L56 半导体集成电路 标准查询与下载

BS IEC 60748-2-20:2008 半导体器件.集成电路.数字集成电路.类规范.低压集成电路

Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits

DIN EN 62132-3:2008 集成电路.150kHz～1GHz电磁兼容性的测量.第3部分:大容量电流注入(BCI)法(IEC 62132-3-2007)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007); German version EN 62132-3:2007

IEC 60748-2-20:2008 半导体器件.集成电路.第2-20部分:数字集成电路.系列规范.低压集成电路

This standard aims at giving DC interface specifications for various sets of values, where each comprises the nominal value of power supply voltage, its tolerance, and the worst-case limit values of the input and output voltages for low voltage integrated circuits. It also provides two categories of interface specification for each nominal supply voltage – normal range and wide range. The normal range is based on the nominal industry standard with typical tolerance of about 10 %. The wide range covers battery operation that extends the lower limit to a practical value at which the battery will continue to operate.

Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

NF C96-261-3:2008 集成电路.150KHz～1GHz电磁抗扰度的测量.第3部分:大容量电流注入(BCI)法

Integrated circuits - Measurement of electromagnetic immunity, 150 KHz to 1 GHz - Part 3 : Bulk Current Injection (BCI) method.

IEC 60747-16-2:2008 半导体器件.第16-2部分:微波集成电路.频率预定标器

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency prescalers.

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

BS IEC 62528:2007 嵌入式基于芯片的集成电路的标准可试性方法

Standard testability method for embedded core-based integrated circuits

BS DD IEC/TS 62215-2:2007 集成电路.脉冲抗扰度的测量.同步瞬时注射法

IEC/Ts 62215-2，which is a technical specification，contains general information and definitions on the test method to evaluate the immunity of integrated circuits(ICs)against fast conducted synchronous transient disturbances．This information is followed by a description of measurement conditions，test equipment and test set—up as well as the test procedures and the requirements on the content of the test report． the objective of this technical specification is to describe general conditions to obtain a quantitative measure of immunity of ICs establishing a uniform testing environment．Critical parameters that are expected to influence the test results are described．Deviations from this specification should be explicitly noted in the individual test report． this synchronous transient immunity measurement method，as described in this specification． uses short impulses with fast rise times of different amplitude，duration and polarity in a conductive mode to the IC．In this method，the applied impulse should be synch ronized with the activity of the IC to make sure that controlled and reproducible conditions can be assured．

Integrated circuits - Measurement of impulse immunity - Synchronous transient injection method

BS EN 62132-3:2007 集成电路.150 kHz～1 GHz电磁抗扰性的测量.大容量电流注入(BCI)法

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) method

IEC 62528:2007 嵌入式基于芯片的集成电路用标准可试性方法

IEEE Std 1500 has developed a standard design-for-testability method for integrated circuits (ICs) containing embedded nonmergeable cores. This method is independent of the underlying functionality of the IC or its individual embedded cores. The method creates the necessary requirements for the test of such ICs, while allowing for ease of interoperability of cores that may have originated from different sources.

Standard testability method for embedded core-based integrated circuits

ANSI/VITA 46.1-2007 VITA 46用VME总线信号绘图

The objective of this standard is to supplement the VITA 46 base standard with the definition for the VMEbus signals as mapped to a VITA 46 connector.

VMEbus Signal Mapping for VITA 46

JIS X 6320-11:2007 识别卡.集成电路板.第11部分:使用生物统计法的个人认证

この規格は，ICカード内のバイオメトリック情報を用いた本人確認で使用される，セキュリティ関連の産業間共通コマンドについて規定する。この規格はまた，パイオメトリック参照データの運搬媒体として，及び個人のバイオメトリック照合(カード内マッチング*)を実行する機器として。カードを使用するための，データ構造及びデータ利用方式を規定する。ただし，バイオメトリック情報による人物の識別(1対N照合)は除外する。

Identification cards -- Integrated circuit cards -- Part 11: Personal verification through biometric methods

IEC TS 62215-2:2007 集成电路.脉冲抗扰度的测量.第2部分:同步瞬时注射法

IEC/Ts 62215-2，which is a technical specification，contains general information and definitions on the test method to evaluate the immunity of integrated circuits(ICs)against fast conducted synchronous transient disturbances．This information is followed by a description of measurement conditions，test equipment and test set—up as well as the test procedures and the requirements on the content of the test report． the objective of this technical specification is to describe general conditions to obtain a quantitative measure of immunity of ICs establishing a uniform testing environment．Critical parameters that are expected to influence the test results are described．Deviations from this specification should be explicitly noted in the individual test report． this synchronous transient immunity measurement method，as described in this specification． uses short impulses with fast rise times of different amplitude，duration and polarity in a conductive mode to the IC．In this method，the applied impulse should be synch ronized with the activity of the IC to make sure that controlled and reproducible conditions can be assured．

Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

IEC 62132-3:2007 集成电路.150kHz～1GHz电磁抗扰性的测量.第3部分:大容量电流注入(BCI)法

This part of IEC 621 32 describes a bulk current injection(BCI)test method to measure the immunity of integrated circuts(IC) in the presence of conducted RF disturbances，e．g． resulting from radiated RF disturbances．This method only applies to ICs that have off-board Wire connections e. g．into a cable harness．This test method is used to inject RF current on one or a combjnation of wires． This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals．

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

DLA SMD-5962-02553 REV A-2007 28V单信道线性混合微电路直流/直流转换器

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534.

MICROCIRCUIT, HYBRID, LINEAR, 28 VOLT, SINGLE CHANNEL, DC/DC CONVERTER

DLA SMD-5962-01536 REV D-2007 单片硅数字线性微电路八进制数400 MBPS总线LVDS中继器

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).

MICROCIRCUIT, DIGITAL-LINEAR, OCTAL 400 MBPS BUS LVDS REPEATER, MONOLITHIC SILICON

DLA SMD-5962-92347 REV D-2007 硅单片,装有锁存器的稳压器,高速线性微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN

MICROCIRCUIT, LINEAR, HIGH SPEED, VOLTAGE COMPARATOR WITH LATCH, MONOLITHIC SILICON

DLA SMD-5962-88711 REV A-2007 硅单片开放电极输出8位身份比较器肖特基TTL促进数字微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTKY, 8-BIT IDENTITY COMPARATOR WITH OPEN COLLECTOR OUTPUTS, MONOLITHIC SILICON

DLA SMD-5962-06233 REV A-2007 硅单片LVTTL兼容输入输出,最小偏斜1-8时钟脉冲驱动器,低压氧化物半导体耐辐射数字微型电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL, RADIATION HARDENED, LOW VOLTAGE CMOS, MINIMUM SKEW ONE-TO-EIGHT CLOCK DRIVER, LVTTL COMPATIBLE INPUTS AND OUTPUTS, MONOLITHIC SILICON

DLA SMD-5962-02552 REV A-2007 15V单信道线性混合微电路直流/直流转换器

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534.

MICROCIRCUIT, HYBRID, LINEAR, 15 VOLT, SINGLE CHANNEL, DC/DC CONVERTER

DLA SMD-5962-88695 REV B-2007 硅单片2输入与非驱动器低功率肖特基TTL促进双极化数字微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, 2-INPUT AND DRIVERS, MONOLITHIC SILICON