31.080.01 半导体器分立件综合 标准查询与下载
共找到 1415 条与 半导体器分立件综合 相关的标准，共 95 页
What is BS IEC 60747 ‑ 14 ‑ 11 about? BS IEC 60747 ‑ 14 ‑ 11 is the 14th part of the multi-series European standard that defines the terms, definitions, configuration, and test methods that can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods described in BS IEC 60747 ‑ 14 ‑ 11 are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. Note: This BS IEC 60747 ‑ 14 ‑ 11 excludes devices dealt with by TC 49: piezoelectric, dielectric, and electrostatic devices and associated materials...
Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
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- 31.080.01
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- 发布
- 2021-03-31
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- 2021-03-31
This part of IEC 60747 defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave- based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. Th
Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
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- 31.080.01
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- 2021-03-01
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Semiconductor devices. Semiconductor devices for energy harvesting and generation. Test method for measuring generated power from flexible thermoelectric devices
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- 31.080.01
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- 2021-02-03
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- 2021-02-03
Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
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- 31.080.01
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- 发布
- 2021-01-22
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- 2021-03-17
1.1?This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire. No
Standard Specification for Gold Wire for Semiconductor Lead Bonding
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- 31.080.01
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- 2021-01-01
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Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation; Corrigendum 1
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- 31.080.01
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- L40
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- 2021-01-00
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Optics and photonics. Semiconducting photoelectric detectors. Photoelectric and photoreceiving devices. Methods of measuring photoelectric parameters and determining characteristics
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- 31.080.01
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- 2021-00-00
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- 2022-03-01
Optics and photonics. Semiconducting photoelectric detectors. Photoelectric and photoreceiving devices. Terms and definitions
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- 31.080.01
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- 2021-00-00
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- 2022-03-01
Optics and photonics. Photodetector devices of second and next-generations. Methods for photoelectric parameters measuring and determination of characteristics
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- 31.080.01
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- 2021-00-00
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- 2022-03-01
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
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- 31.080.01
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- L40/49
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- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
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- 31.080.01
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- L40/49
- 发布
- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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- 31.080.01
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- K40/49
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- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
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- 31.080.01
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- N50/59
- 发布
- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
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- 31.080.01
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- K46
- 发布
- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
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- 31.080.01
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- L40/49
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- 2021
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Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
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- 31.080.01
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- K40/49
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- 2021
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Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
- ICS
- 31.080.01
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- 发布
- 2020-12-31
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
- ICS
- 31.080.01
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- 发布
- 2020-12-31
- 实施
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
- ICS
- 31.080.01
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- 发布
- 2020-12-15
- 实施
- 2020-12-15
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020)
- ICS
- 31.080.01
- CCS
- 发布
- 2020-12-15
- 实施
- 2020-12-15
