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jedec51, Total:30 items.
In the international standard classification, jedec51 involves: Semiconductor devices, Mechanical structures for electronic equipment, Integrated circuits. Microelectronics.
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, jedec51
- JEDEC JESD51-51-2012 Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-Emitting Diodes with Exposed Cooling
- JEDEC JESD51-51A-2022 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
- JEDEC JESD51-9-2000 Test Boards for Area Array Surface Mount Package Thermal Measurements
- JEDEC JESD51-11-2001 Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
- JEDEC JESD51-31-2008 Thermal Test Environment Modifications for MultiChip Packages
- JEDEC JESD51-1-1995 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
- JEDEC JESD51-2-1995 Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
- JEDEC JESD51-3-1996 Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JEDEC JESD51-4-1997 Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997
- JEDEC JESD51-5-1999 Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
- JEDEC JESD51-6-1999 Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
- JEDEC JESD51-7-1999 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JEDEC JESD51-8-1999 Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
- JEDEC JESD51-10-2000 Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
- JEDEC JESD51-12-2005 Guidelines for Reporting and Using Electronic Package Thermal Information
- JEDEC JESD51-14-2010 Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
- JEDEC JESD51-50-2012 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)
- JEDEC JESD51-52-2012 Guidelines for Combining CIE 127-2007 Total Flux Measurements with Thermal Measurements of LEDs with Exposed Cooling Surface
- JEDEC JESD51-2A-2008 Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
- JEDEC JESD51-13-2009 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-52A-2022 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-53A-2022 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-4A-2019 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-50A-2022 Glossary of Thermal Measurement Terms and Definitions
- JEDEC JESD51-12.01-2012 Guidelines for Reporting and Using Electronic Package Thermal Information
- JEDEC JESD51-53-2012 Terms, Definitions and Units Glossary for LED Thermal Testing
- JEDEC JESD51-32-2010 EXTENSION TO JESD51 THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
- JEDEC JESD84-B51-2015 Embedded Multi-Media Card (e MMC) Electrical Standard (5.1)
未注明发布机构, jedec51