IEC 61188-5-3-2007
印制板和印制板组件.设计和使用.第5-3部分:焊接(焊接区/接缝)考虑.两面带有翅形引线的部件
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
IEC 61188-5-3-2007 发布历史
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.
IEC 61188-5-3-2007由国际电工委员会 IX-IEC 发布于 2007-10。
IEC 61188-5-3-2007 在中国标准分类中归属于: L30 印制电路，在国际标准分类中归属于: 31.180 印制电路和印制电路板。
IEC 61188-5-3-2007的历代版本如下：
- 2007年10月 IEC 61188-5-3-2007 印制板和印制板组件.设计和使用.第5-3部分:焊接(焊接区/接缝)考虑.两面带有翅形引线的部件
- 标准号
- IEC 61188-5-3-2007
- 发布日期
- 2007年10月
- 实施日期
- 废止日期
- 无
- 中国标准分类号
- L30
- 国际标准分类号
- 31.180
- 发布单位
- 国际电工委员会
- 被代替标准
- IEC 91/702/FDIS-2007
- 适用范围
- This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.