L01 技术管理 标准查询与下载

JIS C 1082-4:1999 电子技术用文件的制定.第4部分:定位和安装文献

この規格は，主として据付け作業に用いる配置文書及び据付け文書の作成基準を定めたものである。この規格の適用範囲には，現場，建造物及び設備の配置図又は据付け図，現場又は建造物の据付け図又は据付け線図，構成部品の配置図などで示されるそれぞれのシスナム及び対象物が含まれる。

Preparation of documents used in electrotechnology -- Part 4: Location and installation documents

JIS C 1082-3:1999 电子技术用文件的制定.第3部分:连接图、表和目录

この規格は，電気技術で用いる文書の作成のうち接続図，表及びリストについて規定する。

Preparation of documents used in electrotechnology -- Part 3: Connection diagrams, tables and lists

CEA-709.3-1999 自由拓扑双绞线信道规范

This standard was developed under the auspices of the CEMA Technology & Standards R-7.1 HCS1 Subcommittee.

Free-Topology Twisted-Pair Channel Specification

JEDEC JEP132-1998 处理特性指南

Process characterization is an essential element of process control. A process is a combination of people, procedures, methods, machines, materials, measurement equipment, and/or environment for specific work activities to produce a given product or service. When properly defined and controlled, it is a repeatable sequence of activities with measurable inputs and outputs. The characterization of a process defines distinguishing features of a process or its output on which variables or attributes data may be collected. Thus, through process characterization, a manufacturer may define and measure the stability, repeatability, sensitivity, and robustness of a process. Additionally, it supplies inputs for modeling which may be used to identify critical variables, optimize efficiency and output, and provide avenues for continuous improvement. Furthermore, once process characterization has been established, the process predictability may be used for self validation rather than auditing. Management support is essential to the effective implementation and maintenance of a process characterization system.

Process Characterization Guideline

IPC 2225-1998 有机多芯片模块(MCM-L)和MCM-L集会分段设计标准

This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

IPC TM-650 5.5.1.16-1998 IPC-A-44 - 四层测试模式

This document is intended to be a tool for a customer or supplier organization’s internal audit group to assess

IPC-A-44 - Four Layer Test Pattern

IPC TM-650 5.5.1.15-1998 IPC-A-43 - 十层测试模式

This guideline document addresses the issues pertinent to temperature profiling of electronic

IPC-A-43 - Ten Layer Test Pattern

IPC TM-650 5.5.1.7-1998 IPC-A-31 -柔性材料C组测试模式

This specification establishes the specific requirements for organic high-density interconnect (HDI) layers with microvia technology and the quality and reliability assurance requirements that must be met for their acquisition.

IPC-A-31 - Flexible Material Group C Test Pattern

IPC TM-650 5.5.1.8-1998 IPC-A-32 - 灵活的多层测试模式

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buriedblind vias, and metal cores.

IPC-A-32 - Flexible Multilayer Test Pattern

IPC TM-650 5.5.1.13-1998 IPC-A-41 - 单面测试模式

This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.

IPC-A-41 - Single-Sided Test Pattern

IPC TM-650 5.5.1.17-1998 IPC-A-48 - 外部贴装空军稿件艺术品

This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices:

IPC-A-48 - Surface Mount Air Force Mantech Artwork

ANSI/INCITS 172-1996 信息技术.美国国家标准信息技术字典(ANSDIT)

The recommended scope of the Proposed Standard includes the technical terms and their definitions that are required by persons concerned with major areas of the information technology field, and especially the subject areas that comprise the scope of INCITS. The scope of ANSDIT is limited to concepts or terms expected to be employed by computing professionals, skilled managers, or users of information technology, but usually excludes technical detail of concern only to specialists. The Proposed Standard will not include entries from the definition sections of technical standards where entries do not have significance outside that technical standard.

Information Technology - American National Standard Dictionary of Information Technology (ANSDIT)

SJ 20609-1996 电子设计交换格式

本标准规定了电子自动设计和制造过程中的设计交换格式(EDIF)接口。 本标准适用于电子类、计算机类产品的设计。包括电子信息系统、电子电路(数字、模拟)、印刷电路板(PCB)、可编程器件、集成电路(IC，含专用集成电路)等的设计。当采用电子设计自动化(EDA)工具进行上述设计时，它被用作下述场合中的标准： a． 电路网表(Netlist)一级的设计交换格式； b． 物理版图(IC，PCB)一级的设计接口； c． 对电子系统进行行为描述； d． 计算机辅助设计(CAD)与计算机辅助制造(CAM)的接口； e． EDA工具间或设计师间的设计数据交换。

Electronic design interchange format

SJ 20594-1996 军用电子设备振动与冲击手册

Vibration and shock handbook for military electronic equipments

SJ/T 10695-1996 专业工艺装备设计文件编制方法

本标准规定了专用工艺装备设计文件的分类、成套性、零件图、装配图和使用说明书等的编制方法。 本标准适用于电子行业工装设计文件的编制。

Preparation of designed documents for special tooling

SJ/T 10719-1996 电子设备设计文件编制示例

本标准给出了电子设备在设计、生产中使用的表格内容、文字内容、图样和电气简图设计文件编制的示例。适用于电子行业各生产企业设计文件的编制。

Examples for preparation of design documents used in electronic equipments

IPC J-STD-013-1996 球栅阵列应用和其他高密度技术

Material in this standard was voluntarily coordinated by the Surface Mount Council (SMC), and established by Technical Committees of IPC and EIA. Committee members of the two organizations contributed their time, knowledge and expertise to blend a cohesive report on the topic covered by this document. Proposals were sent to key individuals in each of the individual organizations for consensus. Meetings were held to resolve differences or conflicts prior to documenting the information in the final released version.

Implementation of Ball Grid Array and Other High Density Technology

IPC A-311-1996 像掩模生成和使用过程控制

This publication sets forth the information and data which can be collected during the generation and use of phototools with the following objectives and potential benefits:

Process Controls for Phototool Generation and Use

AIIM TR39-1996 数字数据光盘存储数据验证用介质错误监测与报告技术

This standard provides graphic symbols for micrographics and other document management equipment to be used for idenifying equipment fuctions.

Guidelines for the Use of Media Error Monitoring and Reporting Techniques Includes Errata: 1996

SJ/T 10631-1995 工艺文件的编号

本标准规定了工艺文件的编号方法。 本标准适用于电子产品及其组成部分的工艺文件的编号，不适用于专业工艺规程的编号。

Number of technological documents