This Design guide for semiconductor packages defines the general outline drawings, dimensions and
tolerances for square-body packages of Plastic Ball Grid Array (P-BG, A), Tape Ball Grid Array (T-BGA) and
Ceramic Ball Grid Array (C-BGA), which are categorized as Form-D in the Recommended Practice on
Standard for the Preparation of Qutline Drawings of Semiconductor Packages, JF_ITA ~D-7300, with a
terminal pitch of 1.0 mm and higher.