L01 技术管理 标准查询与下载

SJ/T 207.8-2001 设计文件管理制度 第8部分：图样编制

本标准规定了电子产品设计文件中图样的编制要求。 本标准适用于电子产品设计文件中图样的编制。其他产品的图样编制也可参照采用。

Management system for design documents Part 8:Preparation of pictorial form

SJ/T 207.6-2001 设计文件管理制度 第6部分：项目代号

本标准规定了电子产品设计文件中电气技术项目代号的组成方法和应用原则。 本标准适用于电子产品设计文件中电气技术项目代号的编制。其他产品的设计文件也可参照采用。

Management system for design documents Part 6:Item designation

SJ/T 207.7-2001 设计文件管理制度 第7部分：电气简图的编制

本标准规定了电子产品设计文件中电气简图的编制的要求。 本标准适用于电子产品设计文件中电气简图的编制。其他产品的电气简图也可参照采用。

Management system for design documents Part 7:Preparation of electrical diagrams

IPC 6018A-2002 微波终端产品局检查和试验,高频-318B;取代氢氟酸-318A 1991年12月

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buriedblind vias, and metal cores.

Microwave End Product Board Inspection and Test HF-318B; Supersedes HF-318A December 1991

IPC 2511B-2002 应用产品制造描述数据和传递MXL模式分类研究法通用要求

This standard specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer MXL Schema Methodology

IPC 4103-2002 高速/高频率申请基础材料的规格,取代 IPC-L-125A-1992年7月

This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only

Specification for Base Materials for High Speed/High Frequency Applications Supersedes IPC-L-125A - July 1992

JEDEC JESD85-2001 在FITs器中计算故障率的方法

The methods described in this document apply to failure modes and mechanisms whose failures exhibit a constant failure rate, e.=., an Arrhenius behavior characterized by an activation energy for failure. If data on the distributions of failure with time exist, these activation energies can be assumed from prior knowledge or failure analysis signatures. If the default activation energies are not known or can’t be determined, an activation enersy can be used as a default. Refer to JEP 122 Activation Energies for Failure Mechanisms to obtain initial estimates.

Methods for Calculating Failure Rates in Units of FITs

CISPR 24 AMD 1-2001 信息技术设备.抗扰性.限值和测量方法.修改件1

This standard is Information technology equipment - Immunity characteristics - Limits and methods of measurement; Amendment 1

Information technology equipment - Immunity characteristics - Limits and methods of measurement; Amendment 1

EIA-832-2000 过程改进导则

Success oriented manufacturers are or have adopted a business philosophy, focused on delivering quality products quickly, while increasing their profit margins. These manufacturers are continuously looking for process improvement opportunities that give them the greatest return on their investment. To accomplish this, process control techniques have gained wide acceptance and are used, in some form, in most manufacturing environments. This being the case, the assumption is that these businesses have already analyzed their manufacturing processes, assigned measures and are collecting data about those processes. After analyzing process measurement data, the steps taken to determine what improvements could or should be made, and how those changes are implemented is what is known as process improvement. This is generally where most businesses fall short of maximizing process and profit potential as process improvement decisions are influenced by less tangible factors such as corporate culture, market trends, resource conflicts, etc., which makes this a difficult area of business to define and manage.

Process Improvement Guidelines

IPC 2516A-2000 执行董事会组装产品制造数据描述[BDASM]的分段要求

This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description [BDASM]

IPC 2518A-2000 执行部分名单上的产品数据描述[PTLST]分段要求

This standard specifies data formats used to describe parts lists and bill of material generation methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers.

Sectional Requirements for Implementation of Part List Product Data Description [PTLST]

SJ/T 207.4-1999 设计文件管理制度.第4部分：设计文件的编号

Management system for design documents.Part 4:Numbering for design documents

SJ/T 207.1-1999 设计文件管理制度.第1部分：设计文件的分类和组成

本标准规定了电子产品设计文件的基本要求、产品的分级、设计文件的分类和组成。 本标准适用于电子产品设计文件的分类和成套。其他产品的设计文件也可参照采用。

Management system for design documents.Part 1:Classification and composition of design documents

SJ/T 207.3-1999 设计文件管理制度.第3部分：文字内容和表格形式设计文件的编制方法

Management system for design documents.Part 3:Preparation of design documents in the texture content and tables form

SJ/T 207.2-1999 设计文件管理制度.第2部分：设计文件的格式

本标准规定了电子产品设计文件的标题栏、明细栏、镀涂栏、登记栏、倒号栏和格式、尺寸及其填写方法。同时规定了电子产品设计文件的20种格式。并对各种格式所适应的设计文件做了规定。 本标准适用于编制电子产品设计文件时所使用的各种格式。其他产品的设计文件也可参照采用。

Management system for design documents.Part 2:Formats of design documents

SJ/T 207.5-1999 设计文件管理制度.第5部分：设计文件的更改

Management system for design documents.Part 5:Revisions of design documents

IPC 6016-1999 高密度互连(HDI)层或板资格和性能规格

This specification establishes the specific requirements for organic high-density interconnect (HDI) layers with microvia technology and the quality and reliability assurance requirements that must be met for their acquisition.

Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

DLA MIL-HDBK-831-1999 试验报告的准备

This handbook is approved for use by the Department of Defense and is available for use by all Departments and Agencies of the Department of Defense.

PREPARATION OF TEST REPORTS

JIS C 1082-2:1999 电子技术用文件的制定.2部分:功能定位图

この規格は，電気技術で用いる文書の作成のうち，全体図，機能図及び回路図のような機能図についての基準について規定する。

Preparation of documents used in electrotechnology -- Part 2: Function-oriented diagrams

JIS C 1082-1:1999 电子技术用文件的制定.第1部分:一般要求

この規格は，電気技術で用いる文書作成のための一般的な規則，ガイドライン及び一定の種類の文書類の特定規則並びにガイドラインを規定する。例図は所定の規則を説明するためのものであるが，必ずしも文書を完全に代表するものではない。

Preparation of documents used in electrotechnology -- Part 1: General requirements