IEC 60068-2-58-2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability@ resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Edition 4.0)
Essais d’environnement - Partie 2-58: Essais - Essai Td: Méthodes d’essai de la soudabilité@ résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS) (Edition 4.0)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability@ resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Edition 4.0) 是非强制性国家标准,您可以免费下载前三页
This part of IEC 60068 outlines test Td@ applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys@ which are eutectic or near eutectic tin lead (Pb)@ or lead-free alloys. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering@ to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition@ test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB)@ see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.