L30 印制电路 标准查询与下载

SJ/Z 2808-2015 印制板组装件热设计

本标准规定了电子设备中印制板组装件在自然冷却和强迫风冷状态下的热设计。 本标准适用于印制板组装件的热设计和热分析。

Thermal design of printed board assembly

SJ/T 11551-2015 高密度互连印制电路用涂树脂铜箔

Resin-coated copper foil for high-density interconnection printed circuits

NF C01-541/A1:2015 国际电工词汇. 第541部分: 印刷电路

International electrotechnical vocabulary - Part 541 : printed circuits

BS EN 61189-2-721:2015 电气材料, 印制板和其他互连结构和组合装置的试验方法. 互连结构材料试验方法. 采用分离介质谐振器在微波频率下测量覆铜层压板的相对介电常数和损耗角正切

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwa

BS PD IEC/TS 62878-2-1:2015 装置内埋基板. 指南. 通用技术说明

Device embedded substrate. Guidelines. General description of technology

BS PD IEC/TS 62878-2-4:2015 装置内埋基板. 指南. 测试元件组 (TEG)

Device embedded substrate. Guidelines. Test element groups (TEG)

SJ/T 11534-2015 微波电路用覆铜箔聚四氟乙烯玻纤布层压板

本标准规定了微波电路用覆铜箔聚四氟乙烯玻纤布层压板(以下简称覆铜板)的分类、各项技术要求、检验方法、检验规则、标志、包装、储存及运输要求。本标准适用于E玻纤布渍聚四氟乙烯乳液,经烘干、烧结成的聚四氟乙烯预浸料,单面或双面覆铜箔热压制成的覆铜箔层压板。未覆箔层压板也可参照使用。

Copper-clad PTFE woven glass fabric laminate for microwave circuit

BS PD IEC/TS 62878-2-3:2015 设备嵌入式基板 指导方针设计指南

Device embedded substrate. Guidelines. Design guide

IEC 60194:2015 印制板设计、制造和组装.术语和定义

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

Printed board design, manufacture and assembly - Terms and definitions

GOST R IEC 61193-3-2015 质量评估体系. 第3部分. 印制电路板, 层压最终产品及过程审计用抽样方案的选择和使用

Quality assessment systems. Part 3. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

GOST R IEC 61193-1-2015 质量评估体系. 第1部分. 印制版组装件缺陷的登记和分析

Quality assessment systems. Part 1. Registration and analysis of defects on printed board assemblies

DIN EN 61061-3-1 Bb.1:2014 电气用非浸渍致密层压木. 第3部分: 单项材料规格. 活页1: 山毛榉胶合板材制品; 补充件1: 类型对比

Non-impregnated densified laminated wood for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Sheets produced from beech veneer; Supplement 1: Comparison of the types

DIN EN 61061-3-2 Bb.1:2014 电气用非浸渍致密层压木. 第3部分: 单项材料规格. 活页2: 山毛榉胶合板环材; 补充件1: 类型对比

Non-impregnated densified laminated wood for electrical purposes - Part 3: Specifications for individual materials - Sheet 2: Rings produced from beech veneer; Supplement 1: Comparison of the types

BS PD IEC/PAS 61182-12:2014 印刷版组装产品制造描述数据和转移方法的通用要求

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

SJ/T 11050-2014 多层印制板用环氧玻纤布粘结片预浸料

本标准规定了多层印制板用环氧玻纤布粘结片预浸料(以下简称粘结片)的术语和定义、分类、结构和材料、技术要求、检验规则、检验方法及标志、包装、运输及储存要求。 本标准适用于多层印制板用环氧玻纤布粘结片预浸料，本标准中粘结片也可称作预浸料。

Prepreg used as bonding sheet for multilayer printed boards.Epoxy resin-impregnated glass cloth

SJ/T 11481-2014 多层印制板用氰酸酯改性环氧玻纤布粘结片预浸料

Cyanate modified epoxy fiberglass cloth adhesive sheet prepreg for multilayer printed boards

JIS C 61188-7:2014 印制板和印制板组件. 设计和使用. 第7部分: CAD库构建用电子元件零方向

Printed boards and printed board assemblies -- Design and use -- Part 7: Electronic component zero orientation for CAD library construction

DIN EN 61249-4-18:2014 印刷电路板和其他互连结构用材料. 第4-18部分: 非包被预浸材料(多层印制板制造用)分规格组. 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料(垂直燃烧试验)(IEC 61249-4-18-2013); 德文版本EN 61249-4-18-2013

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v

DIN EN 61249-4-19:2014 印刷电路板和其他互连结构用材料. 第4-19部分: 非包被预浸材料(多层印制板制造用)分规格组. 无铅组件用确定易燃性的非卤代环氧化物编织的E玻璃预浸渍材料(垂直燃烧试验)(IEC 61249-4-19-2013); 德文版本EN 61249-4-19-2013

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined

BS PD IEC/PAS 61249-8-1:2014 印制板组装电气绝缘性能和质量手册

Qualification and performance of electrical insulating compound for printed wiring assemblies