31.240 电子设备用机械构件 标准查询与下载

BS EN 60297-3-108:2015 电子设备的机械结构 482.6毫米（19英寸）系列机械结构的尺寸 R型插框和插入式单元的尺寸

Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of R-type subracks and plug-in units

EN 60297-3-108:2015 电子设备的机械结构 482.6 毫米（19 英寸）系列机械结构的尺寸 第 3-108 部分：R 型子架和插入式单元的尺寸

IEC 60297-3-108:2014 provides dimensions and features for R-type subracks and plug-in units, i.e. ruggedized variants of the mechanical structures of the 482,6 mm (19 in) series, with enhanced vibration and shock resistance and/or improved EMC performance, for use in more harsh environment. This leads to a subrack standard which is externally compatible with IEC 60297-3-100 but internally largely incompatible with IEC 60297-3-101. R-type subracks, chassis integrated subracks and plug-in units incorporate dimensions and features which provide for a higher level of ruggedness, compared with IEC 60297-3-101 (test set-up and load definitions are selected from IEC 61587-1 and IEC 61587-5). Key words: R-Type, Subracks, Plug-in unit

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units

GOST R IEC 61587-2-2015 电子设备的机械结构. IEC 60917和IEC 60297的试验. 第2部分. 机柜的地震试验

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Part 2. Seismic tests for cabinets

GOST R IEC 61969-3-2015 电子设备的机械结构. 户外机壳. 第3部分. 环保需求问题, 试验和安全

Mechanical structures for electronic equipment. Outdoor enclosures. Part 3. The environmental demands concern, testing and safety

GSO IEC 60286-1:2014 自动交易元件包装 第1部分：连续带上同轴引线元件的带式包装

This standard applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.

Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

GSO IEC/TS 62610-2:2014 电子设备的机械结构 符合 IEC 60297 系列和 IEC 60917 系列的机柜热管理 第2部分：设计指南：指定强制风冷结构的方法

This part of IEC 62610 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This design guide contains the following: a) Thermal interfaces of subrack and/or chassis based equipment in a cabinet • Reference temperature • Preferred airflow conditions • Airflow volume conditions • Standard air b) Procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions The drawings used are not intended to indicate product design. They are only explanatory indications for determining forced air-cooling structure. The terminology used complies with IEC 60917-1.

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure

GSO IEC 61760-1:2014 表面贴装技术 第1部分：表面贴装元件 (SMD) 规范的标准方法

This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

GSO IEC 61191-4:2014 印制板组件 第4部分：分规范 端部焊接组件的要求

This standard prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

GSO IEC 61191-3:2014 印制板组件 第3部分：分规范 孔装焊接组件的要求

This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

GSO IEC 60286-4:2014 自动交易元件的包装 第4部分：封装在各种形状封装中的电子元件的粘合缓冲垫

This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components.

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

GSO IEC/TS 62454:2014 电子设备机械结构设计指南：国际标准IEC 60297和IEC 60917系列电子设备的接口尺寸和水冷要求

This technical specification provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets have been regarded from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. As the cooling performance is in direct relation to volume flows and temperatures of air and water, cooling performance guidelines are provided for two structural interface levels – Interface level 1 and 2 – of equipment built into cabinets. The third interface level is only described by main interfaces, but without detailed dimensions and without cooling performance guidelines. This interface needs very complex details for the ducting of water supply within the cabinet and down to the component heat sinks on boards within subracks. Therefore, only the principle is shown usable for individual design solutions

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

GSO IEC 60286-3:2014 自动处理元件的包装 第3部分：连续胶带上表面贴装元件的包装

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips)

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

DIN EN 61587-5:2014 电子设备的机械结构. IEC 60917和IEC 60297的试验. 第5部分: 底盘, 插箱和插件的地震试验 (IEC 61587-5-2013); 德文版本EN 61587-5-2014

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013); German version EN 61587-5:2014

DIN EN 60191-4:2014 半导体器件机械标准化.第4部分:半导体器件封装外壳形状编码系统和分类(IEC 60191-4-2013).德文版本EN 60191-4-2014

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014

IEC 60297-3-108:2014 电子设备的机械结构. 482.6 mm (19 in) 系列机械结构的尺寸. 第3-108部分: R型插箱和插件的尺寸

This part of IEC 60297 provides dimensions and features for R-type subracks and plug-in units@ i.e. ruggedized variants of the mechanical structures of the 482@6 mm (19 in) series@ with enhanced vibration and shock resistance and/or improved EMC performance@ for use in more harsh environment. This leads to a subrack standard which is externally compatible with IEC 60297-3-100 but internally largely incompatible with IEC 60297-3-101. R-type subracks@ chassis integrated subracks and plug-in units incorporate dimensions and features which provide for a higher level of ruggedness@ compared with IEC 60297-3-101 (test set-up and load definitions are selected from IEC 61587-1 and IEC 61587-5).

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units

NF C93-471-5*NF EN 61587-5:2014 电子设备的机械结构. IEC 60917和IEC 60297的试验. 第5部分: 底盘, 子架, 和插入式部件的地震试验

La présente partie de la CEI 61587 spécifie les exigences d'essai sismique pour les châssis, les bacs et les unités enfichables tels que définis dans les séries CEI 60297 et CEI 60917.Elle s'applique, en tout ou en partie, seulement aux structures mécaniques des châssis, des bacs et des unités enfichables pour les équipements électroniques, conformément aux séries CEI 60297 et CEI 60917, et ne s'applique pas aux équipements ou systèmes électroniques, aux équipements ou aux systèmes qui se trouvent à l'intérieur de ces structures mécaniques.

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5 : seismic tests for chassis, subracks, and plug-in units

BS EN 61587-5:2014 电子设备的机械结构. IEC 60917和IEC 60297的试验. 底盘, 子架, 和插入式部件的地震试验

Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Seismic tests for chassis, subracks and plug-in units

DIN EN 62610-4:2014 电子设备用机械结构. 依据IEC 60297和IEC 60917系列的机柜热管理. 第4部分: 电子机柜供水换热器的散热性能试验(IEC 62610-4-2013); 德文版本EN 62610-4-2013

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German ver

EN 61587-5:2014 电子设备的机械结构 IEC 60917 和 IEC 60297 的测试 第5部分：机箱、子架和插件单元的抗震测试

IEC 61587-5:2013 specifies seismic test requirements for chassis, subracks, and plug-in units as defined in the IEC 60297 and IEC 60917 series. It applies in whole or in part, only to the mechanical structures of chassis, subracks, and plug-in units for electronic equipment, according to the IEC 60297 and IEC 60917 series, and does not apply to electronic components, equipment or systems within the mechanical structures. The object of this standard is to establish a level of physical integrity of chassis, subracks, and plug-in units according to IEC 60297 and IEC 60917 series that may provide a level of survivability that will preserve functionality during and after a seismic occurrence. It is intended to provide the user with a high level of confidence in the selection of an equipment practice to meet such needs. Since IEC 60297 and IEC 60917 series chassis, subracks, and plug-in units come in many sizes, weights and mechanical complexities, it is not possible to define a single minimum seismic test requirement for all weight categories. Therefore, overall mass categories are defined in this standard. However, the mass distribution inside a chassis and subrack is considered 'application-specific' and herein defined as 'intended use'. Key words: chassis, subracks, plug-in units, seismic tests

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units

KS C IEC 61969-2-2-2014 电子设备机械结构 户外外壳 第2 2部分：详细规范 外壳尺寸

Mechanical structures for electronic equipment－Outdoor enclosures－Part 2－2：Detail specification－Dimensions for cases