JEDEC JESD51-31-2008
用于多片包装的热试验环境改善
Thermal Test Environment Modifications for MultiChip Packages
- 标准号
- JEDEC JESD51-31-2008
- 发布
- 2008年
- 发布单位
- (美国)固态技术协会,隶属EIA
- 引用标准
- JEDEC JESD51 JEDEC JESD51-1 JEDEC JESD51-2 JEDEC JESD51-3 JEDEC JESD51-4 JEDEC JESD51-5 JEDEC JESD51-6
- 适用范围
- This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, “Guideline to Support Effective Use of MCP Thermal Measurements” which is being prepared.