L53 半导体发光器件 标准查询与下载

UL 8750 BULLETIN-2008 灯具产品用发光二极管光源的调查纲要

The following is being proposed for preliminary review and comment only: 1. For Preliminary Review Only: Proposed First Edition of the Standard for Light Emitting Diode (LED) Light Sources for Use in Lighting Products, UL 8750

OUTLINE OF INVESTIGATION FOR LIGHT EMITTING DIODE (LED) LIGHT SOURCES FOR USE IN LIGHTING PRODUCTS

JB/T 10875-2008 发光二极管光学性能测试方法

本标准规定了再额定电流工作条件下的半导体发光二极管（以下简称LED器件）光学性能测试方法。 本标准适用于单色可见光、白光LED器件光学性能测试，组件和功率器件的光学性能测试参照执行。 本标准是一种推荐性的测试方法，只要达到同样的测试目的，也可采用其他的测试方法。

Measuring methods for optical properties of LEDs

SJ 20986-2008 体波声光器件通用规范

本规范规定了军用体波声光器件的通用要求、质量保证规定、测试和试验方法等。 本规范适用于军事装备用声光调制器、声光偏转器、声光滤光器、声光移频器和声光Q开关等体波声光器件（以下简称产品）。

General specification for bulk acoustoptic device

JEDEC J-STD-020D.1-2008 用于不气密固态表面安装设备的湿度/回流灵敏度分级

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2. This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance. SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired. Annex B provides an overview of major changes from Revision C to Revision D of this document. Note: If the procedures in this document are used on packaged devices that are not included in this specification’s scope, the failure criteria for such packages must be agreed upon by the device supplier and their end user.

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IEC 62341-1-2:2007 有机发光二极管显示器.第1-2部分:术语和文字符号

This part of IEC 62341 gives preferred terms, their definitions and symbols for organic light emitting diode (OLED) displays; with the object of using the same terminology when publications are prepared in different countries.

Organic light emitting diode displays - Part 1-2: Terminology and letter symbols

KS C IEC 62341-5:2007 有机发光二极管(OLED)显示器.第5部分:环境监测方法

이 규격은 OLED 표시장치의 환경 신뢰성 및 기계적인 신뢰성 및 품질 약화에 대한 신뢰성

Organic light emitting diode(OLED) displays－Part 5：Environmental and mechanical reliability test methods

KS C IEC 62341-6:2007 有机发光二极管(OLED)显示器.第6-1部分:光学参数及光电学参数的测量方法

이 규격은 유기발광다이오드 디스플레이 패널 및 모듈의 광학 및 광전기적 특성을 결정하기 위

Organic light emitting diode(OLED) displays－Part 6：Measurement methods

UL 879 BULLETIN-2007 电子告示牌零件UL安全标准(评审到期日 2007年9月17日)

The following topics are being recirculated: 11. Flexible sign faces, Ozone - Table 4.3, Part II, rows R & T. 12. Flexible sign faces requirements - Table 4.3, Part II, rows R - V. 13. Flexible sign faces, UV & Ozone - Table 4.3, Part II, rows W - Z. 16. Sign body, not enclosure rated, UV & Ozone -Table 4.3, Part II, row O. 17. Sign face trim, UV & Ozone - Table 4.3, Part II, row CC. 20. Retention tests of electrode cover - 3.4.1.11.2.1, 5.12.3.1, 5.12.3.3.

UL Standard for Safety Electric Sign Components COMMENTS DUE: SEPTEMBER 17, 2007

KS C IEC 62341-1-1:2007 有机发光二极管(OLED)显示器.第1-1部分:通用规范

이 규격은 유기발광다이오드(OLED) 디스플레이를 위한 품목규격이다. 이 규격은 IECQ-

Organic light emitting diode (OLED) displays - Part 1-1 : Generic specification

BS IEC 60747-1:2006+A1:2010 半导体器件.总则

Semiconductor devices - General

KS C IEC 62341-1-2:2005 有机发光二极管(OLED)显示器.第1-2部分:术语和文字符号

이 규격은 유기 발광 다이오드(OLED) 디스플레이의 선호되는 용어, 정의 및 기호를 제공

Organic light emitting diode(OLED) displays－Part 2：Terminology and letter symbols

BS EN ISO 11807-2:2005 集成光学.词汇.分类用术语

— for books produced with a view to heavy use over prolonged periods, e.g. reference works;

Integrated optics - Vocabulary - Terms used in classification

BS EN ISO 11807-1:2005 集成光学.词汇.基本术语和符号

— for books of permanent retention;

Integrated optics - Vocabulary - Basic terms and symbols

BS EN ISO 14881:2005 集成光学.接口.有关耦合特性的参数

Integrated optics - Interfaces - Parameters relevant to coupling properties

JEDEC J-STD-020C-2004 非密封固态表面贴装器件湿度／再流焊敏感度分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2.

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

JEDEC JESD33B-2004 测量和利用温度安全系数以确定一条金属化状态线温度的标准方法

This method is intended for determining the temperature coefficient of resistance (at a given temperature) of aluminum- and copper-based thin-film metallizations that are used in microelectronic circuits and devices. This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed. This method is intended for using a metallization test line as an ambient-temperature sensor. It uses the predetermined values for the temperature coefficient of resistance of the metallization and the resistance of the test line at a reference temperature. This method is designed for use under conditions where the metallization resistivity is linearly dependent on temperature and where it does not suffer any irreversible changes. For aluminum metallizations, a linear dependence appears to hold until approximately 420 ºC, considerably above anticipated stress temperatures. For copper metallizations, a departure from a linear dependence becomes evident at temperatures as low as 200 °C. A correcting function is used for copper to correct for departures from linearity at these higher temperatures This method is applicable to metallization test lines with or without vias, and with oxide or low-k dielectrics. While the method is designed for use with aluminum- and copper-based metallizations, it may also be used with other metals and alloys for conditions that satisfy the linear dependence and stability stipulations in the previous paragraphs. The metallization structure used in the method may be measured while on a wafer or a part therefrom, or as part of a test chip bonded to a package and electrically accessible via package terminals.

Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line

WJ 2100-2004 硅光电二极管、硅雪崩光电二极管测试方法

Test method for silicon photodiodes and silicon avalanche photodiodes

GEIA SSB-1.003-A-2002 加速因素 SSB-1 附件 军事,航空航天和其他方面用塑料包裹微型电路和半导体指南

This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in c

Acceleration Factors Annex to SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications

SJ 20644.2-2001 半导体光电子器件 GD101型PIN光电二极管详细规范

Semiconductor optoelectronic devices Detail specification for type GD101 PIN photodiode

SJ 20644.1-2001 半导体光电子器件 GD3550Y型PIN光电二极管详细规范

Semiconductor optoelectronic devices Detail specification for type GD3550Y PIN photodiode