共找到 379 条与 电子元器件组件 相关的标准,共 26 页
Rework, modification and rework process requirements for electronic assembly welding
Technical requirements and testing methods of BDS/GNSS high precision system on chip (SoC)
Endurance test methods for die attach materials - Temperature cycling test method for die attach materials applied to discrete type power electronic devices
本文件规定了主板(PCBA)测试规范的术语和定义、缩略语、基本要求、测试要求、测试方法、测试报告。 本文件适用于主板(PCBA)测试规范。
Motherboard (PCBA) test specification
本文件规定了电子设备用相变储能膜的技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于电子设备用相变储能膜(以下简称“储能膜”)。
Phase change energy storage film for electronic equipment
本文件规定了柔性线路板用补强片的术语和定义、技术要求、试验方法、检验规则、标志、标签、使用说明书、包装、运输和贮存。 本文件适用于柔性线路板用补强片。
Reinforcement sheet for flexible circuit boards
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices - Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
本文件规定了医用光电式CT滑环(以下称CT滑环)的术语和定义、基本参数、技术要求、试验方法、检验规则、标志、包装、运输与贮存。 本文件适用采用碳质电刷的医用光电式CT滑环,采用其他电刷材质的医用光电式CT滑环可参照执行。
Photoelectric slip ring for medical Computed Tomography
本文件规定了医用光电式CT滑环(以下称CT滑环)的术语和定义、基本参数、技术要求、试验方法、检验规则、标志、包装、运输与贮存。
Medical photoelectric CT slip ring
Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology-Electronic modules
Workmanship requirements for soldered electronic assemblies-Part 4:Terminal assemblies
Workmanship requirements for soldered electronic assemblies-Part 3:Through-hole mount assemblies
Workmanship requirements for soldered electronic assemblies-Part 5:Rework, modification and repair of soldered electronic assemblies
Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
本文件规范了气流传感器的范围、术语和定义、技术要求、试验方法、检验规则、标志、包装、运输及贮存。 本文件适用于插针式、贴片式、引线式类气流传感器。本产品主要用于电子烟气流传感,用来检查吸烟时的负压转换成输出电压驱动雾化装置。
Airflow sensors
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surf
本文件规定在线绝缘测量仪绿色设计产品的评价方法、评价要求,以及产品生命周期评价报告编制方法。 本文件适用于35kV及以下电力系统在线绝缘测量仪系列产品,其它在线绝缘测量仪可参照执行。
Technical specification for evaluation of green design products assessment —Online insulating measuring instrument
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