JEITA EDR7315B-2006
半导体包装件球栅阵列(BGA)用设计指南

Design guide for semiconductor packages ball grid array(BGA)

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标准号

JEITA EDR7315B-2006

发布

1970年

发布单位

JP-JEITA

 

 

适用范围

This Design guide for semiconductor packages defines the general outline drawings, dimensions and tolerances for square-body packages of Plastic Ball Grid Array (P-BG, A), Tape Ball Grid Array (T-BGA) and Ceramic Ball Grid Array (C-BGA), which are categorized as Form-D in the Recommended Practice on Standard for the Preparation of Qutline Drawings of Semiconductor Packages, JF_ITA ~D-7300, with a terminal pitch of 1.0 mm and higher.

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