31.080.01 半导体器分立件综合 标准查询与下载
共找到 1415 条与 半导体器分立件综合 相关的标准，共 95 页
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-12-15
- 实施
- 2020-12-15
Diode low frequency noise parameter testing method
- ICS
- 31.080.01
- CCS
- L 41
- 发布
- 2020-12-09
- 实施
- 2021-04-01
Test method for low-frequency noise parameters of optocoupler devices
- ICS
- 31.080.01
- CCS
- L 50
- 发布
- 2020-12-09
- 实施
- 2021-04-01
本文件规定了电动汽车用功率半导体器件可靠性试验前的功能性检查要求，可靠性试验要求和试验 方法。本文件还规定了车用宽禁带功率半导体器件的特殊试验要求。 本文件适用于非绝缘型功率半导体器件和绝缘型功率半导体模块，包括但不限于绝缘栅双极晶体 管、金属氧化物场效应晶体管和二极管器件及模块。 本文件提供了对电动汽车用功率半导体器件进行可靠性型式试验及可靠性设计与检验的指南。
Reliability test methods for power semiconductor devices in electric vehicle applications
- ICS
- 31.080.01
- CCS
- D441
- 发布
- 2020-12-06
- 实施
- 2020-12-15
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-12-01
- 实施
- 2020-12-01
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV) (english version)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-12-01
- 实施
- 2020-12-01
Information of semiconductor devices required for the design of telecommunication equipment applying soft error mitigation measures
- ICS
- 31.080.01
- CCS
- 发布
- 2020-12-00
- 实施
本文件规定了风电变流器用液冷散热器的术语和定义、型号、尺寸及使用条件、基本要求、技术要求、试验方法、检验规则、标志、合格证、包装、运输、贮存和质量承诺。 本文件适用于模块化安装的风电变流器用，热阻在0.01 ℃/W至0.001 ℃/W的液冷散热器（以下简称散热器）。
Liquid-cooled radiators for converter used in wind turbine generator system
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2020-11-30
- 实施
- 2020-12-31
Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2020)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-30
- 实施
- 2020-11-30
General rules for reliability assured digital semiconductor integrated circuits
- ICS
- 31.080.01
- CCS
- 发布
- 20201120
- 实施
- 20201120
Environmental Testing Methods and Endurance Testing Methods for Semiconductor Integrated Circuits
- ICS
- 31.080.01
- CCS
- 发布
- 20201120
- 实施
- 20201120
Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 19: Die shear strength
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-20
- 实施
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-11-16
- 实施
- 2020-11-16
What is BS EN IEC 60749 ‑ 20 about? BS EN IEC 60749 ‑ 20 is the 20th part of semiconductor the multi-series European standard on semiconductor devices. BS EN IEC 60749 ‑ 20 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- 发布
- 2020-10-31
- 实施
- 2020-10-31
IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- 发布
- 2020-10-09
- 实施
- 2021-01-05 (7)
