L90 电子技术专用材料 标准查询与下载

BS EN 62610-4:2013 电子设备机械结构.遵循IEC 60297和IEC 60917系列标准的机柜热量管理.电子机箱中供水系统热交换器冷却性能试验

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Cooling performance tests for water supplied heat exchangers in electronic cabinets

SJ/T 11197-2013 环氧塑封料

本标准规定了微电子工业用环氧塑封料的分类,要求,试验方法,检验规则及标志、包装、运输和贮存。本标准适用于微电子工业中封装分立器件、中小规模集成电路、大规模集成电路、超大规模集成电路和特大规模集成电路等用环氧塑封料。

Epoxy molding compound

SJ/T 11140-2012 铝电解电容器用电极箔

本标准规定了铝电解电容器用电极箔的型号命名、要求、试验方法、检验规则、包装、贮存、运输、标志。 本标准适用于铝电解电容器用的电极箔(包括：阴极箔、阳极未形成箔、阳极形成箔)。

Electrode foil for aluminum electrolytic capacitor

ITU-T K.94-2012 (预发布)为融合终端设备性能退化评价的互扰试验法

With the rapid progress of the telecommunication terminal technology, more and more converged devices are appearing on the market. As the modules of the converged devices are so close together,if the printed circuit board (PCB) is not designed properly, without adequate earthing,shielding or filtering,an electromagnetic compatibility (EMC) disturbance can occur between the modules.Recommendation ITU-T K.94 analyses the EMC disturbance between different modules in converged terminal devices and defines a conducted test method. This mutual-disturbance test can be used as one of the immunity test items listed in Recommendation ITU-T K.34 and Recommendation ITU-T K.48 to determine the level of performance degradation.

Mutual disturbance test method for evaluating performance degradation of converged terminal devices (Study Group 5)

SJ/T 11411-2010 铜包钢线

本标准规定了铜包钢线的分类、型号、要求、试验方法、检验规则、包装、标志、运输和贮存。本标准适用于同轴电缆内导体、电话通信线、电力工业及电子产品用圆形铜包钢线。

Copper-clad steel wire

SJ/T 11389-2009 无铅焊接用助焊剂

本标准规定了无铅焊接用助焊剂的分类、技术要求、检验方法、检测规则以及产品的标识、包装、运输、贮存等。 本标准主要适用于电子信息产品无铅焊接用助焊剂。

Fluxes for lead-free soldering application

SJ/T 11397-2009 半导体发光二极管用荧光粉

本标准规定了半导体发光二级管用荧光粉相关的名词术语及其定义,还规定了半导体发光二极管用铝酸盐和硅酸盐荧光粉的要求、试验方法、检验规则及标志、包装、运输和贮存要求。

Phosphors for light emitting diodes

SJ/T 11391-2009 电子产品焊接用锡合金粉

本标准规定了电子产品焊接用锡合金粉的技术要求、试验方法、检验规则以及包装、标识、运输和贮存。 本标准适用于电子产品焊接用锡合金粉。

Solder powder for electronic soldering applications

SJ/T 11390-2009 无铅焊料试验方法

本标准规定了无铅焊料的熔化温度、机械拉伸、扩展、润湿、焊点拉伸与剪切、QFP引线焊点45°拉伸、片式元件焊点剪切和焊料动态氧化出渣量的试验方法。 本标准适用于锡基无铅焊料。

Test method for lead-free solders

SJ/T 11186-2009 焊锡膏通用规范

本标准规定了焊锡膏的术语和定义、要求、试验方法、检测规则、标志、包装、运输及贮存。 本标准适用于电子产品焊接用锡膏。

General specification for solder paste

SJ/T 11392-2009 无铅焊料.化学成分与形态

本标准规定了无铅焊料技术要求、测试方法、检验规则以及包装、标志、运输和贮存。 本标准适用于无铅焊料。

Lead-free solders-Chemical compositions and forms

ASTM F1843-09 抛光光泽测量用透明塑料薄膜的样品制备的标准指南

Gloss measurements are used to qualify a raw material or finished product. Sample preparation will effect the outcome of gloss readings. This practice will eliminate second surface reflection, and allow a more accurate gloss reading of the substrate. Materials which require this preparation include the following: clear or translucent substrates, colored transparent substrates, and areas printed with clear, translucent, or transparent colored coatings.1.1 This practice covers the method of sample preparation, prior to taking gloss measurements on a membrane switch overlay. 1.2 Typical applications include window display areas on a graphic overlay, and surface texture. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Sample Preparation of Transparent Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements

ASTM F1710-08 应用高质量分辩率辉光放电质谱计测定电子级钛中微量金属杂质的标准试验方法

This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon between the parties concerned. This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in pure titanium. The objective is to improve laboratory to laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data. For most metallic species the detection limit for routine analysis is on the order of 0.01 weight ppm. With special precautions detection limits to sub-ppb levels are possible. This test method may be used as a referee method for producers and users of electronic-grade titanium materials.1.1 This test method covers the determination of concentrations of trace metallic impurities in high purity titanium. 1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS). 1.3 The titanium matrix must be 99.9 weight % (3N-grade) pure, or purer, with respect to metallic impurities. There must be no major alloy constituent, for example, aluminum or iron, greater than 1000 weight ppm in concentration. 1.4 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment skillfully used by an experienced operator is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of sensitivity limits, etc.) known by the responsible technical committee to effect the reliability of high purity titanium analyses. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer

ASTM F1845-08 用高质量减少辉光放电质谱仪测量电子级铝铜、铝硅和铝铜硅中微量金属杂质的标准试验方法

This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon between the parties concerned. This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in aluminum-copper, aluminum-silicon, and aluminum-copper-silicon alloys. The objective is to improve laboratory-to-laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data. For most metallic species the detection limit for routine analysis is on the order of 0.01 wt. ppm. With special precautions, detection limits to sub-ppb levels are possible. This test method may be used as a referee method for producers and users of electronic-grade aluminum-copper, aluminum-silicon and aluminum-copper-silicon materials.1.1 This test method determines the concentrations of trace metallic impurities in high purity (99.99 wt. % pure, or purer, with respect to metallic trace impurities) aluminum-copper, aluminum-silicon and aluminum-copper-silicon alloys with major alloy constituents as follows: aluminumGreater than 95.0 % copperLess or equal than 5.0 % siliconLess or equal than 5.0 % 1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS). 1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of detection limits, etc.) known by the responsible technical committee to effect the reliability of high purity aluminum analyses. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer

ASTM F1593-08 应用高质量分辩率辉光放电质谱计测定电子级铝中微量金属杂质的标准试验方法

This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon by the parties concerned. This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in pure aluminum. The objective is to improve laboratory to laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data. For most metallic species the detection limit for routine analysis is on the order of 0.01 weight ppm. With special precautions detection limits to sub-ppb levels are possible. This test method may be used as a referee method for producers and users of electronic-grade aluminum materials.1.1 This test method covers measuring the concentrations of trace metallic impurities in high purity aluminum. 1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS). 1.3 The aluminum matrix must be 99.9 weight % (3N-grade) pure, or purer, with respect to metallic impurities. There must be no major alloy constituent, for example, silicon or copper, greater than 1000 weight ppm in concentration. 1.4 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment skillfully used by an experienced operator is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of sensitivity limits, etc.) known by the responsible technical committee to affect the reliability of high purity aluminum analyses. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer

SJ/T 11369-2007 电子玻璃技术数据

本标准规定了电子玻璃的分类、各类电子玻璃的化学组成、理化性能及其对应的检验方法等。 本标准适用于相应各类电子玻璃。

Electronic glass technical data

IPC TM-650 2.5.5.13-2007 使用分体式气缸谐振器的相对介电常数和损失正切

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator

KS C 5112-2005 电子设备环境要求

이 규격은 전자 기기(이하 기기라 한다.)에 관한 환경 조건의 분류에 대하여 규정한다.

Environmental requirements for electronic equipments

IPC TM-650 2.5.5.10-2005 确定嵌入式被动材料介电常数和损失正切的高频率测试

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials

SJ/T 11319-2005 锡焊料动态条件氧化渣量定量试验方法

本标准规定了熔融锡焊料在动态条件下氧化渣产率的试验方法。 本标准适用于60/40、63/37等锡铅合金焊料或无铅焊料氧化渣产率的测量。

Quantity test method of the oxidation sludge in the tin solder