L30 印制电路 标准查询与下载

IEC 61191-3:2017 印刷电路板组件 第3部分:分规范 通孔安装焊接组件的要求

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61189-5-503:2017 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第5-503部分: 材料和组合装置的通用试验方法. 电路板导电阳极丝(CAF)试验

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

DIN EN 61189-5-1:2017 电气材料,印刷电路板和其它互联结构和组件的试验方法.第5-1部分:材料和组件的通用试验方法.印刷电路板组件的指南(IEC 61189-5-1-2016);德文版本EN 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5

IEC 61188-7:2017 印制板和印制板组件.设计和使用.第7部分:用于CAD文库构建的电子元件零方向

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

DIN EN 61189-2-719:2017 电气材料, 印刷电路板和其它互联结构和组件的试验方法.第2-719部分:互连结构材料试验方法.相对介电常数和介质损耗角正切值(500 MHz至10 GHz)(IEC 61189-2-719-2016);德文版本EN 61189-2-719-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719

BS IEC 62899-401:2017 印刷电子. 适印性. 综述

Printed electronics. Printability. Overview

IEC 62899-502-1:2017 印刷电子. 第502-1部分: 质量评估. 普通照明用有机发光二极管(OLED)元件. 柔性基体上成型OLED元件的及机械应力检测

This part of IEC 62899 specifies the quality assessment methods, especially the mechanical stress test methods, for reliability assessment. This document is applicable to flexible OLED elements formed on flexible substrates by printed electronics technology excluding those OLED products, which are intended to be used for lighting purposes.

Printed electronics - Part 502-1: Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates

DIN EN 61249-2-43:2017 印制板和其他互连结构用材料.第2-43部分:包被和非包被增强基材.无铅装配铜用规定阻燃型(垂直燃烧试验)铜包被的无卤环氧纤维素纸/编织E型玻璃增强层压板(IEC 61249-2-43-2016);德文版本EN 61249-2-43-2016

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), co

IEC 62899-401:2017 印刷电子. 第401部分: 适印性. 综述

This part of IEC 62899 provides an introduction to the rest of the IEC 62899-4XX series and explains its modular structure. The IEC 62899-4XX series establishes requirements for the printability of printed electronics. These requirements are stated as measurement of quality, reproducibility, analysis and compliance test methods, as well as measuring methods for environmental conditions. The IEC 62899-4XX series specifies the measurements and the requirements of both the quality and the reproducibility of printed patterns as the result of the interaction of printing media, inks, substrate, and environmental conditions.

Printed electronics - Part 401: Printability - Overview

IEC 62899-402-1:2017 印刷电子. 第402-1部分: 适印性. 质量测量. 型宽

This part of IEC 62899 specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.

Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width

IEC TR 61189-3-914:2017 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第3-914部分: 高亮度LED用印刷线路板热导率的试验方法. 指南

This document specifies the detailed procedures and precautions for IEC 61189-3-913.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

DIN EN 61249-2-44:2017 印制板和其他互连结构用材料.第2-44部分:包被和非包被增强基材.无铅化组装用规定阻燃型(垂直燃烧试验)铜包被的无卤环氧非编织/编织E型玻璃增强层压板(IEC 61249-2-44-2016);德文版本EN 61249-2-44-2016

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-c

IEC TR 62899-250:2016 印刷电子. 第250部分: 可穿戴智能装置的印刷电子所需材料技术

This part of IEC 62899, which is a Technical Report (TR), explores a new technological field to establish standardization activities in TC 119 (Printed electronics) in particular, and to contribute to the development and market expansion of wearable smart device (WSD) technology.

Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices

BS EN 61189-2-719:2016 电气材料, 印刷电路板和其它互联结构和组件的试验方法. 互连结构材料试验方法. 相对介电常数和介质损耗角正切值(500 MHz至10 GHz)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)

SJ/T 11660-2016 印制板钻孔用垫板

Backing plate for drilling holes in printed boards

SJ/T 10188-2016 印制板安装用元器件的设计和使用指南

Design and Use Guidelines for Printed Board Mounting Components

SJ/T 2709-2016 印制板组装件温度测试方法

Temperature test method for printed board assemblies

BS EN 61249-2-44:2016 印制板和其他互连结构用材料. 包被和非包被增强基材. 无铅化组装用规定阻燃型 (垂直燃烧试验) 铜包被的无卤环氧非编织/编织E型玻璃增强层压板

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-

BS EN 61249-2-43:2016 印制板和其他互连结构用材料. 包被和非包被增强基材. 无铅装配用规定阻燃型 (垂直燃烧试验) 铜包被的无卤环氧纤维素纸/编织E型玻璃增强层压板

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for

ANSI/UL 796-2016 印制线路板的安全性标准

UL Standard for Safety Printed-Wiring Boards (Eleventh Edition)