JIS C60068-2-58-2006 环境试验.第2部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热试验方法
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)