L30 印制电路 标准查询与下载

DB32/ 2538-2013 印制电路板单位产品能源消耗限额

Energy Consumption Quotas per Unit Product of Printed Circuit Boards

DIN EN 61249-2-39:2013 印刷电路板和其他互连结构用材料. 第2-39部分: 包被和非包被增强基材. 无铅组件用具有限定易燃性(垂直燃烧试验)的高性能环氧和非环氧编织E型玻璃层压板(IEC 61249-2-39-2012); 德文版本EN 61249-2-39-2013

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

DIN EN 61249-2-30:2013 印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定的易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)(IEC 61249-2-30-2012).德文版本EN 61249-2-30-2013

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IE

DIN EN 61249-2-40:2013 印制板和其它互连结构用材料.第2-40部分:包被和非包被增强基材.规定了易燃性的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)(IEC 61249-2-40-2012).德文版本EN 61249-2-40-2013

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

DIN EN 61249-2-27:2013 印制板和其它互连结构用材料. 第2-27部分:包被和非包被增强基材. 规定的易燃性包铜的双马来酰亚胺/三嗪改良型非卤代环氧编织玻璃纤维层压板 (垂直燃烧试验) (IEC 61249-2-27-2012); 德文版本EN 61249-2-27-2013

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning te

DIN EN 60603-13 Berichtigung 1:2013 印制电路板用的频率低于3 MHz的连接器.非可访问绝缘位移终端(ID)用带自由连接器和2,54 mm(0,1英寸)基本栅极的印制电路板用经质量评定的组合连接器的详细规范(IEC 60603-13-1995).德文版本EN 60603-13-1998、DIN EN 60603-13-1998标准的勘误表

Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displ

DB35/T 1355-2013 无卤型覆铜箔环氧玻纤布层压板

本标准规定了无卤型覆铜箔环氧玻纤布层压板的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存。 本标准适用于溴（Br）、氯（Cl）含量（质量分数）分别小于0.09%，且溴和氯总含量（质量分数）小于0.15%的无卤型覆铜箔环氧玻纤布层压板（以下简称无卤型覆铜板）。

Halogen-free copper clad epoxy fiberglass cloth laminate

DB35/T 1356-2013 多层印制板用无卤环氧玻纤布粘结片预浸料

本标准规定了多层印制板用无卤环氧玻纤布粘结片预浸料的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存等内容。 本标准适用于溴（Br）、氯（Cl）含量（质量分数）分别小于0.09%，且溴和氯总含量（质量分数）小于0.15%的多层印制板用环氧玻纤布粘结片预浸材料（以下简称粘结片 ）。

Halogen-free epoxy glass fiber cloth adhesive sheet prepreg for multilayer printed board

DIN IEC/TS 62326-19:2013 印刷电路板.第19部分:设备嵌入式衬底.设计指南(IEC 91/1084/CD-2013)

Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)

DIN EN 61182-2-2:2013 印刷电路板组件产品. 制造业描述数据和转让方法体系. 第2-2部分:印制电路板装配数据描述实现用部分要求 (IEC 61182-2-2-2012); 德文版本EN 61182-2-2-2012

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012

UL 2839-2013 无卤产品的环境声明验证规程

Environmental Claim Validation Procedure for Halogen Free Products

DIN IEC/TS 62326-16:2013 印刷电路板. 第16部分: 装置内埋基板技术. 总则(IEC 91/1081/CD-2013)

Printed boards - Part 16: Device Embedded Substrate Technology - Generics (IEC 91/1081/CD:2013)

DIN IEC/TS 62326-17:2013 印刷电路板. 第17部分:装置嵌入基体. TEG (测试元件组) (IEC 91/1082/CD-2013)

Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)

BS EN 61193-3:2013 质量评定体系.印刷电路板和层板制成品和过程审核的抽样方案的选择和使用

Quality assessment systems. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

IEC 61191-2:2013 印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole,chip mounting, terminal mounting, etc.).

Printed board assemblies.Part 2: Sectional specification.Requirements for surface mount soldered assemblies

IEC 61191-1:2013 印刷电路板组件.第1部分:总规范.使用表面安装和相关装配技术的焊接电气和电子组件的要求

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Printed board assemblies.Part 1: Generic specification.Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

BS EN 61249-2-27:2013 印制板和其它互连结构用材料.包被和非包被增强基材.规定了易燃性包铜的双马来酰亚胺/三嗪改良型非卤代环氧编织玻璃纤维层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-c

BS EN 61249-2-39:2013 印制板和其它互连结构用材料.包被和非包被增强基材.无铅组件用规定了易燃性的包铜高性能环氧和非环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-fre

BS EN 61249-2-40:2013 印制板和其它互连结构用材料.包被和非包被增强基材.规定了易燃性包铜或无铅装配的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-fre

BS EN 61249-2-30:2013 印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定了易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad