Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with gull-wing leads on two sides. The intent of the
information presented herein is to provide the appropriate size, shape and tolerances of
surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also
allow for inspection, testing and reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design, and the land pattern dimensions.