This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.
IEC 60191-6-5-2001由国际电工委员会 IX-IEC 发布于 2001-08。
IEC 60191-6-5-2001 在中国标准分类中归属于: L04 基础标准与通用方法,L40 半导体分立器件综合,在国际标准分类中归属于: 01.100.25 电气和电子工程制图,31.240 电子设备用机械构件。
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