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DEGold ion sputtering apparatus
Gold ion sputtering apparatus, Total:104 items.
In the international standard classification, Gold ion sputtering apparatus involves: Vacuum technology, FLUID SYSTEMS AND COMPONENTS FOR GENERAL USE, Body care equipment, Analytical chemistry, Products of non-ferrous metals, Non-ferrous metals, Semiconducting materials, Jewellery, Radiation protection, Radiation measurements, Pumps, Materials for aerospace construction, Optics and optical measurements, Rubber, Electricity. Magnetism. Electrical and magnetic measurements, Raw materials for rubber and plastics, Medical equipment, Soil quality. Pedology, Electronic components in general.
Professional Standard - Electron, Gold ion sputtering apparatus
- SJ 1781-1981 Sputtering ion pump--Testing methods
- SJ 1779-1981 Ordinary two-electrode sputtering ion pump--Parameters series
- SJ 1780-1981 Ordinary two-electrode sputtering ion pump--Performance specification
Professional Standard - Machinery, Gold ion sputtering apparatus
German Institute for Standardization, Gold ion sputtering apparatus
- DIN 28429:2003 Vacuum technology - Acceptance specifications for getter ion pumps
- DIN IEC/TS 62743:2013 Radiation protection instrumentation - Electronic counting dosemeters for pulsed fields of ionizing radiation (IEC/TS 62743:2012)
- DIN CEN/TS 15605:2008 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry; German version CEN/TS 15605:2007
- DIN EN 15605:2010-12 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry; German version EN 15605:2010
Group Standards of the People's Republic of China, Gold ion sputtering apparatus
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Gold ion sputtering apparatus
- GB/T 25755-2010 Vacuum technology.Sputter-ion pumps.Measurement of performance characteristics
- GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film
- GB/T 36244-2018 Inductively coupled plasma atomic emission spectrometer
- GB/T 41945-2022 Rubber, raw, vulcanised—Determination of metal content by ICP-OES
RU-GOST R, Gold ion sputtering apparatus
- GOST 5.1807-1973 Type-GIN-0,5-1M getter-ion pump. Quality requirements of certified products
- GOST 27973.2-1988 Gold. Method of atomic-emission analysis with inductive plasma
- GOST 5.413-1970 The mater cooled diode type sputter-ion pump NMDI-01-1 (NIRD-100) with the power supply BP-150. Quality requirements for certified products
- GOST R 52371-2005 Tin and lead babbits. Method of inductively coupled plasma atomic-emission spectrometry
- GOST R ISO 22033-2014 Nickel alloys. Determination of niobium. Inductively coupled plasma/atomic emission spectrometric method
- GOST R ISO 22725-2014 Nickel alloys. Determination of tantalum. Inductively coupled plasma atomic emission spectrometric method
American Society for Testing and Materials (ASTM), Gold ion sputtering apparatus
- ASTM E1162-87(2001) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-87(1996) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1438-91(2001) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1438-91(1996) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1162-11(2019) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-06 Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1832-08 Standard Practice for Describing and Specifying a Direct Current Plasma Atomic Emission Spectrometer
- ASTM E1832-08(2017) Standard Practice for Describing and Specifying a Direct Current Plasma Atomic Emission Spectrometer
- ASTM E684-95(2000) Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM E684-04 Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM E1479-16 Standard Practice for Describing and Specifying Inductively Coupled Plasma Atomic Emission Spectrometers
- ASTM F2113-01 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
- ASTM F2113-01(2007) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
- ASTM UOP407-09 Trace Metals in Organics by Dry Ashing - ICP-OES
- ASTM E1479-24 Standard Practice for Describing and Specifying Inductively Coupled Plasma Atomic Emission Spectrometers
- ASTM F1467-99(2005)e1 Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
Professional Standard - Non-ferrous Metal, Gold ion sputtering apparatus
- YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film
- YS/T 935-2013 Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications
British Standards Institution (BSI), Gold ion sputtering apparatus
- BS ISO 17109:2015 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- BS ISO 17109:2022 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin…
- 21/30433862 DC BS ISO 17109 AMD1. Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and…
- PD IEC/TS 62743:2012 Radiation protection instrumentation. Electronic counting dosemeters for pulsed fields of ionizing radiation
- BS ISO 22415:2019 Surface chemical analysis. Secondary ion mass spectrometry. Method for determining yield volume in argon cluster sputter depth profiling of organic materials
- BS EN 15605:2010 Copper and copper alloys.Inductively coupled plasma optical emission spectrometry
- BS ISO 22962:2008 Titanium and titanium alloys - Determination of iron - Inductively coupled plasma atomic emission spectrometry
International Organization for Standardization (ISO), Gold ion sputtering apparatus
- ISO 17109:2015 Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- ISO 17109:2022 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth p
- ISO 22415:2019 Surface chemical analysis — Secondary ion mass spectrometry — Method for determining yield volume in argon cluster sputter depth profiling of organic materials
- ISO 22725:2007 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method
- ISO 22033:2005 Nickel alloys - Determination of niobium - Inductively coupled plasma atomic emission spectrometric method
- ISO 11435:2005 Nickel alloys - Determination of molybdenum - Inductively coupled plasma atomic emission spectrometric method
- ISO 22033:2011 Nickel alloys - Determination of niobium - Inductively coupled plasma/atomic emission spectrometric method
- ISO/TS 18223:2015 Nickel alloys - Determination of Nickel content - Inductively coupled plasma atomic emission spectrometric method
- ISO 22962:2008 Titanium and titanium alloys - Determination of iron - Inductively coupled plasma atomic emission spectrometry
- ISO 11435:2011 Nickel alloys - Determination of molybdenum content - Inductively coupled plasma/atomic emission spectrometric method
SCC, Gold ion sputtering apparatus
- ISO 17109:2015/DAmd 1 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films — A...
- BS PD IEC/TS 62743:2012 Radiation protection instrumentation. Electronic counting dosemeters for pulsed fields of ionizing radiation
- DIN IEC /TS 62743:2013 Radiation protection instrumentation - Electronic counting dosemeters for pulsed fields of ionizing radiation (IEC/TS 62743:2012)
- NS-EN 15605:2010 Copper and copper alloys — Inductively coupled plasma optical emission spectrometry
- DANSK DS/EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
- UNE-CEN/TS 15605:2008 IN Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
Professional Standard - Agriculture, Gold ion sputtering apparatus
- JJG(教委) 015-1996 Verification Regulations for Inductively Coupled Plasma Atomic Emission Spectrometer
SE-SIS, Gold ion sputtering apparatus
- SIS SS IEC 731:1988 Medical electrical equipment — Dos/meters with ionization chambers as used in radiotherapy
International Electrotechnical Commission (IEC), Gold ion sputtering apparatus
- IEC TS 62743:2012 Radiation protection instrumentation - Electronic counting dosemeters for pulsed fields of ionizing radiation
- IEC 45B/706/DTS:2011 IEC/TS 62743, Ed. 1: Radiation protection instrumentation - Electronic counting dosemeters for pulsed fields of ionizing radiation
IEC - International Electrotechnical Commission, Gold ion sputtering apparatus
- TS 62743-2012 Radiation protection instrumentation – Electronic counting dosemeters for pulsed fields of ionizing radiation (Edition 1.0)
Society of Automotive Engineers (SAE), Gold ion sputtering apparatus
Japanese Industrial Standards Committee (JISC), Gold ion sputtering apparatus
- JIS H 1632-3:2014 Titanium.ICP atomic emission spectrometry.Part 3: Determination of boron
- JIS H 1632-1:2014 Titanium.ICP atomic emission spectrometry.Part 1: General requirements and sample decomposition
Korean Agency for Technology and Standards (KATS), Gold ion sputtering apparatus
- KS D 1939-2003 Chemical analysis of zinc alloys by inductively coupled plasma emission spectrometric method
- KS D 1674-2009 Methods for inductively coupled plasma spectrometric analysis of trace elements in pure gold
- KS D ISO 22033:2006 Nickel alloys－Determination of niobium－Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22962:2010 Titanium and titanium alloys－Determination of iron－Inductively coupled plasma atomic emission spectrometry
- KS D ISO 11435:2006 Nickel alloys－Determination of molybdenum－Inductively coupled plasma atomic emission spectrometric method
- KS D ISO TS 18223:2018 Nickel alloys — Determination of Nickel content — Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22033:2021 Nickel alloys — Determination of niobium — Inductively coupled plasma/atomic emission spectrometric method
- KS D ISO 22962-2020 Titanium and titanium alloys－Determination of iron－Inductively coupled plasma atomic emission spectrometry
Standard Association of Australia （SAA）, Gold ion sputtering apparatus
- AS 3515.4:2007 Gold and gold bearing alloys - Determination of gold content (greater than 99.95 percent) - Inductively coupled plasma - Atomic emission spectrometry
- AS 4479.4:1999 Analysis of soils - Determination of metals in aqua regia extracts of soil by inductively coupled plasma-atomic emission spectrometry
国家市场监督管理总局、中国国家标准化管理委员会, Gold ion sputtering apparatus
- GB/T 36764-2018 Rubber compounding ingredients—Silica, precipitated, hydrated—Determination of heavy metal content by inductively coupled plasma atomic emission spectrometric method
- GB/T 41064-2021 Surface chemical analysis—Depth profiling—Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
Professional Standard - Aviation, Gold ion sputtering apparatus
- HB 20094.2-2012 Test method for determination of wear metals in operating liquid for aviation.Part 2: Inductively coupled plasma automic emission spectrometry (ICP-AES)
GSO, Gold ion sputtering apparatus
- GSO IEC 62467-1:2013 Medical electrical equipment - Dosimetric instruments as used in brachytherapy - Part 1: Instruments based on well-type ionization chambers
- GSO ISO 22725:2013 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method
- OS GSO ISO 22725:2013 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method
- OS GSO ISO 22033:2013 Nickel alloys -- Determination of niobium -- Inductively coupled plasma/atomic emission spectrometric method
- GSO ISO 22033:2013 Nickel alloys -- Determination of niobium -- Inductively coupled plasma/atomic emission spectrometric method
- GSO ISO 22962:2013 Titanium and titanium alloys -- Determination of iron -- Inductively coupled plasma atomic emission spectrometry
- GSO ISO 11435:2015 Nickel alloys -- Determination of molybdenum content -- Inductively coupled plasma/atomic emission spectrometric method
- BH GSO ISO 22962:2016 Titanium and titanium alloys -- Determination of iron -- Inductively coupled plasma atomic emission spectrometry
- BH GSO ISO 11435:2017 Nickel alloys -- Determination of molybdenum content -- Inductively coupled plasma/atomic emission spectrometric method
Association Francaise de Normalisation, Gold ion sputtering apparatus
- NF A08-920:2008 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method.
- NF ISO 23166:2019 Nickel alloys - Determination of tantalum - Optical emission spectrometry method with high frequency induced plasma source
- NF A08-702*NF EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
- NF EN 10361:2016 Aciers alliés - Détermination du Nickel - Méthode par spectrométrie d'émission optique avec source à plasma induit
European Committee for Standardization (CEN), Gold ion sputtering apparatus
- EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
Danish Standards Foundation, Gold ion sputtering apparatus
- DS/EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
Lithuanian Standards Office , Gold ion sputtering apparatus
- LST EN 15605-2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
AENOR, Gold ion sputtering apparatus
- UNE-EN 15605:2011 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
- UNE 38863:2012 Titanium and titanium alloys. Determination of iron. Inductively coupled plasma atomic emission spectrometry.
KR-KS, Gold ion sputtering apparatus
- KS D ISO TS 18223-2018 Nickel alloys — Determination of Nickel content — Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22033-2021 Nickel alloys — Determination of niobium — Inductively coupled plasma/atomic emission spectrometric method