晶圆临时键合机解键合机

产品描述

EVG®850 TB临时键合机

Features

• Open adhesive platform

• Various carriers (silicon, glass, sapphire, etc…)

• Bridge tool capability for different substrate sizes

• Available with multiple load port options and combinations

• Recipe controlled system

• Real time monitoring and recording of all relevant process parameters

• Fully integrated SECS/GEM interface

• Optional integrated inline metrology module for automated feedback loop

Technical Data

Options
Inline Metrology
ID reading
High topography wafer handling
Warped wafer handling EVG®850 DB 解键合机 Features Reliable handling of thinned, bowed and warped wafers with and without topography Automated cleaning of debonded wafer Recipe controlled system Real time monitoring and recording of all relevant process parameters Fully integrated SECS/GEM interface in automated tools Bridge tool capability for different substrate sizes Modular tool layout → throughput-optimized depending on specific process Technical Data Wafer diameter (substrate size)Up to 300 mmUp to 12“ film frameConfigurationDebond moduleClean moduleFilm frame mounterOptionsID readingVarious output formatsHigh topography wafer handlingWarped wafer handling

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注：该产品未在中华人民共和国食品药品监督管理部门申请医疗器械注册和备案，不可用于临床诊断或治疗等相关用途