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产品描述EVG®810 LTFeaturesSurface plasma activation for low-temperature bonding (fus......
产品描述FeaturesUnique pressure and temperature uniformityCompatible with EVG mechan......
产品描述FeaturesWafer/substrate size from pieces up to 200 mm/8’’Top-side and bottom......
产品描述EVG®850 TB临时键合机FeaturesOpen adhesive platformVarious carriers (silicon, glas......