L01 技术管理 标准查询与下载

SJ/T 10629.5-1995 计算机辅助设计设计文件管理制度.设计文件的管理

本标准规定了采用计算机辅助设计技术编制的产品设计文件管理的基本要求及管理方法。 本标准适用于CAD设计文件和CAD设计文件更改通知单的管理。

Management system for CAD design documents.Management of design documents

SJ/T 10629.4-1995 计算机辅助设计设计文件管理制度.设计文件的签署

本标准规定了采用计算机辅助设计技术编制的产品设计文件签署的一般要求、签署的技术责任及签署方法。 本标准适用于CAD设计文件的签署。

Management system for CAD design documents.Signature of design documents

IPC SMC-WP-003-1993 芯片贴装技术(CMT)

The purpose of this paper is to investigate emerging chip attachment methods and define and classify the attachment methods for electronic systems designers and manufacturers today. The industry is on the threshold of the next generation of electronic packaging as the component density limitations of fine pitch technology are approached. Chip Mounting Technology is appearing on the technology horizon as a viable option to higher system densities. The name "Chip Mounting Technology" (CMT) was selected in keeping with the conventions of Through Hole Technology (THT), Surface Mount Te--.nology (SMT), and Fine Pitch Te -:.nology (FPT) . Throughout the paper, the terms "chip" and "device" will be used interchangeably to describe the integrated circuit die.

Chip Mounting Technology (CMT)

SJ/T 10376-1993 工艺文件用基本术语

本标准规定了电子工业工艺文件用基本术语及其定义。 本标准适用于电子工业产品工艺文件的编制，编写其它技术文件时也可参照使用。

General terms used for technological clocument

SJ/T 10375-1993 工艺文件格式的填写

本标准规定了SJ/T 10320工艺文件格式的填写要求和填写内容。 本标准适用于编制电子工业产品及其组成部分的工艺文件。

Filling-in for technological document format

SJ/T 10324-1992 工艺文件的成套性

本标准规定了电子产品工艺文件的成套性要求。 本标准适用于电子产品及其组成部分在生产定型时应具备的工艺文件。其他产品也可参照使用。

Completeness of technological document

SJ/T 10320-1992 工艺文件格式

本标准规定了电子产品用工艺文件的格式。 本标准适用于电子产品及其组成部分在组织生产和生产准备过程中工艺文件的编制。其他产品也可参照使用。

Format of technological document

IPC 2220 SERIES 一套五标准( 2221,2222,2223,2224和2225),2220系列的设计文件

This standard establishes requirements and other considerations

2220 Series of Design Documents Set OF 5 Standards (2221,2222,2223,2224,2225 and 2226)

IPC C-406-1990 外部贴装连接器的设计与应用准则

With the present packaging trend in system design moving towards compact, low power consumption configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. Sophisticated electronic assemblers, using a variety of interconnection and packaging techniques, employ the best of todays technology, intermixed with the appropriate sfate-of-the-art component and attachment processes. The degree of advancement in packaging of electronic components is predicated on the type of product being produced: the need for miniaturization and weight savings; plus the off-the-shelf availability of different component types.

Design and Application Guidelines for Surface Mount Connectors

IPC M-106 设计手册的技术参考

The three configurations, surface microstrip, embedded microstrip, and symmetric stripline are shown in Figure 9 and the equations in the following section. It is strongly recommended that manufacturers empirically verify results by characterizing their own process as all equations are based on a model which may not practically represent the circuit behavior under every circumstance.

Technology Reference for Design Manual

IPC MB-380-1990 模塑互连器件准则

IPC Standards and Publications are designed to serve the public interest through

Guidelines for Molded Interconnection Devices

IPC SM-784-1990 芯片对主板技术实施指南

Guidelines for Chip-on- Board Technology Implementation

Guidelines for Chip-on- Board Technology Implementation

IPC SM-780-1988 外部贴装的元件封装和互连重点

Component Packaging and Interconnecting with Emphasis on Surface Mounting

Component Packaging and Interconnecting with Emphasis on Surface Mounting

SJ 2902-1988 设计文件的登记、流转和保管

本标准规定了电子工业产品设计文件的登记、流转和保管的基本要求与方法。 本标准适用于产品设计文件底图和复印图的管理。对缩微胶片和载有程序媒体形式的设计文件也可参照使用。

Registration,circulation and preservation of design documents

ITU-T M.734-1988 国际交换中心来话测试装置上的信息交换

The attention of Administrations is drawn to the need to exchange information on the incoming test facilities which they have provided at their international switching centres.The exchange of such information has an important bearing on maintenance efficiency since it helps to avoid unnecessary requests for maintenance cooperation and the under utilization of the facilities which have been provided.

Exchange of information on incoming test facilities at international switching centres

ITU-T M.721-1988 系统可用性信息点

The system availability information point is an element within the general maintenance organization for the international automatic and semi-automatic telephone service associated with one or more international centres.It collects and disseminates information concerning the non-availability of telecommunications systems which affects the international service.The term availability is used here in the broadest sense of the word.

SYSTEM AVAILABILITY INFORMATION POINT

GEIA 227-A-1971 1英寸穿孔纸带

The information and comments contained in this foreword should not be considered part of the standard. They have been included for clarification and guidance.

One-Inch Perforated Tape

SJ/T 30002-1994 电子工业职业安全卫生设计规定

Design specifications for occupational safety and health in electronic industry

SJ 20268-1993 TEK1411型视频信号发生器SPG11同步信号发生器单元检定规程

Verification regulation of sync signal generator module SPG 11 in video signal generator type TEK 1411

SJ 20267-1993 TEK1411型视频信号发生器TSG13线性测试信号发生器单元检定规程

本检定规程规定了TEK 1411型视频信号发生器TSG13线性测试信号发生器单元的检定条件、检定项目、检定方法。检定结果处理及检定周期。 本检定规程适用于TEK 1411型视频信号发生器TSG13线性测试信号发生器单元的检定。

Verification regulation of linearity test signal generator module TSG 13 in video signal generator type TEK 1411