GB/T 2423.60-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test U:Robustness of terminations and integral mounting devices (English Version)
This part of GB/T 2423 applies to all electrical and electronic components whose terminals or integral mounting parts may be stressed during normal assembly or repair.
GB/T 2423.60-2008 Referenced Document
GB/T 19247.2 Printed board assemblies--Part 2: Sectional specification Requirements for surface mount soldered assemblies
GB/T 2421.1 Environmental testing for electric and electronic products.General and guidance
GB/T 2423.28-2005 Environmental testing for electric and electronic products.Part2:Test methods-Test T:Soldering
IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
IEC 61190-1-2:2002 Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
ISO 9453 Soft solder alloys — Chemical compositions and forms*, 2020-09-24 Update
GB/T 2423.60-2008 history
2008GB/T 2423.60-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test U:Robustness of terminations and integral mounting devices