This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).
IEC 60068-2-69-2017由国际电工委员会 IX-IEC 发布于 2017-03。
IEC 60068-2-69-2017 在中国标准分类中归属于: A21 环境条件与通用试验方法,在国际标准分类中归属于: 19.040 环境试验,31.190 电子元器件组件。
IEC 60068-2-69-2017 由 IEC 60068-2-54-2006 变更而来。
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