31.240 电子设备用机械构件 标准查询与下载

GSO IEC 61587-5:2017 电子设备机械结构 IEC 60917 和 IEC 60297 测试 第5部分：底盘、子架和插件的抗震测试

This part of IEC 61587 specifies seismic test requirements for chassis, subracks, and plug-in units as defined in the IEC 60297 and IEC 60917 series. It applies in whole or in part, only to the mechanical structures of chassis, subracks, and plug-in units for electronic equipment, according to the IEC 60297 and IEC 60917 series, and does not apply to electronic components, equipment or systems within the mechanical structures. NOTE Subracks may be an integral part of a chassis (often called in the industry a shelf or a crate). The object of this standard is to establish a level of physical integrity of chassis, subracks, and plug-in units according to IEC 60297 and IEC 60917 series that may provide a level of survivability that will preserve functionality during and after a seismic occurrence. It is intended to provide the user with a high level of confidence in the selection of an equipment practice to meet such needs. Since IEC 60297 and IEC 60917 series chassis, subracks, and plug-in units come in many sizes, weights and mechanical complexities, it is not possible to define a single minimum seismic test requirement for all weight categories. Therefore, overall mass categories are defined in this standard. However, the mass distribution inside a chassis and subrack is considered “application-specific” and herein defined as “intended use”. The single-axis or tri-axis acceleration for the seismic testing is selectable.

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units

GSO IEC 62610-4:2017 电子设备的机械结构 符合 IEC 60297 和 IEC 60917 系列的机柜热管理 第4部分：电子机柜中供水热交换器的冷却性能测试

This part of IEC 62610 specifies the test setup and test parameters for water supplied heat exchangers within single electronic cabinet configurations. The tests are focused on cabinets for the installation of high power dissipation electronic equipment. The cabinets concerned are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard is to provide comparable data for the cooling performance of cabinets according to defined test setups and cooling parameters.

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets

EN 61191-3:2017 印制板组装.第3部分:分规范.通孔安装焊接组装的要求

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

EN 61587-6:2017 电气和电子设备的机械结构 IEC 60917 和 IEC 60297 系列的测试 第6部分：室内机柜的安全方面

IEC 61587-6:2017(E) specifies security aspects and security performance levels of indoor cabinets in accordance with IEC 60917 and IEC 60297. This document intends to clarify the relationship between the installation conditions and the security requirements for indoor cabinets, and to provide the required performances and test methods on mechanical components related with security provisions for indoor cabinets which are in accordance with IEC 60297 series and IEC 60917 series.

Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets

ASTM F18-12(2017) 用于电子器件的玻璃 - 金属接头的评估标准规范和测试方法

1.1 This specification and test method cover acceptance requirements for headers used in electron devices and describes procedures for determining conformance to these requirements. 1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.3 The following safety hazard caveat pertains only to the test method (Sections 7 – 13) described in this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

DIN EN 60191-6-13:2017 半导体装置的机械标准化.第6-13部分:小间距球栅阵列(FBGA)和小间距盘栅阵列(FLGA)用顶部开口型插座的设计指南(IEC 60191-6-13-2016);德文版本EN 60191-6-13-2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016

BS EN 61587-1:2017 电子设备机械结构.用于IEC 60917和IEC 60297标准的试验.机箱,支架,辅助框架和底盘在使用和运输下的耐环境试验,机械试验和安全性方面性能

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series. Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation

IEC 61587-6:2017 电气和电子设备用机械结构. IEC 60917和IEC 60297系列试验. 第6部分: 室内机柜安全方面

This part of IEC 61587 specifies security aspects and security performance levels of indoor cabinets in accordance with IEC 60917 and IEC 60297.

Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets

IEC 61191-3:2017 印刷电路板组件 第3部分:分规范 通孔安装焊接组件的要求

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

EN 61587-1:2017 电子设备的机械结构 IEC 60917 和 IEC 60297 系列的测试 第1部分：机柜、机架、子架和机箱在室内条件下使用和运输的环境要求、测试设置和安全方面

IEC 61587-1:2016: specifies environmental requirements, test set-up, as well as safety aspects for empty enclosures, i.e., cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units under indoor condition use and transportation. The purpose of this standard is to establish defined levels of physical performance in order to meet certain requirements of storage, transport and final location conditions. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units, but it does not apply to electronic equipment. This fourth edition cancels and replaces the third edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: total overhaul of Clause 7 "Mechanical tests" and compatibility with IEC 61587-5. Key words: Indoor use, Transportation Requirements, Cabinets, Racks, Chassis Racks

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation

IEC 62739-3:2017 使用熔融无铅焊料合金的波峰焊设备腐蚀试验方法第3部分:侵蚀试验方法的选择指导

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

GOST R IEC 60917-2-5-2017 电子设备机械结构研制用模数序列. 第2-5部分. 分规格. 25 mm设备接口配合尺寸. 杂项设备的机柜结构尺寸

Modular jrder for the develjpment of mechanical structures for electronic equipment practices. Part 2-5. Sectional specification-interface co-ordination dimentions for the 25 mm equipment practice. Cabinet interface dimentions for miscellaneous equipment

IEC 61587-1:2016 电子设备用机械结构. IEC 60917和IEC 60297系列试验. 第1部分: 机柜, 机架, 插箱和机箱在室内条件下使用和运输的环境要求, 试验设置和安全方面

This part of IEC 61587 specifies environmental requirements, test set-up, as well as safety aspects for empty enclosures, i.e., cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units under indoor condition use and transportation. The purpose of this standard is to establish defined levels of physical performance in order to meet certain requirements of storage, transport and final location conditions. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units, but it does not apply to electronic equipment.

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation

BS EN 62610-5:2016 电气和电子设备用机械结构. 依据IEC 60297和IEC 60917系列的机柜热管理. 室内机柜的冷却性能评估

Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Cooling performance evaluation for indoor cabinets

EN 62610-5:2016 电气和电子设备的机械结构 符合 IEC 60297 和 IEC 60917 系列的机柜热管理 第5部分：室内机柜的冷却性能评估

IEC 62610-5:2016 specifies a method for evaluating the cooling capacity mainly for air convection cooling of empty cabinets in accordance with IEC 60297 and IEC 60917 series. The purpose of this standard is to classify the cooling methods of empty indoor cabinets, to simplify the thermal hydraulic formulae for the evaluation and classification of cabinet cooling performances, and to exemplify the cooling performances for representative cabinet sizes based on IEC 60917 or IEC 60297. This enables the users to select the appropriate cabinet cooling solutions for their applications. Key words: Indoor cabinets, Thermal management, Cooling performance

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets

IEC 62610-5:2016 电气和电子设备的机械结构 - 符合Iec 60297和Iec 60917系列的机柜热管理 - 第5部分:室内机柜的冷却性能评估

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor ca

DIN EN 61837-3:2016 频率控制和选择用表面安装的压电器件.标准外形和终端引线的连接.第3部分:金属封装(IEC 61837-3-2015).德文版本EN 61837-3-2015

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015

BS EN 60297-3-109:2016 电气设备和电子设备的机械结构. 482.6 mm (19 in) 系列的机械结构尺寸. 嵌入式计算设备用机箱的尺寸

Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of chassis for embedded computing devices

EN 60297-3-109:2016 电气和电子设备的机械结构 482 6 毫米（19 英寸）系列机械结构的尺寸 第 3-109 部分：嵌入式计算设备机箱的尺寸

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482@6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices

DIN EN 61837-4:2016 频率控制和选择用表面安装的压电器件.标准外形和端头连接.第4部分:混合外壳的外形 (IEC 61837-4-2015);德文版本EN 61837-4-2015

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2015); German version EN 61837-4:2015