L30 印制电路 标准查询与下载
共找到 1035 条与 印制电路 相关的标准，共 69 页
Printed boards. Printed circuit boards for high-brightness LEDs
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-05-31
- 实施
- 2016-05-31
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cy
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-30
- 实施
- 2016-04-30
Water-based cleaning agents for electronics manufacturing
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
Cover plate for printed board drilling
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
本标准规定了电子焊接用免清洗液态助焊剂的分类、技术要求、试验方法、检验规则、标志、包装、运输及储存。本标准适用于印制板组装件及电气和电子电路接点锡焊用免清洗液态助焊剂(以下简称助焊剂)。
No-clean liquid flux
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
Tin slag antioxidant reducing agent
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin
- ICS
- 31.190
- CCS
- L30
- 发布
- 2016-03
- 实施
This part of IEC 62326 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects.
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-02
- 实施
- 2016-02-05
本标准规定了高密度互连印制板(以下简称HDI板)的设计要求。 本标准适用于电子电气产品用的高密度互连印制板。
Design requirements for high density interconnect printed circuit boards
- ICS
- CCS
- L30
- 发布
- 2016-01-19
- 实施
- 2016-03-01
本指导性技术文件给出了印制板钻孔环境、设备、材料、操作和关键工序控制要求。 本指导性技术文件适用于采用环氧材料、聚酰亚胺材料、聚四氟乙烯材料等制成的刚性、挠性或刚挠结合层压板的机械钻孔工艺。
Guide for drilling processing of printed circuit boards
- ICS
- CCS
- L30
- 发布
- 2016-01-19
- 实施
- 2016-03-01
本标准规定了印制板设计与制造的尺寸和公差要求。 本标准适用于印制板。
Printed board dimensions and tolerance
- ICS
- CCS
- L30
- 发布
- 2016-01-19
- 实施
- 2016-03-01
本标准规定了十四层军用刚性印制板的测试图形和布设总图。 本标准规定的测试图形适用于刚性印制板的产品鉴定和能力鉴定。
Test patten for qualification of rigid printed circuit board
- ICS
- CCS
- L30
- 发布
- 2016-01-19
- 实施
- 2016-03-01
Specifications for single and double-sided carbon film printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01-15
- 实施
- 2016-06-01
IEC 61189-3-719:2016 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第3-719部分: 互连结构(印制板)的试验方法. 监测温度循环期间单面金属化通孔(PTH)的电阻变化
This part of IEC 61189 specifies a test method to monitor the resistance of single plated- through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01
- 实施
- 2016-01-08
This part of IEC 61189 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high- brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01
- 实施
- 2016-01-08
Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- ICS
- 31.190;31.240
- CCS
- L30
- 发布
- 2015-11-20
- 实施
Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
- ICS
- 31.190;31.240
- CCS
- L30
- 发布
- 2015-11-20
- 实施
