTER SYMBOLS FOR EMICONDUCTOR DEVICES ND INTEGRATED CIRCU1TS ymbols lor voltage reference and voltage egulator diodes
STAS 12123/2-1983 Semiconductor devices LOW POWER SIGNAL DIODES, INCLUDING SWITCHING DIODES Measuring methods for electrical characteristics
STAS 12124/3-1983 Semiconductor devices FIFL D-EFFECT TRANZISTORS Methods for measuring electrical static parameters
STAS 12124/4-1983 Semiconductor devices FIELD-EFECT TRANZISTORS Methods for measuring electrical static parameters
STAS 12123/4-1984 Semiconductor devices VARIABLE-CAPACITANCE DIODES Measuring methodes for electrical characteristics

Defense Logistics Agency, Semiconductor Test Equipment Models

DLA MIL-S-19500/173 A VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N389 and 2N424 (Navy)
DLA MIL-PRF-19500/597 D VALID NOTICE 1-2008 Semiconductor Device, Transistors, Quad, Field Effect, NChannel, Silicon, Type 2N7334, JAN, JANTX, JANTXV, JANS, JANHC, JANKCA2N7334, and JANHCA2N7334
DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT, DIGITAL, CMOS, TEST BUS CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-86864-1988 MICROCIRCUITS, DIGITAL, ERASEABLE, CMOS, PROGRAMMABLE LOGIC DEVICE
DLA SMD-5962-87640 REV B-2002 MICROCIRCUIT, LINEAR, BIMOS II LATCHED DRIVERS, MONOLITHIC SILICON
DLA MIL-PRF-19500/534 F-2008 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER, TYPES 2N5002 AND 2N5004, JAN, JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF, JANSG, JANSH, JANHCB, JANKCB, JANKCBM, JANKCBD, JANKCBP, JANKCBL, JANKCBR, JANKCBF, JANKCBG, AND JANKCBH
DLA MIL-PRF-19500/420 L-2008 SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER, RECTIFIER, TYPES 1N5550 THROUGH 1N5554, 1N5550US THROUGH 1N5554US, JAN, JANTX, JANTXV, JANS, JANHCA, JANHCB, JANHCC, JANHCD, JANHCE, JANKCA, JANKCD, AND JANKCE
DLA SMD-5962-87641-1988 MICROCIRCUITS, LINEAR, BIMOS 8-BIT, SERIAL INPUT, LATCHED DRIVER, MONOLITHIC SILICON

SE-SIS, Semiconductor Test Equipment Models

SIS SS-IEC 749:1991 Semiconductor devices - Mechanical and climatic test methods
SIS SS 499 07 07-1990 Initiation system with non-electric signal conductor oflow energy type - General requirements and testing
SIS SEN 47 10 03-1973 Radio interference. Limits and methods of measurement of interference voltage for regulating controls incorporating semiconductor devices

CZ-CSN, Semiconductor Test Equipment Models

CSN IEC 749:1994 Semiconductor devices.Mechanical and climatic test methods
CSN 35 8754-1973 Semiconductor devices. Transistors. Measurement of short-circuit output admittance
CSN 35 8756-1973 Semiconductor devices. Transistors Measurement of y-parameters
CSN 35 8742-1973 Semiconductor devices. Transistors. Measurement of cut-oíf currents
CSN 35 8759-1977 Semiconductor devices. Transistors. Methods of measurement of switching times
CSN 35 8737-1975 Semiconductor devices. Diodes. Measurement of differential rosistanoe
CSN IEC 747-3-2:1991 Semiconductor devices. Discrete devices. Part 3: Signal (including switching)and regulator diodes. Section two. Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision referenc
CSN 35 8749-1973 Semiconductor devices. Transistors. Measurement of absolute value of short-circuit forward transfer admittance
CSN 35 8797 Cast.3 IEC 747-3 ZA1+A2:1996 Semiconductor devices. Discrete devices. Part 3: Signál (including switching) and regu lator diodes
CSN 35 8731-1975 Semiconductor devices. Diodes Measurement of d. c. forward voltage
CSN 35 8763-1973 Semiconductor devices. Diodes. Measurement o? reverse breakdown voltage
CSN 35 8761-1973 Semiconductor devices. Phototransistors photodíodes. Measurement of photoelectric current
CSN 35 8762-1973 Semiconductor devices. Phototransistors photodiodes. Measurement of dark current
CSN 35 8752-1976 Semiconductor devices. Transistors. Measuring methods for common base output capacitance.
CSN 35 8785-1975 Semiconductor devices. Varicaps. Measurement of thermal capacitance coefflcient.
CSN 35 8733-1975 Semiconductor devices. Diodes. Measurement of reverse voltago (working voltago)
CSN 35 8764-1976 Semicoaductor devices. Switching diodes. Measurement o? reverse recovery time.
CSN 35 8765-1976 Semiconductor devices. Switching diodes. Measurement of reverse recovery charge.
CSN 35 8746-1973 Semiconductor devices. Transistore. Measurement of absolute value of forward current transfer ratio and frequencies fT, fh21b, fh21e
CSN 35 8745-1973 Semiconductor devices. Transistore. Measurement of open-circuit reverse voltage transfer ratio and tinie coefíicient at high frequencies

PL-PKN, Semiconductor Test Equipment Models

PN T01208-01-1992 Semiconductor devices Bipolar transistors Terminology and letter symbols
PN T01501 ArkusZ4-1973 Semiconductor deyictj Letter symbols of field-effect transistors porameters

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Semiconductor Test Equipment Models

JEDEC JEP104C.01-2003 Reference Guide to Letter Symbols for Semiconductor Devices
JEDEC JESD57-1996 Test Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation
JEDEC JESD66-1999 Transient Voltage Suppressor Standard for Thyristor Surge Protective Device Rating Verification and Characteristic Testing
JEDEC JESD89A-2006 Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor Devices

Electronic Components, Assemblies and Materials Association, Semiconductor Test Equipment Models

ECA CB 5-1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
ECA CB 5-1-1971 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices Addendum to CB5

Lithuanian Standards Office , Semiconductor Test Equipment Models

LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)
LST EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
LST EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
LST EN 60749-5-2004 Semiconductor devices - Mechanical and climatic test methods. Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2003)
LST EN 60749-37-2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008)
LST EN 60749-26-2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2006)
LST EN 60191-6-1-2003 Mechanical standardization of semiconductor devices. Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals (IEC 60191-6-1:2001)

HU-MSZT, Semiconductor Test Equipment Models

MNOSZ 700-3.lap-1955

国家市场监督管理总局、中国国家标准化管理委员会, Semiconductor Test Equipment Models

GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Semiconductor Test Equipment Models

GB/T 1550-1997 Standard methods for measuring conductivity type of extrinsic semiconducting materials
GB 35007-2018 Semiconductor integrated circuit low voltage differential signal circuit testing method
GB/T 24468-2009 Specification for definition and measurement of semiconductor equipment reliability,availability and maintainability(RAM)
GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Semiconductor Test Equipment Models

IEEE 425-1957 TEST CODE for TRANSISTORS SEMICONDUCTOR DEFINITIONS and LEITER SYMBOLS

British Standards Institution (BSI), Semiconductor Test Equipment Models

BS EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
BS EN IEC 60749-28:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
BS EN 62047-13:2012 Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
20/30419235 DC BS EN 60749-28. Semiconductor devices. Mechanical and climatic test methods. Part 28. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
BS IEC 62047-40:2021 Semiconductor devices. Micro-electromechanical devices. Test methods of micro-electromechanical inertial shock switch threshold
BS IEC 60747-5-13:2021 Semiconductor devices. Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
BS EN IEC 60749-10:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Mechanical shock. device and subassembly
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
BS EN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
BS EN 60749-26:2014 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
BS IEC 62047-27:2017 Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
BS IEC 62526:2007 Standard for extensions to standard test interface language (STIL) for semiconductor design environments
PD 6574-1994 Determination of emissions from appliances burning gaseous fuels during type-testing
BS EN IEC 60749-26:2018 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
BS IEC 62047-38:2021 Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection
21/30435579 DC BS EN 60749-10. Semiconductor devices. Mechanical and climatic test methods. Part 10. Mechanical shock. Device and subassembly
BS EN 60749-15:2011 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-15:2003 Semiconductor devices - Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-15:2010 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
BS EN 60749-27:2006+A1:2012 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Semiconductor Test Equipment Models

GB/T 36005-2018 Measuring methods of optical radiation safety for semiconductor lighting equipments and systems
GB/T 35007-2018 Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry

National Metrological Technical Specifications of the People's Republic of China, Semiconductor Test Equipment Models

JJF 1895-2021 Calibration Specification for Semiconductor Devices DC and Low Frequency Parameters Test Equipments

AIA/NAS - Aerospace Industries Association of America Inc., Semiconductor Test Equipment Models

NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type

Association Francaise de Normalisation, Semiconductor Test Equipment Models

NF EN 62779-3:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 3 : type fonctionnel et ses conditions d'utilisation
NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
NF C96-022-26*NF EN IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
NF EN IEC 60749-26:2018 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26 : essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)
NF C96-013-6-1*NF EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals.
NF C96-022-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM).
NF C96-022-15*NF EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices.
NF EN 60749-27:2006 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 27 : essai de la sensibilité aux décharges électrostatiques (DES) - Modèle de machine (MM)
NF EN 60749-27/A1:2013 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 27 : essai de sensibilité aux décharges électrostatiques (DES) - Modèle de machine (MM)

Aerospace Industries Association, Semiconductor Test Equipment Models

AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type

European Committee for Electrotechnical Standardization（CENELEC）, Semiconductor Test Equipment Models

EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

National Metrological Verification Regulations of the People's Republic of China, Semiconductor Test Equipment Models

JJG(电子) 04008-1987 Trial Verification Regulations for QE1A Double-base Semiconductor Tube Tester
JJG(电子) 04023-1989 Specification for verification of BJ2970 model high power semiconductor triode tf tester

Danish Standards Foundation, Semiconductor Test Equipment Models

DS/EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
DS/EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
DS/EN 60749-30/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DS/EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DS/EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
DS/EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
DS/EN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
DS/EN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
DS/EN 60749-27/A1:2013 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

Professional Standard - Electron, Semiconductor Test Equipment Models

SJ/T 11820-2022 Technical requirements and measurement methods for DC parameter test equipment of semiconductor discrete devices
SJ 20233-1993 Verification regulation of model IMPACT-II semiconductor discrete device test sysytem
SJ/T 11007-1996 Semiconductor TV integrated circuits - General principles of measuring methods for video signal and chrominance signal processing circuits
SJ/T 10740-1996 Semiconductor integrated circuits - General principles of measuring methods for bipolar random access memories

工业和信息化部, Semiconductor Test Equipment Models

SJ/T 11702-2018 Semiconductor integrated circuit serial peripheral interface test method

国家质量监督检验检疫总局, Semiconductor Test Equipment Models

SN/T 3480.4-2016 Technical requirements for inspection of complete sets of equipment for the imported electronics and electrical industry Part 4: Semiconductor packaging and testing equipment

German Institute for Standardization, Semiconductor Test Equipment Models

DIN 41772:1979 Static power convertors; semiconductor rectifier equipment, shapes and letter symbols of characteristic curves
DIN 41772:1979-02 Static power convertors; semiconductor rectifier equipment, shapes and letter symbols of characteristic curves
DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
DIN EN IEC 60749-37:2023 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
DIN EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016

United States Navy, Semiconductor Test Equipment Models

NAVY MIL-STD-287 A NOTICE 2-1997 TEST SIGNALS FOR ELECTRONIC TACTICAL AIR NAVIGATION EQUIPMENT (TACAN)
NAVY MIL-STD-287 A VALID NOTICE 1-1991 TEST SIGNALS FOR ELECTRONIC TACTICAL AIR NAVIGATION EQUIPMENT (TACAN)
NAVY MIL-STD-287 A-1958 TEST SIGNALS FOR ELECTRONIC TACTICAL AIR NAVIGATION EQUIPMENT (TACAN)

Korean Agency for Technology and Standards (KATS), Semiconductor Test Equipment Models

KS C IEC 62526-2015(2020) Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
KS C IEC 62526:2015 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

AENOR, Semiconductor Test Equipment Models

UNE-EN 60749-30:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
UNE 73350-1:2003 Procedure for the determination of ambient radioactivity. Measurement equipment. Part 1: Gamma spectrometry by semiconductor sensors.
UNE 73350-2:2003 Procedure for the determination of ambient radioactivity. Measurement equipment. Part 2: Alpha spectrometry by semiconductor sensors.

RU-GOST R, Semiconductor Test Equipment Models

GOST 14343-1969 Semiconductors diodes types of D 223, D 223a, D 223B for widely used devices

Institute of Electrical and Electronics Engineers (IEEE), Semiconductor Test Equipment Models

IEEE Std C62.37/COR-2009 Errata to IEEE Standard Test Specification for Thyristor Diode Surge Protective Devices
IEEE 1450.1-2005 IEEE Standard for Extensions to Standard Test Interface Language (STIL) (IEEE Std 1450?999) for Semiconductor Design Environments IEEE Computer Society Document; Errata:12/20/2005

AT-OVE/ON, Semiconductor Test Equipment Models

OVE EN IEC 60749-10:2021 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (IEC 47/2692/CDV) (english version)

未注明发布机构, Semiconductor Test Equipment Models

BS IEC 62526:2007(2010) Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

Canadian Standards Association (CSA), Semiconductor Test Equipment Models

CSA C22.2 No.199-M89-CAN/CSA-1989 Dispositifs De Surveillance De Flamme Et Allumeurs A Semi-Conducteurs Pour Appareils A Gaz Et A Mazout Fiche No 1

International Electrotechnical Commission (IEC), Semiconductor Test Equipment Models

IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
IEC 62830-8:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-30:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Military Standard of the People's Republic of China-General Armament Department, Semiconductor Test Equipment Models

GJB 4295-2001 Code naming method for measurement and control equipment at missile and spacecraft test sites
GJB 4295A-2017 Code naming method for missile and spacecraft test site measurement and control equipment

ECIA - Electronic Components Industry Association, Semiconductor Test Equipment Models

EIA CB-5-1:1971 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices (Addendum to Bulletin No.5; (STABILIZED))

Professional Standard - Aerospace, Semiconductor Test Equipment Models

QJ 3156-2002 Stress test method for large structure of missile ground equipment

IECQ - IEC: Quality Assessment System for Electronic Components, Semiconductor Test Equipment Models

QC 750101/SU 0001-1990 Detail Specification for Electronic Components Signal Semiconductor Epitaxy- Planar Ambient-Rated Diodes for Pulse and Digital Circuits of Electronic Equipment Type KD5I0A
QC 750101/SU 0003-1990 Detail Specification for Electronic Components Signal Semiconductor Epitaxy- Planar Ambient-Rated Diodes for Pulse and Digital Circuits of Electronic Equipment Type KD522B
QC 750101/SU 0002-1990 Detail Specification for Electronic Components Signal Semiconductor Epitaxy-Planar Ambient- Rated Diodes for Pulse and Digital Circuits of Electronic Equipment Type KD52IA@ KD52IB

Japanese Industrial Standards Committee (JISC), Semiconductor Test Equipment Models

JIS C 5630-3:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing
JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials

CENELEC - European Committee for Electrotechnical Standardization, Semiconductor Test Equipment Models

EN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 60191-6-12:2002 Mechanical Standardization of Semiconductor Devices Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages Design Guide for Fine-Pitch Land Grid Array (FLGA) Rectangular Type

ES-UNE, Semiconductor Test Equipment Models

UNE-EN IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006) (Endorsed by AENOR in November of 2006.)
UNE-EN 60749-27:2006/A1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (Endorsed by AENOR in January of 2013.)

American National Standards Institute （ANSI), Semiconductor Test Equipment Models

ANSI/IEEE 1450.1:2005 Standard for Extensions to Standard Test Interface Language (STIL) (IEEE Std. 1450-1999) for Semiconductor Design Environments