Sputtering instrument

Sputtering instrument, Total:101 items.

In the international standard classification, Sputtering instrument involves: Analytical chemistry, Products of non-ferrous metals, Vacuum technology, Particle size analysis. Sieving, Paints and varnishes, Ceramics, Semiconducting materials, Electricity. Magnetism. Electrical and magnetic measurements, FLUID SYSTEMS AND COMPONENTS FOR GENERAL USE, Non-ferrous metals, Medical equipment, Surface treatment and coating, Powder metallurgy, Test conditions and procedures in general, Electronic tubes, Protection against fire, Pesticides and other agrochemicals, Kitchen equipment, Electronic display devices, Terminology (principles and coordination), Non-destructive testing, Jewellery, Linear and angular measurements, Optics and optical measurements, Radiation protection.

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Sputtering instrument

GB/T 32999-2016 Surface chemical analysis—Depth profiling—Measurement of sputtering rate: mesh-replica method using a mechanical stylus profilometer
GB/T 34649-2017 Magnetron sputtering ruthenium target

AT-ON, Sputtering instrument

ONORM E 1355-1959 Detector. Anti-splash detector

Professional Standard - Non-ferrous Metal, Sputtering instrument

YS/T 1024-2015 Tantalum sputtering targets
YS/T 819-2012 High-purity sputtering copper target used in electronic film
YS/T 893-2013 High-purity sputtering titanium target used in electronic film
YS/T 718-2009 Flat magneting sputtering target.Niobium target for optical coating
YS/T 719-2009 Flat magneting sputtering target.Silicon target for optical coating
YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film
YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies

Professional Standard - Machinery, Sputtering instrument

JB/T 8945-1999 Vacuum sputtering coating plant
JB/T 8945-2010 Vacuum sputtering coating plant
JB/T 4081-2011 Vacuum technology - Sputter ion pump
JB/T 4082-1991 Sputtering ion pump technical conditions
JB/T 2965-1992 Performance testing method of sputtering ion pump
JB/T 4081-1991 Sputtering ion pump type and basic parameters
JB/T 11144-2011 X-ray diffractometer

Professional Standard - Electron, Sputtering instrument

SJ 1781-1981 Sputtering ion pump--Testing methods
SJ/T 10478-1994 General specification for magnetic sputtering equipment
SJ 1779-1981 Ordinary two-electrode sputtering ion pump--Parameters series
SJ 1780-1981 Ordinary two-electrode sputtering ion pump--Performance specification
SJ/T 31066-1994 Requirements of readiness and methods of inspection and assessment for Type 3180 sputtering coaters
SJ/T 31067-1994 Requirements of readiness and methods of inspection and assessment for S-gun magnetron sputtering coaters
SJ/T 31273-1994 Requirements of readiness and methods of inspection and assessment for EVP-13480 magnetron sputtering machines

International Organization for Standardization (ISO), Sputtering instrument

ISO/TS 13762:2001 Particle size analysis - Small angle X-ray scattering method
ISO/TR 15969:2001 Surface chemical analysis - Depth profiling - Measurement of sputtered depth
ISO/TR 22335:2007 Surface chemical analysis - Depth profiling - Measurement of sputtering rate: mesh-replica method using a mechanical stylus profilometer
ISO/TR 15969:2021 Surface chemical analysis — Depth profiling — Measurement of sputtered depth
ISO 17109:2015 Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films

American Society for Testing and Materials (ASTM), Sputtering instrument

ASTM D4707-09 Standard Test Method for Measuring Paint Spatter Resistance During Roller Application
ASTM D4707-09(2013) Standard Test Method for Measuring Paint Spatter Resistance During Roller Application
ASTM D4707-97 Standard Test Method for Measuring Paint Spatter Resistance During Roller Application
ASTM D4707-09(2017) Standard Test Method for Measuring Paint Spatter Resistance During Roller Application
ASTM E1634-94(1999) Standard Guide for Performing Sputter Crater Depth Measurements
ASTM E1634-02 Standard Guide for Performing Sputter Crater Depth Measurements
ASTM E1634-02(2007) Standard Guide for Performing Sputter Crater Depth Measurements
ASTM E1634-11(2019) Standard Guide for Performing Sputter Crater Depth Measurements
ASTM E1634-11 Standard Guide for Performing Sputter Crater Depth Measurements
ASTM F136-98e1 Standard Specification for Wrought Titanium-6 Aluminum-4 Vanadium ELI (Extra Low Interstitial) Alloy (UNS R56401) for Surgical Implant Applications
ASTM F136-08 Standard Specification for Wrought Titanium-6 Aluminum-4 Vanadium ELI (Extra Low Interstitial) Alloy for Surgical Implant Applications (UNS R56401)
ASTM F136-13(2021)e1 Standard Specification for Wrought Titanium-6Aluminum-4Vanadium ELI (Extra Low Interstitial) Alloy for Surgical Implant Applications (UNS R56401)
ASTM F1367-98(2011) Standard Specification for Chromium Sputtering Targets for Thin Film Applications
ASTM F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
ASTM F1512-94(1999) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM F1512-94(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
ASTM E1162-87(2001) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
ASTM E1162-87(1996) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
ASTM F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
ASTM F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
ASTM F1238-95(1999) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM E1438-11(2019) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
ASTM F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM E1438-91(2001) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
ASTM E1438-91(1996) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS

Group Standards of the People's Republic of China, Sputtering instrument

T/ZZB 0639-2018 Alumium doped zinc oxide magnetron sputtering targets
T/CAS 304-2018 Magnetron sputtering silicon targets and bound targets
T/ZZB 0093-2016 High-purity sputtering titanium target used in integrated circuit
T/QGCML 3081-2024 Semiconductor sputtering target high-purity titanium metal powder
T/QGCML 159-2021 Calibration method of helmet splash resistance molten metal splash tester
T/CSEA 15-2021 Vacuum Magnetron Sputtering Silver Plating Technology and Quality Inspection
T/QGCML 4248-2024 A smart egg beater with anti-splash function
T/ICMTIA TG0011-2022 High-purity aluminum and aluminum alloy sputtering targets for integrated circuits
T/GVS 002-2021 Generic specification for high precision magnetron sputtering coating plant
T/ZZB 1790-2020 Sputter equipment for Cu-In-Ga-Se thin film solar cells
T/SZS 4034-2021 Process specification of rhodium film deposited on precious metals jewelry surface by magnetron sputtering

工业和信息化部, Sputtering instrument

YS/T 1555-2022 Platinum cobalt chromium boron alloy sputtering target
YS/T 1357-2020 Chromium-tantalum-titanium alloy sputtering target for magnetic recording
YS/T 1358-2020 Iron-cobalt-tantalum alloy sputtering target for magnetic recording
YS/T 1124-2016 Test method for magnetic permeability of magnetic sputtering targets

CZ-CSN, Sputtering instrument

CSN 65 6334-1973 Determination o? grease plashing out of loller bearing

German Institute for Standardization, Sputtering instrument

DIN 28429:2003 Vacuum technology - Acceptance specifications for getter ion pumps

ZA-SANS, Sputtering instrument

SANS 5891:2003 Pesticides - Flammability of aerosols (flame projection test)

Association Francaise de Normalisation, Sputtering instrument

FD X21-063*FD ISO/TR 22335:2008 Surface chemical analysis - Depth profiling - Measurement of sputtering rate : mesh-replica method using a mechanical stylus profilometer
FD ISO/TR 22335:2008 Chemical analysis of surfaces - Depth profiling - Spray velocity measurement: grid imprint method using a mechanical stylus profilometer
NF EN ISO 10342:2010 Instruments ophtalmiques - Réfractomètres

GSO, Sputtering instrument

OS GSO ISO/TR 22335:2009 Surface chemical analysis - Depth profiling – Measurement of sputtering rate – mesh-replica method using a mechanical stylus profilometer
OS GSO ISO/TR 15969:2013 Surface chemical analysis -- Depth profiling -- Measurement of sputtered depth
GSO ISO/TR 15969:2013 Surface chemical analysis -- Depth profiling -- Measurement of sputtered depth
BH GSO ISO/TR 15969:2016 Surface chemical analysis -- Depth profiling -- Measurement of sputtered depth

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Sputtering instrument

GB/T 25755-2010 Vacuum technology.Sputter-ion pumps.Measurement of performance characteristics
GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film
GB/T 29557-2013 Surface chemical analysis.Depth Profiling.Measurment of sputtered depth
GB/T 31227-2014 Test method for the surface roughness by atomic force microscope for sputtered thin films
GB 16355-1996 Radiation protection standards for X-ray diffraction and fluorescence analysis equipment

Korean Agency for Technology and Standards (KATS), Sputtering instrument

KS D ISO TR 15969-2011(2021) Surface chemical analysis－Depth profiling－Measurement of sputtered depth
KS D ISO TR 15969-2011(2016) Surface chemical analysis－Depth profiling－Measurement of sputtered depth
KS D ISO TR 15969-2021 Surface chemical analysis－Depth profiling－Measurement of sputtered depth

Military Standard of the People's Republic of China-General Armament Department, Sputtering instrument

GJB 3032-1997 Specification for sputtered molybdenum disulfide-based self-lubricating solid films

British Standards Institution (BSI), Sputtering instrument

PD ISO/TR 22335:2007 Surface chemical analysis. Depth profiling. Measurement of sputtering rate. Mesh-replica method using a mechanical stylus profilometer
BS PD ISO/TR 15969:2021 Surface chemical analysis. Depth profiling. Measurement of sputtered depth
PD ISO/TR 15969:2021 Surface chemical analysis. Depth profiling. Measurement of sputtered depth
BS ISO 17109:2015 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
BS ISO 17109:2022 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin…
21/30433862 DC BS ISO 17109 AMD1. Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and…

SCC, Sputtering instrument

BS PD ISO/TR 22335:2007 Surface chemical analysis. Depth profiling. Measurement of sputtering rate. Mesh-replica method using a mechanical stylus profilometer
ISO 17109:2015/DAmd 1 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films — A...

RU-GOST R, Sputtering instrument

GOST 5.1807-1973 Type-GIN-0,5-1M getter-ion pump. Quality requirements of certified products