共找到 224 条与 标准化、质量管理 相关的标准,共 15 页
Boiler and Pressure Vessel.Section II: Part D - Properties (Customary) Due July 2004
Section II: Part D - Properties (Customary) Due July 2004
Boiler and Pressure Vessel.Section II: Part B - Nonferrous Material Specifications Due July 2004
Section II: Part B - Nonferrous Material Specifications Due July 2004
IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing
Liquid Flux Activity, Wetting Balance Method Revision A
aterial in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Fluoride Concentration, Fluxes - Quanitative Revision A
This standard establishes requirements and other considerations
Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods Revision A
Information flow is essential to efficient electronics manufacturing and standards are essential to information flow. One area of commerce that has lacked its own communication standards is the electronics manufacturing factory floor. Information exchange between a system of electronic assembly equipment and higher-level applications has, in the past, used proprietary or borrowed standards. The IPC-254X and IPC-255X series of standards address this issue by defining the messages needed for this information exchange.
Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms Revision A
aterial in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Fluorides by Spot Test, Fluxes - Qualitative Revision A
This document is presented to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards without embedded components (i.e., resistors, capacitors, etc.).
Moisture and Insulation Resistance, Printed Boards Revision F
IPC Standards and Publications are designed to serve the public interest through
Microsectioning, Manual Method Revision E
Because of a need for technical information, and to develop standards in the field
Tensile Strength and Elongation, In-House Plating Revision A
It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closer to meeting each others needs.
Rework Simulation, Plated-Through Holes for Leaded Components Revision C
T?m? dokumentti kuvaa tavoiteltavat, hyv?ksytt?v?t ja poikkeavat joko sis?isesti tai ulkoisesti piirilevyiss? havaittavat olosuhteet. Samalla se esitt?? visuaalisen tulkinnan erilaisille piirilevym??rittelyille asetetuista v?himm?isvaatimuksista, kuten IPC-6010 -sarja, ANSI/J-STD-003 jne. 1.2
Thermal Stress, Plated-Through Holes Revision E
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
Outgassing, Printed Boards Revision B
IPC Standards and Publications are designed to serve the public interest through
Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate) Revision A
Characteristic Impedance of Lines on Printed Boards by TDR Revision A
Characteristic Impedance of Lines on Printed Boards by TDR Revision A
Zinc di--alkyl dithio--phosphate (ZnDTP) compounds are widely used in engine and transmission oils both as anti--oxidants and as anti--wear additives. However, recent work has shown that many anti--wear additives appear to have a detrimental effect on the resistance of gears and other contacting components to various types of rolling contact fatigue, including micropitting. In the present paper we examined the effect of the presence of a secondary C6 ZnDTP in a low viscosity synthetic base oil on the resistance to micropitting and wear of carburised steel rollers, using a triple--contact disk tester. It was found that the additive caused severe micropitting and associated wear, whereas the pure base oil did not give rise to any micropitting. It was further found that the additive was not detrimental unless it was present during the first 100 000 cycles of the test when it was found to exert a strong effect on the development of roughness on the counter--rollers. It is concluded that the additive is detrimental to micropitting resistance because it retards wear--in of the contact surfaces, favouring the development of damaging fatigue cracks. This contrasts with some earlier speculation that suggested a direct chemical effect could be responsible.
The Effect of a ZnDTP Anti--wear Additive on Micropitting Resistance of Carburised Steel Rollers
Boiler and Pressure Vessel.Appendix A - Nonmandatory Acceptable ASTM Editions
Appendix A - Nonmandatory Acceptable ASTM Editions
As the requirements for companies to manufacture their prodinu cctl ean environments increase,
Reporting, Format Revision A
As the requirements for companies to manufacture their prodinu cctl ean environments increase,
Introduction Revision C
As the requirements for companies to manufacture their prodinu cctl ean environments increase,
Reporting, Invalid Test Results Revision A
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