L30 印制电路 标准查询与下载

GB/T 4677.16-1988 印制板一般检验方法

本标准规定了印制板的外观检验和尺寸检验。 本标准适用于单面、双面和多层印制板。

General examination method for printed boards

GB/T 5489-1985 印制板制图

本标准规定了自动、半自动和手工方法绘制印制板零件图及印制板组装件装配图（以下简称印制板装配图）图样的规则。 本标准未规定微型电路、微型组件和类似产品图样的绘制规则。

Printed board drawing

GB/T 4825.1-1984 印制板导线局部放电测试方法

本标准适用于测量印制板上印制导线间的局部放电。

Test method for partial discharge of conductors on printed boards

GB/T 4825.2-1984 印制板导线载流量测试方法

本标准适用于测试印制板上印制导线通过不同电流时的温升，以确定印制导线的载流量。 本方法是一个比较法，用以确定印制导线材料、导线横截面、基材和工艺对印制板的温度——直流电流特性的影响，推荐并规定一个标准试样。

Test method for current carrying capacity of conductors on printed boards

GB 4725-1992 印制电路用覆铜箔环氧玻璃布层压板

Copper-clad epoxy glass cloth laminates for printed circuits

GB/T 4677.10-1984 印制板可焊性测试方法

本标准适用于具有或不具有金属化孔的单面或双面印制板、多层印制板的可焊性的测试。

Test method of solderability for printed boards

DIN EN IEC 62878-2-5:2021 设备嵌入组装技术. 第2-5部分: 指南. 设备嵌入基材三维数据格式的实现(IEC 62878-2-5-2019); 德文版本EN IEC 62878-2-5-2019

This part of IEC 62878 specifies requirements based on XML schema that represents the design data format for device embedded substrate (as known as FUJIKO: Fukuoka University JIsso K(C)Onsortium-format in Japan), that is, active and passive devices embedded board whose electrical

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019

YD/T 2379.1-2019 电信设备环境试验要求和试验方法 第1部分：通用准则

Environmental test requirements and test methods for telecommunications equipment Part 1: General guidelines

DIN EN 61191-4:2018 印刷电路板组件.第4部分:分规范.接线端焊接组件的要求(IEC 61191-4-2017); 德文版本EN 61191-4-2017

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017

IEC 62899-303-1:2018 印刷电子.第303-1部分:设备.辊间印刷.机械尺寸

This part of IEC 62899 defines standard mechanical dimensions (especially related to the web size) of equipment for printed electronics. This document covers web-based printing equipment, but it can be used for sheet-based products.

Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions

IEC 62899-302-2:2018 印刷电子.第302-2部分:设备.喷墨.液滴体积的成像测量

This part of IEC 62899 specifies the method for determining accurate inkjet droplet volume based on images obtained by drop-in-flight measurement systems. It does not apply to imaging systems using interference fringes, such as holography or phase doppler anemometry. This document is not limited to drop-on-demand inkjet systems, but might not be applicable to continuous inkjet or liquid dispensing systems. This document includes a description of the issues concerning such measurements and consideration of the limits to measurement accuracy.

Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume

SJ/T 11725-2018 印制电路用导热型覆铜箔环氧复合基层压板

Thermal conductive copper-clad epoxy composite base laminate for printed circuits

IEC 61249-2-47:2018 印制板和其他互连结构用材料. 第2-47部分: 覆层和未覆层增强基材. 非卤化环氧化物无纺/机织E-玻璃增强层压板,导热率为2.0w/( m-K ),并具有规定的可燃性(垂直燃烧试验),无铅装配用铜覆层

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (2,0 ± 0,30) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m-K) and defined flammabil

IEC 61249-2-46:2018 印制板和其他互连结构用材料. 第2 - 46部分:复合和未复合增强基材. 非卤化环氧化物非织造/机织E -玻璃增强层压板,导热率(1.5w / ( m - K ))和规定的可燃性(垂直燃烧试验),无铅装配用覆铜板

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal Conductivity is defined to be (1,5 ± 0,2) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1,5 W/(m-K)) and defined flammab

IEC 61249-2-45:2018 印制板和其他互连结构用材料. 第2 - 45部分:覆层和未覆层增强基材. 非卤化环氧化物无纺/机织E -玻璃增强层压板,导热率为1.0w / (m - K),并具有规定的可燃性(垂直燃烧试验),无铅装配用铜覆层

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (1,0 ± 0,15) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m-K) and defined flammabil

IEC 60194-2:2017 印制板设计、制造和装配. 词汇. 第2部分:电子技术以及印刷电路板和电子组装技术的常用

This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

IEC 61191-4:2017 印刷电路板组件 第4部分:分规范 端点焊接组件的要求

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61189-5-503:2017 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第5-503部分: 材料和组合装置的通用试验方法. 电路板导电阳极丝(CAF)试验

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

IEC 62899-301-1:2017 印刷电子. 第301-1部分: 设备. 接触印刷. 刚性母板. 母板外形尺寸的测量方法

This part of IEC 62899 defines measurement terms and methods related to the external dimension of a rigid plate master. Measurement terms include geometrical size such as edge length, edge squareness, edge straightness and thickness, flatness of plate master substrates, and surface roughness of plate master.

Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension