DIN 50441-3-1985 半导体工艺材料的检验.第3部分:半导体切片几何尺寸的测量.第3部分:用多射线干涉法测定抛光切片的平面偏差
Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference