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Microelectronics

Microelectronics, Total:249 items.

In the international standard classification, Microelectronics involves: Testing of metals, Equipment for petroleum and natural gas industries, Integrated circuits. Microelectronics, Mechanical testing, Semiconductor devices, Electrical and electronic testing, Construction of railways, Non-ferrous metals, Products of non-ferrous metals, Optical equipment, Electronic tubes, Electromechanical components for electronic and telecommunications equipment, Non-destructive testing, Analytical chemistry, Materials for aerospace construction, Medical sciences and health care facilities in general, ELECTRONICS, Valves, Electrical accessories, Mechanical structures for electronic equipment, Fluid storage devices, Electronic components in general, Air quality, Optics and optical measurements, Electrical engineering in general, Microbiology, Vocabularies, Linear and angular measurements, Metrology and measurement in general.

SE-SIS, Microelectronics

SIS SEN 01 03 61-1969 Microelectronics Fundamental terms

CZ-CSN, Microelectronics

CSN 35 8009-1988 Technological systems for microelectronics. Nomenclature

U.S. Military Regulations and Norms, Microelectronics

ARMY MIL-HDBK-175 VALID NOTICE 1-2000 MICROELECTRONIC DEVICE DATA HANDBOOK
ARMY MIL-HDBK-175-1968 MICROELECTRONIC DEVICE DATA HANDBOOK

Chongqing Provincial Standard of the People's Republic of China, Microelectronics

DB50/T 540-2014 Microelectronic Thermal Mass Gas Flow Meter

Taiwan Provincial Standard of the People's Republic of China, Microelectronics

CNS 13724-1996 Method of Test for Pull Strength of Microelectronic Wire Bonds
CNS 12865.6-1991 Method of Test for Digital Microelectronics ( Terminal Capacitance )
CNS 12865-6-1991 Method of Test for Digital Microelectronics ( Terminal Capacitance )
CNS 12865.10-1992 Method of Test for Digital Microelectronics `6rFunctional Testing`6s
CNS 12865-9-1991 Method of Test for Digital Microelectronics ( Delay Measurements )
CNS 12865.8-1991 Method of Test for Digital Microelectronics ( Load Condition )
CNS 12865-8-1991 Method of Test for Digital Microelectronics ( Load Condition )
CNS 12865-10-1992 Method of Test for Digital Microelectronics `6rFunctional Testing`6s
CNS 12865.9-1991 Method of Test for Digital Microelectronics ( Delay Measurements )
CNS 12865.7-1991 Method of Test for Digital Microelectronics ( Drive Source, Dynamic )
CNS 12865-7-1991 Method of Test for Digital Microelectronics ( Drive Source, Dynamic )
CNS 12865.11-2005 Noise margin measurements for digital microelectronic devices
CNS 12865-11-2005 Noise margin measurements for digital microelectronic devices
CNS 12865-1-1991 Method of Test for Digital Microelectronics ( High Level Output Voltage )
CNS 12865-3-1991 Method of Test for Digital Microelectronics ( Low Level Input Current )
CNS 12865-2-1991 Method of Test for Digital Microelectronics ( Low Level Output Voltage )
CNS 12865-4-1991 Method of Test for Digital Microelectronics ( High Level Input Current )
CNS 12865.5-1991 Method of Test for Digital Microelectronics ( Output Short Circuit Current )
CNS 12865.4-1991 Method of Test for Digital Microelectronics ( High Level Input Current )
CNS 12865.3-1991 Method of Test for Digital Microelectronics ( Low Level Input Current )
CNS 12865.2-1991 Method of Test for Digital Microelectronics ( Low Level Output Voltage )
CNS 12865.1-1991 Method of Test for Digital Microelectronics ( High Level Output Voltage )
CNS 12865-5-1991 Method of Test for Digital Microelectronics ( Output Short Circuit Current )
CNS 13725-1996 Method of Nondestructive Test for Microelectronic Wire Bonds

US-Unspecified Preparing Activity, Microelectronics

DI-QCIC-80886 A-1993 CUSTOM MICROCIRCUIT CHARACTERIZATION PLAN
DI-MGMT-81763 A-2009 Customized Microelectronics Devices Source Protection Plan

Association Francaise de Normalisation, Microelectronics

NF C96-315:1987 Microwave microelectronics. Attenuators and loads.
NF X21-005:2006 Microbeam analysis - Scanning electron microscopy - Guidelines for calibrating image magnification.
NF C96-314:1985 Microcircuits. Microwave. Couplers. General requirements.
NF EN ISO 10692-1:2001 Bouteilles à gaz - Raccords pour robinets de bouteilles à gaz pour l'industrie de la microélectronique - Partie 1 : raccords de sortie
NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
NF C96-050-5*NF EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches.
NF E29-692-1*NF EN ISO 10692-1:2001 Gas cylinders - Gas cylinder valve connections for use in the micro-electronics industry - Part 1 : outlet connections
NF X21-016*NF ISO 15932:2014 Microbeam analysis - Analytical electron microscopy - Vocabulary
NF ISO 15932:2014 Analyse par microfaisceaux - Microscopie électronique analytique - Vocabulaire
NF EN ISO 10692-2:2001 Bouteilles à gaz - Raccords pour robinets de bouteilles à gaz pour l'industrie de la microélectronique - Partie 2 : spécifications et essais de type pour les raccords entre le robinet et la bouteille
NF X21-010:2009 Microbeam analysis - Scanning electron microscopy - Vocabulary.

SAE - SAE International, Microelectronics

SAE AS1142-1971 HERMETICITY TESTING OF MICROELECTRONIC DEVICES
SAE AMS2690B-1988 Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates
SAE AMS2690D-2017 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates

Society of Automotive Engineers (SAE), Microelectronics

SAE AS1142-2002 1992 Hermeticity Testing of Microelectronic Devices
SAE AMS2690A-1982 PARALLEL GAP WELDING Microelectronic Interconnections To Thin Film Substrates
SAE AMS2690C-2011 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
SAE AMS2690-1968 PARALLEL GAP WELDING OF MICROELECTRONIC INTERCONNECTIONS TO THIN FILM SUBSTRATES
SAE AMS2690C-2001 Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates
SAE AMS2690B-1993 PARALLEL GAP WELDING Micro-electronic Interconnections To Thin Film Substrates
SAE AMS2690C-1988 (Noncurrent)Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates

Professional Standard - Electron, Microelectronics

SJ/T 10584-1994 Glossary of photomasking techniques for microelectronics
SJ/T 10747-1996 color codes for lead wires of microwave devices
SJ 20900-2004 Specification for beryllia ceramic sleeves used in microwave electronic tubes
SJ/Z 9008.1-1987 Measurement of electrical properties of microwave tubes--Part 1: Terminology
SJ/Z 9008.3-1987 Measurement of electrical properties of microwave tubes--Part 4: Magnetrons
SJ/Z 9008.2-1987 Measurement of electrical properties of microwave tubes--Part 2: General measurements

HU-MSZT, Microelectronics

MSZ 9200/23-1980

PL-PKN, Microelectronics

PN T04813-1971 Low power elec?ronic ?ubet M?Hiod of m?a?ur?men? of micropkonic noiic wHh aicHation by tapping

Military Standard of the People's Republic of China-General Armament Department, Microelectronics

GJB 548B-2005 Test methods and procedures for microelectronic device
GJB 548A-1996 Microelectronic device test methods and procedures
GJB 548C-2021 Microelectronic device test methods and procedures
GJB 548-1988 Microelectronic device test methods and procedures
GJB 3312-1998 General specification for microwave tubes
GJB 3312A-2011 General specification for microwave tubes
GJB 3311A-2011 Microwave tube test method
GJB 3311-1998 Microwave tube test method
GJB/Z 40.3-1993 Military vacuum electronic device series spectrum microwave tubes
GJB/Z 14-1990 Military microwave tube series type spectrum
GJB 7675-2012 Test methods for microwave tube cathodes and components
GJB 4158-2001 Specification for beryllium oxide ceramic output windows for microwave tubes

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Microelectronics

JEDEC JESD27-1993 Ceramic Package Specification for Microelectronic Packages
JEDEC JEP121A-2006 Requirements for Microelectronic Screening and Test Optimization
JEDEC JESD9B-2011 Inspection Criteria for Microelectronic Packages and Covers
JEDEC JEP144A-2011 Guideline for Internal Gas Analysis for Microelectronic Packages
JEDEC JEP144-2002 Guideline for Residual Gas Analysis (RGA) for Microelectronic Packages
JEDEC JESD9-A-1987 Metal Package Specification for Microelectronic Packages and Covers
JEDEC JESD99B-2007 Terms, Definitions, and Letter Symbols for Microelectronic Devices
JEDEC JESD22-C101D-2008 Field-Induced Charged-Device Model Test Method for Electrostatic- Discharge-Withstand Thresholds of Microelectronic Components
JEDEC JESD22-C101F-2013 Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
JEDEC JESD22-C101C-2004 Field-Induced Charged-Device Model Test Method for Electrostatic- Discharge-Withstand Thresholds of Microelectronic Components

IET - Institution of Engineering and Technology, Microelectronics

LOW-PWR HF MICROELEC-1996 Low-power HF Microelectronics: a unified approach

Association of German Mechanical Engineers, Microelectronics

VDI/VDE 2422-1994 Systematical development of devices controlled by microelectronics
VDI 2083 Blatt 13.2-2009 Cleanroom technology - Quality, production and distribution of ultrapure water - Microelectronics and other technical applications

Professional Standard - Railway, Microelectronics

TB/T 3090-2004 25Hz phase detecting track circuit microelectronic receiver

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Microelectronics

GB/T 17472-2008 Specification for pastes of precious metal used for microelectronics
GB/T 17472-2022 Specification for pastes of precious metal used for microelectronics
GB/T 42709.19-2023 Semiconductor devices microelectromechanical devices Part 19: Electronic compass
GB 50467-2008 Code for construction and acceptance of micro-electronics manufacturing equipment installation engineering
GB/T 17473.2-2008 Test method of precious metals pastes used for microelectronics.Determination of fineness
GB/T 17473.3-2008 Test method of precious metals pastes used for microelectronics.Determination of sheet resistance
GB/T 17473.5-2008 Test method of precious metals pastes used for microelectronics.Determination of viscosity
GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics.Determination of adhesion
GB/T 17473.6-2008 Test method of precious metals pastes used for microelectronics.Determination of resolution
GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of fineness
GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance
GB/T 17473.1-2008 Test method of precious metals pastes used for microelectronics.Determination of solids content
GB/T 42709.5-2023 Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches
GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of viscosity
GB/T 17473.6-1998 Test methods of precious metal pastes used for thick-film microelectronics--Determination of resolution
GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion
GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of solids content
GB/T 17473.7-2008 Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance
GB/T 17473.7-1998 Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance
GB/T 18907-2002 Method of selected area electron diffraction for transmission electron microscopes
GB/T 18907-2013 Microbeam analysis.Analytical electron microscopy.Selected-area electron diffraction analysis using a transmission electron microscope
GB/T 23414-2009 Microbeam analysis.Scanning electron microscopy.Vocabulary
GB/T 26095-2010 Electronic column micrometer
GB/T 21636-2008 Microbeam analysis.Electron probe microanalysis (EPMA).Vocabulary

Korean Agency for Technology and Standards (KATS), Microelectronics

KS D ISO 16700:2013 Microbeam analysis－Scanning electron microscopy－Guidelines for calibrating image magnification
KS D ISO 14595:2012 Microbeam analysis-Electron probe microanalysis-Guidelines for the specification of certified reference materials(CRMs)
KS D ISO 14594:2012 Microbeam analysis－Electron probe microanalysis－Guidelines for the determination of experimental parameters for wavelength dispersive spectroscopy
KS B ISO 10692-1:2014 Gas cylinders — Gas cylinder valve connections for use in the micro-electronics industry — Part 1: Outlet connections
KS B ISO 10692-1:2003 Gas cylinders-Gas cylinder valve connections for use in the micro-electronics industry-Part 1:Outlet connections
KS B ISO 10692-1-2014(2019) Gas cylinders — Gas cylinder valve connections for use in the micro-electronics industry — Part 1: Outlet connections
KS C IEC PAS 62162-2002(2022) Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components
KS D ISO TR 17270:2007 Microbeam analysis－Analytical transmission electron microscopy－Technical report on the determination of the experimental parameters for electron energy loss spectroscopy
KS C IEC PAS 62162-2002(2017) Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components
KS D ISO 23833:2012 Microbeam analysis-Electron probe microanalysis(EPMA)-Vocabulary
KS B ISO 10692-2:2014 Gas cylinders — Gas cylinder valve connections for use in the micro-electronics industry — Part 2: Specification and type testing for valve to cylinder connections
KS B ISO 10692-2:2003 Gas cylinders-Gas cylinder valve connections for use in the micro-electronics industry-Part 2:Specification and type testing for valve to cylinder connections
KS D ISO 22493-2012(2017) Microbeam analysis－Scanning electron microscopy－Vocabulary
KS D ISO 22493:2022 Microbeam analysis —Scanning electron microscopy — Vocabulary
KS D ISO 23833:2018 Microbeam analysis — Electron probe microanalysis(EPMA) — Vocabulary
KS B ISO 10692-2-2014(2019) Gas cylinders — Gas cylinder valve connections for use in the micro-electronics industry — Part 2: Specification and type testing for valve to cylinder connections
KS D ISO 23833:2022 Microbeam analysis — Electron probe microanalysis (EPMA) — Vocabulary
KS D ISO 22493:2012 Microbeam analysis－Scanning electron microscopy－Vocabulary

International Organization for Standardization (ISO), Microelectronics

ISO 16700:2004 Microbeam analysis - Scanning electron microscopy - Guidelines for calibrating image magnification
ISO 16700:2016 Microbeam analysis - Scanning electron microscopy - Guidelines for calibrating image magnification
ISO/CD 25498:2023 Microbeam analysis — Analytical electron microscopy — Selected area electron diffraction analysis using a transmission electron microscope
ISO 14594:2003 Analyse par microfaisceaux - Analyse par microsonde électronique (Microsonde de Castaing) - Lignes directrices pour la détermination des paramètres expérimentaux pour la spectrométrie à dispersion de longueur d'onde
ISO 14594:2014 Microbeam analysis - Electron probe microanalysis - Guidelines for the determination of experimental parameters for wavelength dispersive spectroscopy
ISO 22309:2006 Microbeam analysis - Quantitative analysis using energy-dispersive spectrometry (EDS)
ISO 10692-1:2001 Gas cylinders - Gas cylinder valve connections for use in the micro-electronics industry - Part 1: Outlet connections
ISO 23420:2021 Microbeam analysis — Analytical electron microscopy — Method for the determination of energy resolution for electron energy loss spectrum analysis
ISO/CD 19214:2023 Microbeam analysis — Analytical electron microscopy — Method of determination for apparent growth direction of wirelike crystals by transmission electron microscopy
ISO 25498:2010 Microbeam analysis - Analytical electron microscopy - Selected-area electron diffraction analysis using a transmission electron microscope
ISO 25498:2018 Microbeam analysis - Analytical electron microscopy - Selected area electron diffraction analysis using a transmission electron microscope
ISO/TS 21383:2021 Microbeam analysis - Scanning electron microscopy - Qualification of the scanning electron microscope for quantitative measurements
ISO 10692-2:2001 Gas cylinders - Gas cylinder valve connections for use in the micro-electronics industry - Part 2: Specification and type testing for valve to cylinder connections
ISO 22493:2014 Microbeam analysis - Scanning electron microscopy - Vocabulary
ISO 19214:2017 Microbeam analysis - Analytical electron microscopy - Method of determination for apparent growth direction of wirelike crystals by transmission electron microscopy
ISO 24639:2022 Microbeam analysis — Analytical electron microscopy — Calibration procedure of energy scale for elemental analysis by electron energy loss spectroscopy
ISO 15932:2013 Microbeam analysis.Analytical electron microscopy.Vocabulary

British Standards Institution (BSI), Microelectronics

BS ISO 16700:2004 Microbeam analysis - Scanning electron microscopy - Guidelines for calibrating image magnification
BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
BS EN 62047-7:2011 Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
BS EN ISO 10692-1:2001 Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Outlet connections
BS ISO 14594:2003 Microbeam analysis - Electron probe microanalysis - Guidelines for the determination of experimental parameters for wavelength dispersive spectroscopy
BS ISO 14594:2014 Microbeam analysis. Electron probe microanalysis. Guidelines for the determination of experimental parameters for wavelength dispersive spectroscopy
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS ISO 25498:2018 Tracked Changes. Microbeam analysis. Analytical electron microscopy. Selected area electron diffraction analysis using a transmission electron microscope
BS ISO 23420:2021 Microbeam analysis. Analytical electron microscopy. Method for the determination of energy resolution for electron energy loss spectrum analysis
BS ISO 24639:2022 Microbeam analysis. Analytical electron microscopy. Calibration procedure of energy scale for elemental analysis by electron energy loss spectroscopy
BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
BS EN 62047-9:2013 Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
20/30380369 DC BS ISO 23420. Microbeam analysis. Analytical electron microscopy. Method for the determination of energy resolution for electron energy loss spectrum analysis
21/30404763 DC BS ISO 24639. Microbeam analysis. Analytical electron microscopy. Calibration procedure of energy scale for elemental analysis by electron energy loss spectroscopy
BS ISO 25498:2010 Microbeam analysis - Analytical electron microscopy - Selected-area electron diffraction analysis using a transmission electron microscope
18/30319114 DC BS ISO 20171. Microbeam analysis. Scanning electron microscopy. Tagged image file format for Scanning electron microscopy(TIFF/SEM)
BS ISO 15932:2013 Microbeam analysis. Analytical electron microscopy. Vocabulary
BS ISO 22493:2014 Microbeam analysis. Scanning electron microscopy. Vocabulary

Institute of Environmental Sciences and Technology, Microelectronics

IEST RP-CC024.1-1994 MEASURING AND REPORTING VIBRATION IN MICROELECTRONICS FACILITIES
IEST RP-CC024.1-2002 MEASURING AND REPORTING VIBRATION IN MICROELECTRONICS FACILITIES (5TH PRINTING)
IEST RP-CC004.3-2004 MEASURING AND REPORTING VIBRATION IN MICROELECTRONICS FACILITIES (5TH PRINTING)

American Society for Testing and Materials (ASTM), Microelectronics

ASTM F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM F60-68(1983)e2 Methods for Detection and Enumeration of Microbiological Contaminants in Water Used for Processing Electron and Microelectronic Devices
ASTM F1238-95(1999) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
ASTM F10-69(1981)e1 Specification for Miniature Electron Tube Leads
ASTM F459-84(2001) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
ASTM F459-84(1995)e1 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
ASTM F459-13 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
ASTM F459-13(2018) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
ASTM F542-98 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM F542-02 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM F459-06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM F677-95(1999) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
ASTM F677-04 Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
ASTM F677-04(2009) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
ASTM F677-13 Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
ASTM F71-68(1999) Standard Practice for Using the Morphological Key for the Rapid Identification of Fibers for Contamination Control in Electron Devices and Microelectronics (Withdrawn 2005)
ASTM F1094-87(2005) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
ASTM F1094-87(1999) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
ASTM F1094-87(2020) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
ASTM F1227-89(1999) Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates (Withdrawn 2000)
ASTM F1094-87(2012) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
ASTM F1467-99(2005)e1 Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits

ASHRAE - American Society of Heating@ Refrigerating and Air-Conditioning Engineers@ Inc., Microelectronics

ASHRAE KC-03-9-3-2003 Integrating Technology Changes Into Microelectronic Cleanrooms

Defense Logistics Agency, Microelectronics

DLA SMD-5962-91669 REV A-2008 MICROCIRCUIT, LINEAR, 5 V LOW-DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON
DLA SMD-5962-95839 REV C-2008 MICROCIRCUIT, LINEAR, 5 V LOW DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON
DLA SMD-5962-92109 REV C-2008 MICROCIRCUIT, HYBRID, LINEAR, 12-VOLT, DUAL CHANNEL, DC/DC CONVERTER
DLA SMD-5962-94761 REV B-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-90659 REV F-2008 MICROCIRCUIT, HYBRID, LINEAR, HIGH POWER, OPERATIONAL AMPLIFIER
DLA SMD-5962-87641 REV A-2008 MICROCIRCUIT, LINEAR, BIMOS 8-BIT, SERIAL INPUT, LATCHED DRIVER, MONOLITHIC SILICON
DLA MIL-M-38510/316 E VALID NOTICE 1-2008 MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, CASCADABLE LATCHES, MONOLITHIC SILICON
DLA MIL-M-38510/319 C VALID NOTICE 1-2008 MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, 4 BY 4 REGISTER FILE, CASCADABLE, MONOLITHIC SILICON
DLA SMD-5962-92078 REV J-2008 MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 512K x 8-BIT
DLA SMD-5962-93217 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR ,TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-92223 REV D-2008 MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL TRANSCEIVER/REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON
DLA MIL-PRF-1/1037 E NOTICE 2-2008 ELECTRON TUBE, NEGATIVE GRID (MICROWAVE) TYPE 6897
DLA MIL-PRF-1/1037E-1998 ELECTRON TUBE, NEGATIVE GRID (MICROWAVE) TYPE 6897
DLA MIL-PRF-1/1055 F NOTICE 1-2008 ELECTRON TUBE, MICROWAVE (NEGATIVE GRID) TYPE 6442
DLA MIL-PRF-1/1055F-2002 ELECTRON TUBE, MICROWAVE (NEGATIVE GRID) TYPE 6442
DLA SMD-5962-92225 REV C-2008 MICROCIRCUIT, DIGITAL, FAST CMOS, 10-BIT BUS INTERFACE D REGISTERS WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON
DLA SMD-5962-96570 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, OCTAL BUFFER AND LINE DRIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON

Aeronautical Radio Inc., Microelectronics

ARINC 606-1 ITEM 3.0 Effects of Electrostatic Fields and Discharge on Contemporary Micro-Electronic Parts

Shanghai Provincial Standard of the People's Republic of China, Microelectronics

DB31/ 842-2014 Specifications for Control of Occupational Hazards in Microelectronic Components Manufacturing Industry

工业和信息化部, Microelectronics

SJ/T 11705-2018 Ground and power supply impedance test methods for microelectronic device packages
SJ/T 11704-2018 Test method for digital signal transmission characteristics of microelectronic packages
SJ/T 11703-2018 Test method for crosstalk characteristics of digital microelectronic device packaging

IPC - Association Connecting Electronics Industries, Microelectronics

IPC/JEDEC-9301-2018 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

PT-IPQ, Microelectronics

NP 3081-1985

GB-REG, Microelectronics

REG NASA-LLIS-0678--2000 Lessons Learned ?Design Considerations for Selection of Thick-Film Microelectronic Circuits

U.S. Air Force, Microelectronics

AIR FORCE MIL-E-1/144 E-1968 ELECTRON TUBE, NEGATIVE GRID (MICROWAVE) TYPE 2C43

American National Standards Institute （ANSI), Microelectronics

ANSI/ASTM F542:2007 Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ANSI/ASTM F677:2013 TEST METHOD FOR FLUID AND GREASE RESISTANCE OF THERMOSET ENCAPSULATING COMPOUNDS USED IN ELECTRONIC AND MICROELECTRONIC APPLICATIONS

Danish Standards Foundation, Microelectronics

DS/EN ISO 10692-1:2002 Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 1: Outlet connections
DS/EN ISO 10692-2:2002 Gas cylinders - Gas cylinder valve connections for use in microelectronic industry - Part 2: Specification and type testing for valve to cylinder connections

IN-BIS, Microelectronics

IS 1885 Pt.7/Sec.5-1971

International Electrotechnical Commission (IEC), Microelectronics

IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC 62047-5:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches; Corrigendum 1
IEC PAS 62162:2000 Filed-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components

German Institute for Standardization, Microelectronics

DIN EN ISO 10692-1:2003 Gas cylinders - Gas cylinder valve connections for use in the microelectronic industry - Part 1: Outlet connections (ISO 10692-1:2001); German version EN ISO 10692-1:2001
DIN EN ISO 10692-1:2003-04 Gas cylinders - Gas cylinder valve connections for use in the microelectronic industry - Part 1: Outlet connections (ISO 10692-1:2001); German version EN ISO 10692-1:2001
DIN EN ISO 10692-2:2003 Gas cylinders - Gas cylinder valve connections for use in the microelectronic industry - Part 2: Specification and type testing for valve to cylinder connections (ISO 10692-2:2001); German version EN ISO 10692-2:2001
DIN EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011

European Committee for Standardization (CEN), Microelectronics

EN ISO 10692-1:2001 Gas Cylinders - Gas Cylinder Valve Connections for Use in the Microelectronics Industry - Part 1: Outlet Connections ISO 10692-1: 2001

KR-KS, Microelectronics

KS D ISO TR 17270-2007 Microbeam analysis－Analytical transmission electron microscopy－Technical report on the determination of the experimental parameters for electron energy loss spectroscopy
KS D ISO 22493-2022 Microbeam analysis —Scanning electron microscopy — Vocabulary
KS D ISO 23833-2018 Microbeam analysis — Electron probe microanalysis(EPMA) — Vocabulary
KS D ISO 23833-2022 Microbeam analysis — Electron probe microanalysis (EPMA) — Vocabulary

Lithuanian Standards Office , Microelectronics

LST EN ISO 10692-1:2002 Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 1: Outlet connections (ISO 10692-1:2001)

RU-GOST R, Microelectronics

GOST 30350-1996 Analog integrated circuits. General requirements to apparatus and conditions for measurement of electrical parameters
GOST R 57367-2016 Products acoustoelectronic on surface acoustic waves. Identification mark. General specifications

IEC - International Electrotechnical Commission, Microelectronics

PAS 62162-2000 Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components (Edition 1.0)

国家市场监督管理总局、中国国家标准化管理委员会, Microelectronics

GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance
GB/T 40300-2021 Microbeam analysis—Analytical electron microscopy—Vocabulary
GB/T 21636-2021 Microbeam analysis—Electron probe microanalysis (EPMA)—Vocabulary

AENOR, Microelectronics

UNE-EN ISO 10692-1:2002 Gas cylinders - Gas cylinder valve connections for use in the microelectronics industry - Part 1: Outlet connections. (ISO 10692-1:2001)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Microelectronics

GB/T 33834-2017 Microbeam analysis—Scanning electron microscopy—Scanning electron microscope analysis of biological specimens

Professional Standard - Electricity, Microelectronics

DL/T 2163-2020 MEMS Inclinometer

Professional Standard - Machinery, Microelectronics

JB/T 8499-1996 Inductance scale micrometers for electron beam
JB/T 12203-2015 Electron Column Pneumatic Micrometer

Electronic Components, Assemblies and Materials Association, Microelectronics

ECA TEP 170-1972 X-Radiation Detection and Measurements for Microwave Tubes, Recommended Practice on