L40 半导体分立器件综合 标准查询与下载
共找到 1197 条与 半导体分立器件综合 相关的标准，共 80 页
This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead- packages (SOJ), package outline form E in accordance with IEC 60191-4.
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-08
- 实施
- 2010-09-01
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German ver
- ICS
- 01.100.25;31.240
- CCS
- L40
- 发布
- 2010-08
- 实施
- 2010-08-01
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
- ICS
- 31.080.99
- CCS
- L40
- 发布
- 2010-08
- 实施
This standard describes a method for conventional constant current electromigration testing of metal lines, via string and contacts.
Semiconductor devices - Constant current electromigration test
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-07-31
- 实施
- 2010-07-31
AMENDMENT 1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-07
- 实施
- 2010-12-01
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
- ICS
- 31.080.01;31.220.01
- CCS
- L40
- 发布
- 2010-07
- 实施
- 2010-07-01
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- ICS
- 01.100.25;31.240
- CCS
- L40
- 发布
- 2010-07
- 实施
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-06-30
- 实施
- 2010-06-30
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
- ICS
- 01.100.25;31.240
- CCS
- L40
- 发布
- 2010-06
- 实施
- 2010-06-01
Load test of a bolt-clamped Langevin vibrator using wattmeter method
- ICS
- 31.080.99
- CCS
- L40
- 发布
- 2010-05-20
- 实施
This standard describes a method for conventional constant current electromigration testing of metal lines, via string and contacts.
Semiconductor devices - Constant current electromigration test
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-05
- 实施
- 2010-05-21
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
Semiconductor devices - Part 1: General
- ICS
- 31.080;31.200
- CCS
- L40
- 发布
- 2010-05
- 实施
- 2010-08-24
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- ICS
- 01.100.25;31.080.01;31.240
- CCS
- L40
- 发布
- 2010-05
- 实施
Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- ICS
- 31.080.99
- CCS
- L40
- 发布
- 2010-04-30
- 实施
- 2010-04-30
Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- ICS
- 31.080.99
- CCS
- L40
- 发布
- 2010-04-30
- 实施
- 2010-04-30
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- ICS
- 01.100.25;31.240
- CCS
- L40
- 发布
- 2010-04-30
- 实施
- 2010-04-30
This test method provides a means of assessing the resistance to soldering heat of plastic encapsulated surface mount devices (SMDs). This test is destructive.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-04
- 实施
- 2010-04-01
This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. This standard is applicable for reliability investigation and qualification of semiconductor process.
Semiconductor devices - Metallization stress void test
- ICS
- 25.220.40;31.080.01
- CCS
- L40
- 发布
- 2010-04
- 实施
- 2013-07-03
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
- ICS
- 31.240
- CCS
- L40
- 发布
- 2010-02
- 实施
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Semiconductor devices - Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2010-01-31
- 实施
- 2010-01-31
