L10 电子元件综合 标准查询与下载

IEC 107/144/DTS:2011 IEC/TS 62564-1,版本2:航空航天合格的电子元件(AQEC).第1部分:集成电路和分立元件

IEC/TS 62564-1, Ed. 2: Aerospace qualified electronic component (AQEC) - Part 1: Integrated circuits and discrete semiconductors

ANSI/EIA 649-B:2011 配置管理标准

Overall review of the existing Std for shortcomings noted during creation of the Handbook 649 and a number of new issues that have been brought forward after release of Rev. A

Configuration Management Standard

ANSI/EIA 960-A:2011 货盘组件装配.ACT

Covers requirements for Assepmbly Component Trays - ACTs used during automated assembly processes.

Assembly Component Tray- ACT

ASTM F1190-11 无偏电子元件中子辐照的标准指南

Semiconductor devices can be permanently damaged by reactor spectrum neutrons (1, 2) . The effect of such damage on the performance of an electronic component can be determined by measuring the component’s electrical characteristics before and after exposure to fast neutrons in the neutron fluence range of interest. The resulting data can be utilized in the design of electronic circuits that are tolerant of the degradation exhibited by that component. This guide provides a method by which the exposure of silicon and gallium arsenide semiconductor devices to neutron irradiation may be performed in a manner that is repeatable and which will allow comparison to be made of data taken at different facilities. For semiconductors other than silicon and gallium arsenide, applicable validated 1-MeV damage functions are not available in codified National standards. In the absence of a validated 1-MeV damage function, the non-ionizing energy loss (NIEL) or the displacement kerma, as a function incident neutron energy, normalized to the response in the 1 MeV energy region, may be used as an approximation. See Practice E722 for a description of the method used to determine the damage functions in Si and GaAs (3).1.1 This guide strictly applies only to the exposure of unbiased silicon (Si) or gallium arsenide (GaAs) semiconductor components (integrated circuits, transistors, and diodes) to neutron radiation from a nuclear reactor source to determine the permanent damage in the components. Validated 1-MeV displacement damage functions codified in National Standards are not currently available for other semiconductor materials. 1.2 Elements of this guide, with the deviations noted, may also be applicable to the exposure of semiconductors comprised of other materials except that validated 1-MeV displacement damage functions codified in National standards are not currently available. 1.3 Only the conditions of exposure are addressed in this guide. The effects of radiation on the test sample should be determined using appropriate electrical test methods. 1.4 This guide addresses those issues and concerns pertaining to irradiations with reactor spectrum neutrons. 1.5 System and subsystem exposures and test methods are not included in this guide. 1.6 This guide is applicable to irradiations conducted with the reactor operating in either the pulsed or steady-state mode. The range of interest for neutron fluence in displacement damage semiconductor testing range from approximately 109 to 1016 1-MeV n/cm2. 1.7 This guide does not address neutron-induced single or multiple neutron event effects or transient annealing. 1.8 This guide provides an alternative to Test Method 1017.3, Neutron Displacement Testing, a component of MIL-STD-883 and MIL-STD-750. The Department of Defense has restricted use of these MIL-STDs to programs existing in 1995 and earlier. 1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Guide for Neutron Irradiation of Unbiased Electronic Components

DIN EN 61760-3:2010 表面安装技术.第3部分:通孔回流(THR)焊接用组件规范的标准方法(IEC 61760-3-2010).德文版本EN 61760-3-2010

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010

IEC 113/100/PAS:2010 纳米制造.材料规范.第2-1部分:单层奈米碳管.空白详细规范

Nanomanufacturing - Material specifications - Part 2-1: Single-wall carbon nanotubes - Blank detail specification

NF C90-710-3*NF EN 61760-3:2010 表面安装技术.第3部分:通孔回流(THR)焊接用元部件规格的标准方法

Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering.

BS EN 61760-3:2010 表面安装技术.通孔回流(THR)焊接用组件规范的标准方法

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering

IECQ 02-2010 电子组件IEC质量评定体系(IECQ体系).程序规则.IECQ体系验收IECQ认证机构用通用要求

IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - General Requirements for the Acceptance of IECQ Certification Bodies into the IECQ System

JIS C 62137-1-2:2010 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验

Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test

JIS C 62137-1-1:2010 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-1部分:拉拔强度试验

Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test

JIS C 5005-2:2010 质量评估系统.第2部分:电子元件和包装件检验用抽样检验方案的选择和使用

Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages

JIS C 0806-3:2010 自动处理用元件的包装.第3部分:连续传送带上表面装配元件的包装

This Standard is applicable to the tape packaging of electronic components used for automatic handling without leads or with lead stumps which are intended to be connected to electronic circuits.

Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

IEC 61760-3:2010 表面贴装技术.第3部分:通孔回流(THR)焊接用组件规范的标准方法

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

ANSI/SCTE 147-2010 75 ohm内联衰减器规格

Specification for 75 ohm Inline Attenuators

DIN EN 62137-1-5:2010 表面贴装技术.表面贴装焊接接点用环境及疲劳试验方法.第1-5部分:机械剪切疲劳试验(IEC 62137-1-5-2009).德文版本EN 62137-1-5-2009

The test method described in this part of IEC 62137 applies to area array packages, such as BGA.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009

ANSI/IEEE C57.12.30:2010 杆式安装设备标准.沿海环境用外壳集成

This standard covers conformance tests and requirements for the enclosure integrity of pole-mounted equipment for installations in coastal environments, containing apparatus energized in excess of 600v, typically not accessible to the general public, such as but not limited to the following types of equipment: pole-mounted distribution transformers, pole-mounted switches, pole-mounted regulators, pole-mounted metering equipment, pole-mounted reclosers/sectionalizers, pole-mounted capacitors.

Standard for Pole-Mounted Equipment - Enclosure Integrity for Coastal Environments

GJB 360B-2009 电子及电气元件试验方法

本标准规定了电子及电气元件的基本环境、物理性能和基本电性能等方面的通用试验方法。 本标准适用于电阻器、电容器、电感器、电连接器、开关、继电器和变压器等电子及电气元件。如无特殊规定，本标准仅适用于重量小于136kg或试验电压低于50000V(有效值)的电子及电气元件。

Test methods for electronic and electrical component pasrts

KS C IEC 61193-2:2009 质量评估系统.第2部分:电子元件和包装件检验用抽样检验方法的选择和使用

KS C IEC 61193 중 이 표준은 전자부품 및 인쇄회로기판의 검사시에 따른 전자적

Quality assessment systems-Part 2:Selection and use of sampling plans for inspection of electronic components and packages

KS C IEC 61760-2:2009 表面安装技术.第2部分:表面安装元件(SMD)的运输和存储条件.使用指南

이 표준은 표면실장부품(SMD)의 운송 및 보관조건에 대한 요구사항을 규정하고 있다. SM

Surface mounting technology-Part 2:Transportation and storage conditions of surface mounting devices(SMD)-Application guide