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Sealing of semiconductor equipment

Sealing of semiconductor equipment, Total:499 items.

In the international standard classification, Sealing of semiconductor equipment involves: Aircraft and space vehicles in general, Semiconductor devices, Seals, glands, Electromechanical components for electronic and telecommunications equipment, Electrical accessories, Medical equipment, Telecommunication systems, Shipbuilding and marine structures in general, Insulating materials, Technical drawings, Mechanical structures for electronic equipment, Air quality, Protection against fire, Integrated circuits. Microelectronics, Linear and angular measurements, Rectifiers. Convertors. Stabilized power supply, Pipeline components and pipelines, Internal combustion engines for road vehicles, Telecommunication terminal equipment, Optoelectronics. Laser equipment, Compressors and pneumatic machines, Acoustics and acoustic measurements, Refrigerating technology, Safety of machinery, Industrial automation systems, Electrical engineering in general, Electricity. Magnetism. Electrical and magnetic measurements, Capacitors, Semiconducting materials, Rotating machinery, Electronic display devices, Vocabularies, Welding, brazing and soldering, Components for electrical equipment, Power stations in general, Switchgear and controlgear, Printed circuits and boards, Electronic components in general, Power transmission and distribution networks, Fluid power systems, Rubber and plastics products, Products of non-ferrous metals, Measurement of fluid flow, Automatic controls for household use, Electrical equipment for working in special conditions, Valves, Aerospace fluid systems and components, Company organization and management, Aerospace electric equipment and systems, Occupational safety. Industrial hygiene.

SE-SIS, Sealing of semiconductor equipment

SIS SS-IEC 747:1991 Semiconductor devices — Discrete devices
SIS SEN 01 03 51-1966 Semiconductor devices Terminology
SIS SEN 01 03 51-1976 Semiconductor devices Terminology
SIS SS-IEC 748:1991 Semiconductor devices — Integrated circuits
SIS SEN 27 06-1962 Polycrystalline semiconductor rectifier stacks and equipments
SIS SS-IEC 749:1991 Semiconductor devices - Mechanical and climatic test methods
SIS SEN 28 09 06-1971 Metal- and plastic-enclosed switchgear and controlgear. Placing of neutral and protective conductors
SIS SEN 47 10 03-1973 Radio interference. Limits and methods of measurement of interference voltage for regulating controls incorporating semiconductor devices

Defense Logistics Agency, Sealing of semiconductor equipment

DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
DLA MIL-S-19500/173 A VALID NOTICE 3-2011 Semiconductor Device, Transistor, Types 2N389 and 2N424 (Navy)
DLA SMD-5962-87641-1988 MICROCIRCUITS, LINEAR, BIMOS 8-BIT, SERIAL INPUT, LATCHED DRIVER, MONOLITHIC SILICON
DLA DSCC-DWG-85006 REV E-2008 RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 1.0 AMPERE, 60 V DC, SPST (N.0.), CMOS INPUT
DLA MIL-PRF-19500/610 E VALID NOTICE 1-2008 Semiconductor Device, Hermetic, Diode, Silicon, Schottky Barrier, Types 1N6677-1 and 1N6677UR-1, JAN, JANTX, JANTXV, JANS, JANHC, and JANKC
DLA MIL-PRF-19500/610 E (1)-2012 SEMICONDUCTOR DEVICE, HERMETIC, DIODE, SILICON, SCHOTTKY BARRIER, TYPES 1N6677-1 AND 1N6677UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
DLA MIL-PRF-19500/620 H-2011 SEMICONDUCTOR DEVICE, HERMETIC, DIODE, SILICON, RECTIFIER, SCHOTTKY BARRIER, TYPES 1N5822, 1N5822US, 1N6864, 1N6864US, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
DLA MIL-PRF-19500/586 J-2009 SEMICONDUCTOR DEVICE, DIODE, SILICON, SCHOTTKY BARRIER, HERMETIC, TYPES 1N5819-1, 1N5819UR-1, 1N6761-1, AND 1N6761UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
DLA MIL-PRF-19500/586 J-2008 SEMICONDUCTOR DEVICE, DIODE, SILICON, SCHOTTKY BARRIER, HERMETIC, TYPES 1N5819-1, 1N5819UR-1, 1N6761-1, AND 1N6761UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
DLA SMD-5962-86864-1988 MICROCIRCUITS, DIGITAL, ERASEABLE, CMOS, PROGRAMMABLE LOGIC DEVICE
DLA MIL-PRF-19500/586 K-2011 SEMICONDUCTOR DEVICE, DIODE, SILICON, SCHOTTKY BARRIER, HERMETIC, TYPES 1N5817-1, 1N5817UR-1, 1N5819-1, 1N5819UR-1, 1N6761-1, AND 1N6761UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC

CZ-CSN, Sealing of semiconductor equipment

CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
CSN 35 8754-1973 Semiconductor devices. Transistors. Measurement of short-circuit output admittance
CSN 35 8756-1973 Semiconductor devices. Transistors Measurement of y-parameters
CSN 35 8797 Cast.8 IEC 747-8 ZA1+A2:1996 Semiconductor devices. Discrete devices. Part 8: Field-effect transistore
CSN 35 8742-1973 Semiconductor devices. Transistors. Measurement of cut-oíf currents
CSN 34 0415-1973 Screwless terminals for connecting copper of eonductors
CSN IEC 92-304:1993 Electrical installations in ships. Equipment. Semiconductor convertors
CSN IEC 749:1994 Semiconductor devices.Mechanical and climatic test methods
CSN 35 8759-1977 Semiconductor devices. Transistors. Methods of measurement of switching times
CSN 35 8737-1975 Semiconductor devices. Diodes. Measurement of differential rosistanoe
CSN IEC 748-1:1993 Semiconductor devices. Integrated circuits. Part 1: General
CSN 35 8749-1973 Semiconductor devices. Transistors. Measurement of absolute value of short-circuit forward transfer admittance
CSN IEC 747-10:1994 Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits
CSN 35 8801-1979 Semiconductor devices for widely u?ed equipments. General specifications.
CSN 35 8971 Cast.1-1984 Semiconductor devices. Substrates for masks and masks. Nomenclature and definitions
CSN 35 8731-1975 Semiconductor devices. Diodes Measurement of d. c. forward voltage
CSN 35 8763-1973 Semiconductor devices. Diodes. Measurement o? reverse breakdown voltage
CSN 35 8761-1973 Semiconductor devices. Phototransistors photodíodes. Measurement of photoelectric current
CSN 35 8762-1973 Semiconductor devices. Phototransistors photodiodes. Measurement of dark current
CSN 35 8752-1976 Semiconductor devices. Transistors. Measuring methods for common base output capacitance.
CSN 35 8785-1975 Semiconductor devices. Varicaps. Measurement of thermal capacitance coefflcient.
CSN IEC 747-3-2:1991 Semiconductor devices. Discrete devices. Part 3: Signal (including switching)and regulator diodes. Section two. Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision referenc
CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
CSN 35 8733-1975 Semiconductor devices. Diodes. Measurement of reverse voltago (working voltago)
CSN 35 8764-1976 Semicoaductor devices. Switching diodes. Measurement o? reverse recovery time.
CSN 35 8765-1976 Semiconductor devices. Switching diodes. Measurement of reverse recovery charge.
CSN 35 8797 Cast.3 IEC 747-3 ZA1+A2:1996 Semiconductor devices. Discrete devices. Part 3: Signál (including switching) and regu lator diodes
CSN 35 8797 Cast.1 IEC 747-1 Z2:1996 Semiconductor devices. Discrete devices and integrated circuits. Pari 1: General.
CSN 35 8804-1985 Semiconductor optoelectronic devices for widely u?ed equipments. General specifications
CSN 35 4102-1997 Low-voltage controlgear Part 2: Semiconductor contactors (solid state contactors)
CSN 35 8797 Cast.2 IEC 747-2:1990 Semiconductor devices. Discrete devices and integrated circuits. Part 2: Rectifíer diodes
CSN 35 8746-1973 Semiconductor devices. Transistore. Measurement of absolute value of forward current transfer ratio and frequencies fT, fh21b, fh21e
CSN 35 8745-1973 Semiconductor devices. Transistore. Measurement of open-circuit reverse voltage transfer ratio and tinie coefíicient at high frequencies

BE-NBN, Sealing of semiconductor equipment

NBN C 95-001-1977

PL-PKN, Sealing of semiconductor equipment

PN E93602-1969 Metallic segting glands for conduc?ors in elektrical installa?ions on ships Housings
PN E93601-1969 Melallic sealing glands for conductors in eleclrical inslalla?ions on ships
PN E93607-1969 Me?allic sealing glands for conduc?ors in electrical installalions on ships packings
PN T04901-1974 Mierowave e?uipment Sealing test for waveguide tubing
PN E93608-1969 Me?allic sealing glands for conductors in eleclrical installations on ships Plugs
PN E93606-1969 Melallic sealing glands lor conductors in elec?rical inslollations on ships Washer pads
PN T01208-01-1992 Semiconductor devices Bipolar transistors Terminology and letter symbols
PN E93600-1969 Metallic sealing glands tor conduclors in electrical inslalla?ions in ?hips General specificalion
PN T01501 ArkusZ4-1973 Semiconductor deyictj Letter symbols of field-effect transistors porameters
PN M73091-1962 Hydraullc drive and control equipment. Dtmensions of housings for hydraullcseals
PN T01201-1988 Semiconductor devices Discrete, devices and intgrated circuits Part: General Translation of Publication IEC 747-1 (1983)

British Standards Institution (BSI), Sealing of semiconductor equipment

BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
BS IEC 60747-5-13:2021 Semiconductor devices. Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
BS EN 60191-6-8:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)
BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
BS IEC 60092-304:2002 Electrical installation in ships - Equipment - Semiconductor convertors
BS EN 60747-2:2016 Semiconductor devices. Discrete devices. Rectifier diodes
BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch
BS EN 60204-33:2011 Safety of machinery. Electrical equipment of machines. Requirements for semiconductor fabrication equipment
BS EN 60191-6-12:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
BS IEC 62047-41:2021 Semiconductor devices. Micro-electromechanical devices. RF MEMS circulators and isolators
BS IEC 60092-304:2022 Tracked Changes. Electrical installations in ships. Equipment. Semiconductor converters
BS EN 60749-32:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
22/30430766 DC BS EN 60947-10. Low-voltage switchgear and controlgear - Part 10. Semiconductor Circuit-Breakers
BS 5424-2:1987 Low-voltage controlgear - Specification for semiconductor contactors (solid state contactors)
BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
BS EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 5: Die and wafer devices
BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
19/30389766 DC BS IEC 60747-8 AMD1. Semiconductor devices. Discrete devices. Part 8. Field-effect transistors
18/30383448 DC BS EN 60947-4-3. Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
18/30375223 DC BS EN 60947-4-3. Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
BS EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
BS EN 60191-6-5:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
BS EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
BS EN 13604:2002 Copper and copper alloys - Products of high conductivity copper for electronic tubes, semiconductor devices and vacuum applications
BS EN 60191-6-12:2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
BS EN 60749-30+A1:2006 Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing
BS EN 60749-30:2005+A1:2011 Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing
18/30365373 DC BS IEC 60092-304 Ed.4.0. Electrical installations in ships. Part 304. Equipment - Semiconductor convertors
BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PF
BS EN 331:1998 Manually operated ball valves and closed bottom taper plug valves for gas installations in buildings
BS IEC 62047-40:2021 Semiconductor devices. Micro-electromechanical devices. Test methods of micro-electromechanical inertial shock switch threshold
BS PD IEC/TS 62564-1:2016 Process management for avionics. Aerospace qualified electronic components (AQEC). Integrated circuits and discrete semiconductors
BS DD IEC/TS 62564-1:2011 Process management for avionics. Aerospace qualified electronic components (AQEC). Integrated circuits and discrete semiconductors
BS EN 60191-6-6:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA). Proposed amendment on terminology
BS EN 60749-15:2011 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
BS EN 60749-15:2003 Semiconductor devices - Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
BS 6493-1.5:1992 Semiconductor devices. Discrete devices. Recommendations for optoelectronic devices. Section 5: Recommendations for optoelectronic devices
BS EN IEC 60749-30:2020 Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing
BS EN 60749-15:2010 Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

Group Standards of the People's Republic of China, Sealing of semiconductor equipment

T/QGCML 1407-2023 Double sleeve sealing device for semiconductor photovoltaic manufacturing
T/ZACA 041-2022 Mixed signal semiconductor device test equipment
T/ZAMPCC 002-2023 The automatic adhesive equipments of heat conduction and seal airtight for vehicle controller
T/ZAQ 10113-2022 Intermittent working life test equipment for semiconductor devices
T/CZSBDTHYXH 001-2023 Wafer defects Automatic optical inspection equipment
T/QGCML 744-2023 Chemical cleaning process specification for semiconductor equipment parts
T/QGCML 743-2023 Specifications for anodizing process of semiconductor equipment parts
T/ZJATA 0017-2023 Chemical vapor deposition (CVD) epitaxy equipment for preparing silicon carbide semiconductor materials
T/CES 007-2018 Guide for on-site lighting impulse test of gas-insulated metal-enclosure switchgear

YU-JUS, Sealing of semiconductor equipment

JUS N.A3.500-1980 Semiconductor devices. Graphical symbols
JUS N.E5.240-1991 Low-voltage fuses. Supplementary requirements for fuse-links for the protection of semiconductor devices
JUS N.A5.772-1980 Basic envronmental testing procedures for equipment and their components. Test Qc: Container sealing, gas leakage
JUS N.A5.774-1980 Basic environmental testing procedures for equipment and their components. Test Qe: Container sealing, penetration ofliquid

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Sealing of semiconductor equipment

GB/T 15872-1995 Power supply interface for semiconductor equipment
GB/T 15872-2013 Power supply interface for semiconductor equipment
GB/T 11023-1989 Test guide of SF6 gas tightness for high-voltage switchgear
GB 10292-1988 Semiconductor rectifier equipments for telecommunicat-ions
GB/T 22193-2008 Electrical installations in ships. Equipment. Semiconductor convertors
GB/T 29845-2013 Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment
GB/T 13539.4-2016 Low-voltage fuses.Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
GB/T 13539.4-2005 Low-voltage fuses Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
GB/T 13539.4-2009 Low-voltage fuses.Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
GB/T 24468-2009 Specification for definition and measurement of semiconductor equipment reliability,availability and maintainability(RAM)

Danish Standards Foundation, Sealing of semiconductor equipment

DS/EN 60191-6-8:2002 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
DS/EN 60749-30/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DS/EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DS/EN 60749-8+Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
DS/EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
DS/IEC 92-304:1994 Electrical installations in ships - Part 304: Equipment - Semiconductor converters
DS/EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
DS/IEC 747-12:1993 Semiconductor devices. Part 12: Sectional specification for optoelectronic devices
DS/EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr
DS/EN 60191-6-5:2002 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
DS/EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
DS/EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
DS/EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
DS/EN 60191-6-6:2002 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
DS/EN 60191-6-10:2004 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
DS/EN 60191-6-2/Corr.1:2003 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
DS/EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
DS/EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
DS/EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
DS/EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
DS/EN 60269-4:2010 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
DS/EN 60269-4/A1:2012 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

AENOR, Sealing of semiconductor equipment

UNE-EN 60191-6-8:2002 Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
UNE-EN 60749-30:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
UNE-EN 60749-8:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE 21135-304:1993 ELECTRICAL INSTALLATIONS IN SHIPS. EQUIPMENT. SEMICONDUCTOR CONVERTORS
UNE 20700-11:1991 SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
UNE-EN 60191-6-5:2002 Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
UNE 21135-304:1993/1M:2010 Electrical installations in ships. Part 304: Equipment - Semiconductor convertors
UNE-EN 60191-6-6:2002 Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
UNE-EN 60191-6-2:2003 Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
UNE-EN 60191-6-1:2002 Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
UNE-EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
UNE-EN 60269-4:2011/A2:2017 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

Professional Standard - Medicine, Sealing of semiconductor equipment

YY/T 0998-2015 Semiconductor heating and/or cooling therapy equipment
YY 1289-2016 Laser Therapy Equipment Ophthalmic Diode Laser Photocoagulation Instrument
YY 0845-2011 Laser therapeutic equipment.Diode laser equipment for photodynamic therapy

RO-ASRO, Sealing of semiconductor equipment

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology
STAS 6988/3-1989 Refrigerating equipmcnt REFRIGERANT SEMI-HERMET1C PISTON MOTOCOMPRESSORS Basic parameters
STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties
STAS 12258/5-1986 OPTOELECTRONIG SEMICONDUCTOR DEVICES DISPLAYS Terminology and essential characteristres
STAS 7128/9-1980 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for unijonction transistors
STAS 12124/1-1982 Semiconductor devices BIPOLAR TRANZISTORS Methods for measuring electrical static parameters
STAS 7128/1-1985 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS General rules
STAS 7128/2-1986 LETTER SYMBOLS FOR SEMI- ONDUCTOR DEVICES AND INTE- RATED MICROCIRCUITS ymbols for bipolar transistors
STAS 12258/4-1986 Optoelectronic semiconductor devices LIGHT EMITTING DIODES Terminology and main characteristics
STAS 7128/6-1986 LETTER SYMBOLS FOR SEMI- CONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for thyristors
STAS 12124/3-1983 Semiconductor devices FIFL D-EFFECT TRANZISTORS Methods for measuring electrical static parameters
STAS 12124/4-1983 Semiconductor devices FIELD-EFECT TRANZISTORS Methods for measuring electrical static parameters
STAS 7128/8-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for field effect transitors
STAS 7128/4-1971 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for lunnel diodes
SR CEI 748-11-1-1992 Semiconductor devices Integrated circuits Part 11: Section 1: Internai visual examination for semiconductor integrated circuits excluding hybrid circuits
STAS 12123/4-1984 Semiconductor devices VARIABLE-CAPACITANCE DIODES Measuring methodes for electrical characteristics
STAS 7128/5-1985 LETTER SYMBOLS FOR SEMICON- DUCTOR DEVICES AND INTEGRA- TED NICROCIRCUITS Symbols for rectifier diodes
STAS CEI 747-10-1992 Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits
STAS 7128/11-1985 T.ETTJ?R SYMBOLS FOR EMICONDUCTOR DEVICES ND INTHGRATED CIRCUITS Symbols fur digital integrated eircuits
STAS 7128/10-1984 LETTER SIMBOLS FOR SEMICON- DUCTOR DEVICES ANI) INTF.GHA- TED CIRCU1TS Sinibols for analoguc inlcgnated circuits
STAS 7128/7-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED C1RCUITS Symbols for variable capacitance diodes and mixer diodes

Professional Standard - Post and Telecommunication, Sealing of semiconductor equipment

YD 576-1992 Semiconductor rectifier equipments For telecommunications
YD/T 940-1999 Semiconductor arrester for The over-voltage protection of telecommunications installations
YD/T 682-1994 Quality grading criteria of semiconductor rectifier installations for communication

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Sealing of semiconductor equipment

JEDEC JESD30D-2006 Descriptive Designation System for Semiconductor-device Packages
JEDEC JESD30E-2008 Descriptive Designation System for Semiconductor-device Packages
JEDEC JEP104C.01-2003 Reference Guide to Letter Symbols for Semiconductor Devices
JEDEC JESD31D-2010 General Requirements for Distributors of Commercial and Military Semiconductor Devices
JEDEC JESD31D.01-2012 General Requirements for Distributors of Commercial and Military Semiconductor Devices
JEDEC JESD57-1996 Test Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation
JEDEC JESD89A-2006 Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor Devices

European Committee for Electrotechnical Standardization（CENELEC）, Sealing of semiconductor equipment

EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
EN 60191-6-8:2001 Mechanical Standardization of Semiconductor Devices Part 6-8: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Glass Sealed Ceramic Quad Flatpack (G-QFP)
EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods Part 8: Sealing
EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
FprEN IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
EN 60191-6-2:2002 Mechanical Standardization of Semiconductor Devices Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
EN 62047-1:2006 Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitions
EN 120000:1996 Generic Specification: Semiconductor Optoelectronic and Liquid Crystal Devices (Remains Current)
EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods Part 32: Flammability of plastic-encapsulated devices (externally induced) (Incorporates Amendment A1: 2010)
EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods Part 31: Flammability of plastic-encapsulated devices (internally induced)
EN 60191-6-1:2001 Mechanical Standardization of Semiconductor Devices Part 6-1: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Gull-Wing Lead Terminals
EN 60191-6-5:2001 Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
EN 60269-4:2009/A2:2016 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
EN 60269-4:2009 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

NEMA - National Electrical Manufacturers Association, Sealing of semiconductor equipment

NEMA RI 6-1959 ELECTROCHEMICAL PROCESSING SEMICONDUCTOR RECTIFIER EQUIPMENT

Korean Agency for Technology and Standards (KATS), Sealing of semiconductor equipment

KS C IEC 60204-33-2010(2020) Safety guideline for semiconductor fabrication equipment
KS C IEC 62047-5:2015 Semiconductor devices - MEMS devices - Part 5: RF MEMS switches
KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS V 8209-2007 Electrical installations in ships Part 304：Equipment－Semiconductor convertors
KS C IEC 60119:2014 Recommendations for polycrystalline semiconductor rectifier stacks and equipments
KS V 8209-1999(2004) Electrical installations in ships Part 304：Equipment－Semiconductor convertors
KS C IEC 60092-304-2007(2012) Electrical installations in ships－Part 304：Equipment－Semiconductor convertors
KS C IEC 60204-33:2010 Safety guideline for semiconductor fabrication equipment
KS C IEC 60749-31:2006 Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of plastic-encapsulated devices(internally induced)
KS C IEC 60749-32:2006 Semiconductor devices－Mechanical and climatic test methods－Part 32：Flammability of plastic-encapsulated devices(externally induced)

Association of German Mechanical Engineers, Sealing of semiconductor equipment

VDI/VDE 3713 Blatt 8-1995 Technical procurement specification - Epoxy encapsulants for semiconductor chips

Lithuanian Standards Office , Sealing of semiconductor equipment

LST EN 60191-6-22-2013 Mechanical standardization of semiconductor devices -- Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic
LST EN 60191-6-8-2002 Mechanical standardization of semiconductor devices. Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001)
LST EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)
LST EN 62047-5-2011 Semiconductor devices - Micro-electromechanical devices -- Part 5: RF MEMS switches (IEC 62047-5:2011)
LST EN 62047-1-2006 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2005)
LST EN 60749-8-2004 Semiconductor devices. Mechanical and climatic test methods. Part 8: Sealing (IEC 60749-8:2002 + corrigendum 2003)
LST EN IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2020)
LST EN 60191-6-18-2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010)
LST EN 60191-6-2-2003 Mechanical standardization of semiconductor devices. Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (I
LST EN 60191-6-1-2003 Mechanical standardization of semiconductor devices. Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals (IEC 60191-6-1:2001)
LST EN 60191-6-4-2003 Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)
LST EN 60191-6-5-2002 Mechanical standardization of semiconductor devices. Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001)
LST EN 60191-6-10-2004 Mechanical standardization of semiconductor devices. Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON (IEC 60191-6-10:2003)
LST EN 60191-6-6-2002 Mechanical standardization of semiconductor devices. Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001)
LST EN 60191-6-17-2011 Mechanical standardization of semiconductor devices -- Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land g
LST EN 60749-31-2004 Semiconductor devices. Mechanical and climatic test methods. Part 31: Flammability of plastic-encapsulated devices (internally induced) (IEC 60749-31:2002)
LST EN 60204-33-2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (IEC 60204-33:2009, modified)
LST EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
LST EN 60747-16-3-2003/A1-2009 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A1:2009)
LST EN 60191-6-12-2011 Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011)

German Institute for Standardization, Sealing of semiconductor equipment

DIN EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
DIN EN 60749-8:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 / Note: Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standa...
DIN 8905-1:1983 Tubes for refrigerating systems with hermetic and semi-hermetic compressors; outside diameter up to 54 mm; technical delivery conditions
DIN EN 60191-6-22:2013-08 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
DIN ISO 9090:1990 Gas tightness of equipment for gas welding and allied processes; identical with ISO 9090:1989
DIN EN 60191-6-8:2002 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Germa
DIN 41752:1982 Static power convertors; semiconductor convertor equipment; rating code
DIN EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2011); German version EN 60749-29:2011
DIN EN 60191-6-18:2010-08 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German ...
DIN EN 62047-20:2015 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
DIN EN 60269-4:2008 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices (IEC 60269-4:2006); German version EN 60269-4:2007
DIN EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DIN 41751:1977 Static power convertors; semiconductor convertor assemblies and equipments, cooling methods
DIN EN 60191-6-17:2011-09 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...
DIN EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191
DIN EN 60191-6-12:2011-12 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); Ger...
DIN EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (
DIN 41772 Beiblatt 2:1979-02 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for equipment operating in parallel with batteries
DIN EN 60749-30:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011
DIN EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German
DIN 41772:1979 Static power convertors; semiconductor rectifier equipment, shapes and letter symbols of characteristic curves
DIN 41777:1986 Static power convertors; semiconductor rectifier equipment for trickle charging of lead-acid batteries
DIN EN IEC 60747-5-5:2021 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2020); German version EN IEC 60747-5-5:2020
DIN EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German ver
DIN 41772 Bb.2:1979 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for equipment operating in parallel with batteries
DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN 41772 Bb.1:1979 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for battery chargers
DIN 41772:1979-02 Static power convertors; semiconductor rectifier equipment, shapes and letter symbols of characteristic curves
DIN 41772 Beiblatt 1:1979-02 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for battery chargers
DIN EN IEC 60749-30:2023-02 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...

Association Francaise de Normalisation, Sealing of semiconductor equipment

NF C96-022-8*NF EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing
NF EN 60749-8:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8 : étanchéité
NF EN 62779-1:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 1 : exigences générales
NF C63-244-1*NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : general requirements and specifications
NF S61-704:1966 Fire fighting equipment. Self-sealing symmetrical half couplings, sizes 40 and 65.
NF S61-705:1966 Fire fighting equipment. Self-sealing symmetrical half couplings, size 100. Type AR.
NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
NF C96-005-5*NF EN IEC 60747-5-5:2020 Semiconductor devices - Part 5-5 : optoelectronic devices - Photocouplers
NF S31-123:1986 Acoustics. Noise emitted by refrigeration equipments with hermetic and accessible hermetic compressors. Test code for measuring the sound power.
NF C96-005-5/A1*NF EN 60747-5-5/A1:2015 Semiconductor devices - Discrete devices - Part 5-5 : optoelectronic devices - Photocouplers
NF C96-013-6-8*NF EN 60191-6-8:2002 Mechanical standardization of semiconductor devices - Part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
NF C96-022-30/A1*NF EN 60749-30/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing
NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
NF EN 62779-3:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 3 : type fonctionnel et ses conditions d'utilisation
NF EN 60204-33:2012 Sécurité des machines - Équipement électrique des machines - Partie 33 : exigences pour les équipements de fabrication des semi-conducteurs
NF EN 60191-6-12:2012 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12 : règles générales pour la préparation des dessins d'encombrement des boîtiers des dispositifs à semiconducteurs à montage en surface - Lignes drectrices de conception po...
NF C79-130-33*NF EN 60204-33:2012 Safety of machinery - Electrical equipment of machines - Part 33 : requirements for semiconductor fabrication equipment.
NF EN 60191-6-22:2013 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-22 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciel...
NF EN 60191-6-1:2002 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-1 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broch...
NF EN 60191-6-2:2002 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-2 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broch...
NF EN 60191-6-17:2012 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-17 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers empilés ...
NF C96-022-15*NF EN 60749-15:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices.
NF C96-069-3*NF EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3 : shock driven piezoelectric energy harvesting for automotive vehicle sensors
NF C96-435-6*NF EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6 : packaged or finished devices
NF EN 60191-6-5:2002 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-5 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels...
NF EN 60191-6-18:2010 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matrici...
NF C96-013-6-22*NF EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic
NF C96-022-32/A1*NF EN 60749-32/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced)
NF C96-013-6-18*NF EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
NF EN 60191-6-8:2002 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quad...
NF C47-734:1993 Automatic electrical controls for househod and similar use. Part 2 : particular requirements for thermal motor protectors for motor-compressors of hermetic and semi-hermetic type.
NF C96-022-31*NF EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31 : flammability of plastic-encapsulated devices (internally induced)
NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
NF EN IEC 60749-30:2020 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30 : préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité
NF C96-013-6-1*NF EN 60191-6-1:2002 Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals.
NF C60-200-4/A2*NF EN 60269-4/A2:2017 Low-voltage fuses - Part 4 : Supplementary requirements for fuse-links for the protection of semiconductor devices

International Electrotechnical Commission (IEC), Sealing of semiconductor equipment

IEC 60749-8:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
IEC 60747-5-6:2021 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
IEC 60749-30:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60092-304:1980 Electrical installations in ships. Part 304 : Equipment - Semiconductor convertors
IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
IEC 60749-30:2005/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60119:1960 Recommendation for polycrystalline semiconductor rectifier stacks and equipment
IEC 60092-304:2022 Electrical installations in ships - Part 304: Equipment - Semiconductor converters
IEC 60204-33:2009 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
IEC 60092-304/AMD1:1980 Electrical Installations in Ships Part 304: Equipment - Semiconductor Convertors (Edition 3.0)
IEC 60092-304:1980/AMD1:1995 Electrical installations in ships - Part 304: Equipment - Semiconductor convertors; Amendment 1
IEC 60191-6-18:2010/COR1:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 60158-2:1982 Low-voltage controlgear. Part 2 : Semiconductor contactors (solid state contactors)
IEC 60269-4:2006 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010/COR2:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
IEC 60191-6-2:2001/COR1:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages;
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals
IEC 60079-13:2010 Explosive atmospheres - Part 13: Equipment-protection by pressurized room "p"
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 60269-4:2012 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
IEC 60191-6-12:2002 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type
IEC PAS 60191-6-18:2008 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60269-4/AMD2:2002 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices; Amendment 2
IEC 60747-5-5:2007+AMD1:2013 CSV Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 60747-11:1985/AMD2:1996 Amendment 2 - Semiconductor devices. Discrete devices. Part 11: Sectional specification for discrete devices
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-30:2020 RLV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)

IN-BIS, Sealing of semiconductor equipment

American National Standards Institute （ANSI), Sealing of semiconductor equipment

ANSI/NFPA 318-2011 Standard for the Protection of Semiconductor Fabrication Facilities
ANSI/EIA 401:1973 Paper, Paper/Film Dielectric Capacitors for Power Semiconductor Applications
ANSI/ASME MFC-8M-2001 Fluid Flow in Closed Conduits – Connections for Pressure Signal Transmission Between Primary and Secondary Devices

Aerospace Industries Association, Sealing of semiconductor equipment

AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type

工业和信息化部, Sealing of semiconductor equipment

SJ/T 11762-2020 Semiconductor equipment manufacturing information labeling requirements
SJ/T 11763-2020 Specification for human-machine interface for semiconductor manufacturing equipment
SJ/T 11761-2020 Specification for loading ports of semiconductor equipment for wafers 200mm and below

CH-SNV, Sealing of semiconductor equipment

VSM 10336.10-1939

IECQ - IEC: Quality Assessment System for Electronic Components, Sealing of semiconductor equipment

PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits

国家质量监督检验检疫总局, Sealing of semiconductor equipment

SN/T 3480.4-2016 Technical requirements for inspection of complete sets of equipment for the imported electronics and electrical industry Part 4: Semiconductor packaging and testing equipment

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Sealing of semiconductor equipment

IEEE 216-1960 STANDARDS ON SOLID STATE DEVICES: DEFINITIONS OF SEMICONDUCTOR TERMS

HU-MSZT, Sealing of semiconductor equipment

MNOSZ 25280-1955

Electronic Components, Assemblies and Materials Association, Sealing of semiconductor equipment

ECA CB 5-1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
ECA CB 5-1-1971 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices Addendum to CB5

BELST, Sealing of semiconductor equipment

STB 2340-2013 Cooling radiators of semiconductor devices. General specifications
STB 2365-2014 Cooling radiators of semiconductor devices. Methods of calculation

Institute of Electrical and Electronics Engineers (IEEE), Sealing of semiconductor equipment

IEEE Std 216-1960 IRE Standards on Solid-State Devices: Definitions of Semiconductor Terms
IEEE 216*61 IRE 28 S1 IEEE Standards on Solid-State Devices: Definitions of Semiconductor Terms 1960
IEEE Std 1687-2014 IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
IEEE 1687-2014 Access and Control of Instrumentation Embedded within a Semiconductor Device (IEEE Computer Society)
IEEE Std C62.37/COR-2009 Errata to IEEE Standard Test Specification for Thyristor Diode Surge Protective Devices
IEEE P1687/D1.62, September 2013 IEEE Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
IEEE P1687/D1.71, March 2014 IEEE Approved Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device

Taiwan Provincial Standard of the People's Republic of China, Sealing of semiconductor equipment

CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)

ES-UNE, Sealing of semiconductor equipment

UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
UNE-EN 60204-33:2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (Endorsed by AENOR in December of 2011.)
UNE-EN 60191-6-18:2010 Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
UNE-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)
UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
UNE-EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...
UNE-EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (Endorsed by AENOR in Nove...
UNE-EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (Endorsed by Asociación Española de Normalización in November of 2021.)
UNE-EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)

Building Officials and Code Administrators International(U.S.), Sealing of semiconductor equipment

BOCA ARTICLE 18 NFPC COMM-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials
BOCA ARTICLE 18 NFPC-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials Eighth Edition

Standard Association of Australia （SAA）, Sealing of semiconductor equipment

AS 1852.521:1988 International electrotechnical vocabulary - Semiconductor devices and integrated circuits
AS/NZS IEC 60947.4.2:2015

Japanese Industrial Standards Committee (JISC), Sealing of semiconductor equipment

JIS F 8067:1986 Electrical installations in ships Part 304 Equipment -- Semiconductor convertors
JIS F 8067:2000 Electrical installations in ships -- Part 304: Equipment -- Semiconductor convertors
JIS B 9960-33:2012 Safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
JIS B 2409:2002 Hydraulic fluid power -- Sealing devices -- Standard test methods to assess the performance of seals used in oil hydraulic reciprocating applications

AT-ON, Sealing of semiconductor equipment

ONORM EN 29090-1992 Gas tightness of equipment for gas welding and allied processes

AT-OVE/ON, Sealing of semiconductor equipment

OVE EN IEC 63244-1:2020 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (IEC 47/2653/CDV) (english version)
OVE EN IEC 60747-5-5:2021 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers ((IEC 60747-5-5:2020) EN IEC 60747-5-5:2020) (german version)
OVE EN IEC 60749-10:2021 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (IEC 47/2692/CDV) (english version)

RU-GOST R, Sealing of semiconductor equipment

GOST R IEC 748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
GOST 31196.4-2012 Lov-voltage fuse-links. Part 4. Supplementary requirements for fuse-links for the protection of semiconductor devices
GOST 14343-1969 Semiconductors diodes types of D 223, D 223a, D 223B for widely used devices
GOST R 53734.5.6-2021 Electrostatics. Protection of electronic devices against electrostatic phenomena. Integrated circuits and semiconductor devices

CENELEC - European Committee for Electrotechnical Standardization, Sealing of semiconductor equipment

EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
EN 60191-6-12:2002 Mechanical Standardization of Semiconductor Devices Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages Design Guide for Fine-Pitch Land Grid Array (FLGA) Rectangular Type
EN 60269-4:2007 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

Professional Standard - Machinery, Sealing of semiconductor equipment

JB/T 4219-1999 Type designation of measuring equipments for power semiconductor devices
JB/T 8453-1996 Semiconductor converters - Part 5: Switches for uninterruptible power supply equipment (UPS switches)
JB/T 50129-1999 Guidelines for product quality classification inspection of gas-insulated metal-enclosed switchgear above 72.5kV

Professional Standard - Electricity, Sealing of semiconductor equipment

DL/T 728-2013 Choose guide of gas-insulated metal-enclosure switchgear
DL/T 311-2010 Guide for AC 1100kV GIS/HGIS maintenance
DL/T 728-2000 Technical guide for the order of Gas-insulated metal-enclosed switchgear
DL/T 1688-2017 Guidelines for condition evaluation of gas-insulated metal-enclosed switchgear
DL/T 1689-2017 Guidelines for condition maintenance of gas insulated metal-enclosed switchgear
DL/T 1300-2013 Guide for impulse test of gas-insulated metal-enclosure switchgear on site
DL/T 555-2004 Guide for withstand voltage and insulated test of gas-insulated metal-enclosure switchgear on site
DL/T 555-1994 Guide for withstand voltage and insulated test of gas-insulated metal-enclosure switchgear on site

国家市场监督管理总局、中国国家标准化管理委员会, Sealing of semiconductor equipment

GB/T 36646-2018 Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy
GB/T 11023-2018 Test method of SF6 gas tightness for high—voltage switchgear
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

AIA/NAS - Aerospace Industries Association of America Inc., Sealing of semiconductor equipment

NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type

American Society for Testing and Materials (ASTM), Sealing of semiconductor equipment

ASTM E431-96(2016) Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices

Insulated Cable Engineers Association （ICEA), Sealing of semiconductor equipment

ICEA T-32-645-1993 Establishing Compatibility of Sealed Conductor Filler Compounds with Conducting Stress Control Materials

Professional Standard - Energy, Sealing of semiconductor equipment

NB/T 11071-2023 1kV-52kV AC Solid Insulated Enclosed Switchgear and Controlgear Test Guidelines

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Sealing of semiconductor equipment

GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment
GB/T 36005-2018 Measuring methods of optical radiation safety for semiconductor lighting equipments and systems

PT-IPQ, Sealing of semiconductor equipment

NP 2626-521-2001 International Electrotechnical Vocabulary Chapter 521: Semiconductor devices and integrated circuits

国家药监局, Sealing of semiconductor equipment

YY/T 1751-2020 Laser treatment equipment semiconductor laser intranasal irradiation therapy instrument

UNKNOWN, Sealing of semiconductor equipment

CN-QIYE, Sealing of semiconductor equipment

Q/GDW 448-2010
Q/GDW 199-2008 Guidelines for Construction Technology of 1000kV Gas Insulated Metal Enclosed Switchgear

National Metrological Technical Specifications of the People's Republic of China, Sealing of semiconductor equipment

JJF 1895-2021 Calibration Specification for Semiconductor Devices DC and Low Frequency Parameters Test Equipments

SAE - SAE International, Sealing of semiconductor equipment

SAE EIA-4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges

European Committee for Standardization (CEN), Sealing of semiconductor equipment

HD 419.2 S1-1987 Low-voltage controlgear; part 2: semiconductor contactors (solid state contactors)
EN 13604:2002 Copper and Copper Alloys - Products of High Conductivity Copper for Electronic Tubes, Semiconductor Devices and Vacuum Applications
EN 13604:2013 Copper and copper alloys - Semiconductor devices, electronic and vacuum products made from high conductivity copper

U.S. Military Regulations and Norms, Sealing of semiconductor equipment

ARMY MIL-PRF-55310/18 F-2009 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 0.01 Hz THROUGH 15.0 MHz, HERMETIC SEAL, SQUARE WAVE, CMOS
ARMY MIL-PRF-55310/30 D-2008 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 450 kHz THROUGH 100 MHz, HERMETIC SEAL, LOW VOLTAGE CMOS
ARMY MIL-PRF-55310/12 H-2009 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 0.05 MHz THROUGH 10 MHz, HERMETIC SEAL, SQUARE WAVE, CMOS
ARMY MIL-PRF-55310/37 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO), 500 KHz THROUGH 85 MHz, HERMETIC SEAL, CMOS
ARMY MIL-PRF-55310/27 D-2008 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 1.0 MHz THROUGH 85 MHz, HERMETIC SEAL, SQUARE WAVE, HIGH SPEED CMOS
ARMY MIL-PRF-55310/32 B-2008 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 1.544 MHz THROUGH 125 MHz, HERMETIC SEAL, SQUARE WAVE, ADVANCED CMOS
ARMY MIL-PRF-55310/31 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 0.75 MHz THROUGH 200 MHz, HERMETIC SEAL, SQUARE WAVE, ADVANCED CMOS
ARMY MIL-PRF-55310/33 B-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 500 KHz THROUGH 85 MHz, HERMETIC SEAL, CMOS
ARMY MIL-PRF-55310/34 B-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 500 KHz THROUGH 150 MHz, HERMETIC SEAL, LOW VOLTAGE CMOS
ARMY MIL-PRF-55310/38 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO), 500 KHz THROUGH 150 MHz, HERMETIC SEAL, LOW VOLTAGE CMOS
ARMY MIL-PRF-55310/35 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO), 1 MHz THROUGH 133 MHz, HERMETIC SEAL, LOW VOLTAGE 2.5V CMOS
ARMY MIL-PRF-55310/36 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO), 1 MHz THROUGH 100 MHz, HERMETIC SEAL, LOW VOLTAGE 1.8V CMOS
ARMY MIL-PRF-55310/39 A-2010 OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO), 1 MHz THROUGH 133 MHz, HERMETIC SEAL, LOW VOLTAGE 2.5V CMOS

GOSTR, Sealing of semiconductor equipment

GOST R 59023.6-2020 Welding and surfacing of equipment and pipelines of nuclear power plants. Surfacing of sealing and guiding surfaces

TH-TISI, Sealing of semiconductor equipment

TIS 2114-2002 Low.voltage fuses.part 4: supplementary requirements for fuse.links for the protection of semiconductor devices

FI-SFS, Sealing of semiconductor equipment

American Society of Mechanical Engineers (ASME), Sealing of semiconductor equipment

ASME MFC-8M-2001 Fluid Flow in Closed Conduits : Connections for Pressure Signal Transmissions Between Primary and Secondary Devices

IEC - International Electrotechnical Commission, Sealing of semiconductor equipment

PAS 60191-6-18-2008 Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) (Edition 1.0)
PAS 62240-2001 Use of Semiconductor Devices Outside Manufacturer's Specified Temperature Ranges (Edition 1.0)

International Telecommunication Union (ITU), Sealing of semiconductor equipment

ITU-T K.150-2020 Information of semiconductor devices required for the design of telecommunication equipment applying soft error mitigation measures

未注明发布机构, Sealing of semiconductor equipment

BS 5424-2:1987(1999) Low - voltage controlgear — Part 2 : Specification for semiconductor contactors (solid state contactors)

Professional Standard - Electron, Sealing of semiconductor equipment

SJ/T 11820-2022 Technical requirements and measurement methods for DC parameter test equipment of semiconductor discrete devices

Society of Automotive Engineers (SAE), Sealing of semiconductor equipment

SAE AS85720/1-1998 FITTINGS, TUBE, FLUID SYSTEMS, SEPARABLE, HIGH PRESSURE, DYNAMIC BEAM SEAL, DESIGN STANDARD FOR MALE END FSC 4730

Japan Electronics and Information Technology Industries Association, Sealing of semiconductor equipment

EIAJ RC-2372-1997 Test methods of seal performance of aluminium electrolytic capacitors with non-solid electrolyte for use in electronic equipment

PH-BPS, Sealing of semiconductor equipment

PNS IEC 60749-30:2021 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing