L01 技术管理 标准查询与下载

SL 385-2007 水文数据GIS分类编码标准

本标准适用于水文数据地理信息系统的分类与编码

Standard of hydrologic data classification and coding for GIS

CEA-2013-A-2007 数字机顶盒的背景功率消耗

The properties of the Logical Units’ user interfaces originating from a physical device are available using the GET IPaddr/2027_file command, where the IPaddr is the IP address of the physical device in dotted decimal notation in ASCII. Service devices shall return an XML document, see [6], describing all device supported Logical Units as the concatenation of all Logical Unit block descriptions. The schemas for the 2027 file and opcodes in Annex B are informative.

Digital STB Background Power Consumption

IPC 2583-2007 为制造业数据描述应用设计特点的分段要求

Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

IPC 7351A-2007 外部贴装设计与土地的标准模式通用要求

This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet to meet the requirements of IPC J-STD- 001, and also to allow for inspection, testing, and rework of those solder joints.

Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC 7525A-2007 模版设计指引

This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only as much of the content is based on the experience of stencil designers, fabricators and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.

Stencil Design Guidelines

IPC 1752-2007 申报材料管理1.1版

This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for Electrical and Electronic Equipment (EEE). This standard applies to products, components, subitems and materials that are supplied to producers of EEE for incorporation into their products. It does not apply to packaging materials (e.g. cardboard, plastic tray). It covers materials and substances that may be present in the supplied product or subitem. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or subitem.

Materials Declaration Management Version 1.1

IPC 1751-2007 申报过程管理1.1版通用要求

This standard provides the principles and details for declarations necessary between members of a supply chain. Although this standard contains only generic information regarding trading partners, when combined with a specific sectional standard, the entire document set is used to define and maintain the declaration type information. The requirements pertain to both hard copy and electronic data descriptions. This standard provides for the creation of a record that will serve as a commitment between trading partners and may be used to establish due diligence in any dispute in third-party litigation.

Generic Requirements for Declaration Process Managemnt Version 1.1

JEDEC JESD96A-1-2007 JEDEC标准的互用性和顺应性技术要求.JESD96A 使用IEEE 802.11n的操作规程建议 JESD96A的附录1

The RF to baseband interface specified in the JEDEC standard JESD96A is briefly described as follows. This interface is a high-speed, low latency digital interface that has been defined primarily for wireless local area networking applications but can be used for other RF to BB links such as used in metro area networking and wide area networking applications. This interface allows the radio front end of a wireless network controller to be separated from the base-band and MAC device(s) by up to 50 cm. A typical example is to connect a radio front end in the upper (screen) portion of a laptop computer to a base-band device on the motherboard. Lower power options are also defined for shorter distances.

Interoperability and Compliance Technical Requirements for JEDEC Standard JESD96A ?Recommended Practice for use with IEEE 802.11n Addendum 1 to JESD96A

IPC JP002-2006 目前的锡晶须理论和缓减做法指南

Members of the Joint JEDEC/IPC Tin Whiskers Theory and Mitigation Practices Guideline Task Group have worked to develop this document. We would like to thank them for their dedication to this effort. Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of both the JEDEC JC 14.1 Task Group and the IPC 5-23e Task Group are shown below, it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of the JEDEC and IPC extend their gratitude.

Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC 9261A-2006 为PCAs的DPMO过程和估计产量

This document defines standard methodologies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assembly processes. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC- 7912.

In-Process DPMO and Estimated Yield for PCAs

JEDEC JESD51-12-2005 传送和使用电子仪器组件热信息的指南

This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.

Guidelines for Reporting and Using Electronic Package Thermal Information

IPC M-109-2004 湿度敏感元件标准和指引手册

IPC and JEDEC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC or JEDEC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC or JEDEC members, whether the standard is to be used either domestically or internationally.

Moisture Sensitive Component Standards and Guidelines Manual

DLA MIL-HDBK-831 VALID NOTICE 1-2004 试验报告的准备

MIL-HDBK-831, dated 23 April 1999, has been reviewed and determined to be valid for use in acquisition

PREPARATION OF TEST REPORTS

IPC 7095A-2004 设计和组装过程中应用BGAs

This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs.

Design and Assembly Process Implementation for BGAs

IPC 2501-2003 基于网络的交换xml数据(信息经纪人)定义

Information flow is essential to efficient electronics manufacturing and standards are essential to information flow. One area of commerce that has lacked its own communication standards is the electronics manufacturing factory floor. Information exchange between a system of electronic assembly equipment and higher-level applications has, in the past, used proprietary or borrowed standards. The IPC-254X and IPC-255X series of standards address this issue by defining the messages needed for this information exchange.

Definition for Web-Based Exchange of XML Data (Message Broker)

IPC 8413-1-2003 处理光学纤维制造业运营过程规范

The purpose of the specification is to define standard practices for handling various kinds of optical fiber and to define the specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing.

Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

CISPR 24 AMD 2-2002 信息技术设备.抗干扰特性.测试的限制和方法;修改件2

This standard is Information technology equipment - Immunity characteristics - Limits and methods of measurement; Amendment 2

Information technology equipment - Immunity characteristics - Limits and methods of measurement; Amendment 2

IPC 9199-2002 统计过程控制(SPC)质量等级

This document is intended to be a tool for a customer or supplier organization’s internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This document should be used by trained evaluators. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels.

Statistical Process Control (SPC) Quality Rating

IEC PAS 62337:2002 加工工业中电子仪器仪表和控制系统在交付使用中的里程碑和活动

This document defines phases and milestones (see figure 1) and describes as an example activities after the “Completion of Erection” milestone of the project and prior to the Acceptance of Plant by the owner. For each type of process/plant the activities shall be adapted.

Milestones and activities during commissioning of electrical instrumentation and control systems in the process industry

IPC J-STD-032-2002 球栅阵列球的绩效标准

IPC J-STD-032-2002

Performance Standard for Ball Grid Array Balls