31.220 电子电信设备用机电元件 标准查询与下载

IPC TM-650 3.8-1975 连接器机械冲击 修订版A 1975年7月

Whether a printed circuit is to be a prototype, or a high-volume

Mechanical Shock, Connectors; Revision A - July 1975

IPC TM-650 3.7-1975 低水平电路连接器 修订版A 1975年7月

Whether a printed circuit is to be a prototype, or a high-volume

Low Level Circuit Connectors; Revision A - July 1975

IPC TM-650 3.5-1975 连接器湿度 修订版A 1975年7月

This specification defines guidelines for selecting core constructions in terms of fiberglass fabric style and configuration for use in multilayer PWB applications. Each core construction is given a registration number for ordering purposes. Every effort shall be made to periodically review the construction guideline and include or exclude constructions based on current data.

Humidity, Connectors; Revision A - July 1975

IPC TM-650 3.3-1975 连接器拉伸强度和卷曲度 修订版A 1975年7月

With the present packaging trend in system design moving towards compact, low power consumption configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. Sophisticated electronic assemblers, using a variety of interconnection and packaging techniques, employ the best of todays technology, intermixed with the appropriate sfate-of-the-art component and attachment processes. The degree of advancement in packaging of electronic components is predicated on the type of product being produced: the need for miniaturization and weight savings; plus the off-the-shelf availability of different component types.

Crimp Tensile Strength, Connectors; Revision A - July 1975

IPC TM-650 3.2-1975 连接器通讯保持 修订版A 1975年7月

Whether a printed circuit is to be a prototype, or a high-volume

Contact Retention, Connectors; Revision A - July 1975

IPC TM-650 3.1-1975 连接器接触电阻 修订版A 1975年7月

Whether a printed circuit is to be a prototype, or a high-volume

Contact Resistance, Connectors; Revision A - July 1975

IPC TM-650 3.12-1975 连接器振动 修订版A 1975年7月

With the present packaging trend in systems moving towards high speed compact, configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. The degree of advancement in packaging of electronic components is predicated on the type of product being produced; the need for miniaturization and weight savings; plus the offthe- sheif availability of different component types.

Vibration, Connectors; Revision A - July 1975

IPC TM-650 3.13-1975 连接器耐电压性 修订版A 1975年7月

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial and industrial applications.

Withstanding Voltage, Connectors; Revision A - July 1975

IPC TM-650 3.14-1975 连接器的高温生活

This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA) characteristics. The major focus of the information presented is directed toward those PWAs that have surface mount (SM) components, either totally, or intermixed with through-hole components, mounted on one or both sides of the mounting structure.

High Temperature Life, Connectors

IPC TM-650 5.1.122-1975 氯化镍与硫酸电镀解决方案分析

Rigid printed boards and printed board assemblies are generally subject to classifications by intended end item use. The IPC’s classification of producibility is related to complexity of the design and the precision required to produce the particular printed board or printed board assembly.

Analysis of Nickel Chloride/Sulfate Electroplating Solutions

IPC TM-650 5.1.130-1975 铑电镀解决方案分析

Primarily because of its flat, thin shape, the use of flexible printed circuits can often give the designer optimum savings in weight, space, and cost. Depending on the specific application, a savings of up to 75% of packaging and interconnecting structure volume and weight are feasible.

Analysis of Rhodium Electroplating Solutions

IPC TM-650 5.1.450-1975 体积电阻率去离子为分析

This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved.

Analysis of Deionized Water for Volume Resistivity

IPC TR-470-1974 多层互连板的热特性

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Thermal Characteristics of Multilayer Interconnection Boards

IPC TM-650-1973 包括所有修改意见的测试方法手册: 修订本E 2004年5月

This test method covers the determination of breaking strength of woven fiber glass fabrics.

TEST METHODS MANUAL Includes All Revisions; Revision E: 05/2004

IPC TM-650 2.4.6-1973 热石油

Hot Oil

Hot Oil

IPC TM-650 5.8.3-1973 剥离强度测试模式

This test method is used to determine the ammonium persulfate and sulfuric acid concentrations in ammonium persulfate cleaning solutions.

Peel Strength Test Pattern

IPC TM-650 2.2.8-1973 孔地点

This standard establishes requirements and other considerations

Location of Holes

IPC TM-650 5.7-1973 子目录

This test method is used to determine the major constituents in copper fluorborate electroplating solUtions.

Subsection Table of Contents

IPC TM-650 2.4.11-1973 弹性介质材料的抗剪强度

IPC Standards and Publications are designed to serve the public interest throughIPC Standards and Publications are designed to serve the public interest through

Shear Strength Flexible Dielectric Materials

IPC TM-650 2.4.17-1973 撕裂强度(繁殖)

IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing

Tear Strength (Propagation)