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Ion sputtering + gold
Ion sputtering + gold, Total:90 items.
In the international standard classification, Ion sputtering + gold involves: Vacuum technology, FLUID SYSTEMS AND COMPONENTS FOR GENERAL USE, Analytical chemistry, Products of non-ferrous metals, Non-ferrous metals, Semiconducting materials, Jewellery, Electronic tubes, Electronic display devices, Terminology (principles and coordination), Pumps, Materials for aerospace construction, Body care equipment, Electricity. Magnetism. Electrical and magnetic measurements, Linear and angular measurements.
Professional Standard - Electron, Ion sputtering + gold
- SJ 1781-1981 Sputtering ion pump--Testing methods
- SJ 1779-1981 Ordinary two-electrode sputtering ion pump--Parameters series
- SJ 1780-1981 Ordinary two-electrode sputtering ion pump--Performance specification
- SJ/T 10755-1996 Test methods for gold, silver and their alloy brazing for electronic devices - Test method for spatter property
Professional Standard - Machinery, Ion sputtering + gold
German Institute for Standardization, Ion sputtering + gold
- DIN 28429:2003 Vacuum technology - Acceptance specifications for getter ion pumps
- DIN IEC 60562:1980 Measurements of incidental ionizing radiation from electronic tubes
- DIN IEC 60562:1980-05 Measurements of incidental ionizing radiation from electronic tubes
- DIN CEN/TS 15605:2008 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry; German version CEN/TS 15605:2007
- DIN EN 15605:2010-12 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry; German version EN 15605:2010
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Ion sputtering + gold
- GB/T 25755-2010 Vacuum technology.Sputter-ion pumps.Measurement of performance characteristics
- GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film
- GB/T 31227-2014 Test method for the surface roughness by atomic force microscope for sputtered thin films
RU-GOST R, Ion sputtering + gold
- GOST 5.1807-1973 Type-GIN-0,5-1M getter-ion pump. Quality requirements of certified products
- GOST 27973.2-1988 Gold. Method of atomic-emission analysis with inductive plasma
- GOST 5.413-1970 The mater cooled diode type sputter-ion pump NMDI-01-1 (NIRD-100) with the power supply BP-150. Quality requirements for certified products
- GOST R 52371-2005 Tin and lead babbits. Method of inductively coupled plasma atomic-emission spectrometry
- GOST R ISO 22033-2014 Nickel alloys. Determination of niobium. Inductively coupled plasma/atomic emission spectrometric method
- GOST R ISO 22725-2014 Nickel alloys. Determination of tantalum. Inductively coupled plasma atomic emission spectrometric method
American Society for Testing and Materials (ASTM), Ion sputtering + gold
- ASTM E1162-87(2001) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-87(1996) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1438-91(2001) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1438-91(1996) Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
- ASTM E1162-11(2019) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM E1162-06 Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
- ASTM F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM E684-95(2000) Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM E684-04 Standard Practice for Approximate Determination of Current Density of Large-Diameter Ion Beams for Sputter Depth Profiling of Solid Surfaces
- ASTM F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
- ASTM F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
- ASTM F1238-95(1999) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM F2113-01 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
- ASTM F2113-01(2007) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
Professional Standard - Non-ferrous Metal, Ion sputtering + gold
- YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film
- YS/T 819-2012 High-purity sputtering copper target used in electronic film
- YS/T 893-2013 High-purity sputtering titanium target used in electronic film
- YS/T 935-2013 Standard guide for analysis and reporting the impurity content and grade of high purity metallic sputtering targets for electronic thin film applications
工业和信息化部, Ion sputtering + gold
- YS/T 1555-2022 Platinum cobalt chromium boron alloy sputtering target
- YS/T 1357-2020 Chromium-tantalum-titanium alloy sputtering target for magnetic recording
- YS/T 1358-2020 Iron-cobalt-tantalum alloy sputtering target for magnetic recording
British Standards Institution (BSI), Ion sputtering + gold
- BS ISO 17109:2015 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- BS ISO 17109:2022 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin…
- 21/30433862 DC BS ISO 17109 AMD1. Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and…
- BS ISO 22415:2019 Surface chemical analysis. Secondary ion mass spectrometry. Method for determining yield volume in argon cluster sputter depth profiling of organic materials
- BS EN 15605:2010 Copper and copper alloys.Inductively coupled plasma optical emission spectrometry
- BS ISO 22962:2008 Titanium and titanium alloys - Determination of iron - Inductively coupled plasma atomic emission spectrometry
International Organization for Standardization (ISO), Ion sputtering + gold
- ISO 17109:2015 Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
- ISO 17109:2022 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth p
- ISO 22415:2019 Surface chemical analysis — Secondary ion mass spectrometry — Method for determining yield volume in argon cluster sputter depth profiling of organic materials
- ISO 22725:2007 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method
- ISO 22033:2005 Nickel alloys - Determination of niobium - Inductively coupled plasma atomic emission spectrometric method
- ISO 11435:2005 Nickel alloys - Determination of molybdenum - Inductively coupled plasma atomic emission spectrometric method
- ISO 22033:2011 Nickel alloys - Determination of niobium - Inductively coupled plasma/atomic emission spectrometric method
- ISO/TS 18223:2015 Nickel alloys - Determination of Nickel content - Inductively coupled plasma atomic emission spectrometric method
- ISO 22962:2008 Titanium and titanium alloys - Determination of iron - Inductively coupled plasma atomic emission spectrometry
- ISO 11435:2011 Nickel alloys - Determination of molybdenum content - Inductively coupled plasma/atomic emission spectrometric method
Group Standards of the People's Republic of China, Ion sputtering + gold
- T/ICMTIA TG0011-2022 High-purity aluminum and aluminum alloy sputtering targets for integrated circuits
- T/QGCML 018-2020 Negative ion emitter
- T/SZS 4034-2021 Process specification of rhodium film deposited on precious metals jewelry surface by magnetron sputtering
Society of Automotive Engineers (SAE), Ion sputtering + gold
Korean Agency for Technology and Standards (KATS), Ion sputtering + gold
- KS D 1939-2003 Chemical analysis of zinc alloys by inductively coupled plasma emission spectrometric method
- KS D 1674-2009 Methods for inductively coupled plasma spectrometric analysis of trace elements in pure gold
- KS D ISO 22033:2006 Nickel alloys－Determination of niobium－Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22962:2010 Titanium and titanium alloys－Determination of iron－Inductively coupled plasma atomic emission spectrometry
- KS D ISO 11435:2006 Nickel alloys－Determination of molybdenum－Inductively coupled plasma atomic emission spectrometric method
- KS D ISO TS 18223:2018 Nickel alloys — Determination of Nickel content — Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22033:2021 Nickel alloys — Determination of niobium — Inductively coupled plasma/atomic emission spectrometric method
Standard Association of Australia （SAA）, Ion sputtering + gold
- AS 3515.4:2007 Gold and gold bearing alloys - Determination of gold content (greater than 99.95 percent) - Inductively coupled plasma - Atomic emission spectrometry
国家市场监督管理总局、中国国家标准化管理委员会, Ion sputtering + gold
- GB/T 41064-2021 Surface chemical analysis—Depth profiling—Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
Association Francaise de Normalisation, Ion sputtering + gold
- NF A08-920:2008 Nickel alloys - Determination of tantalum - Inductively coupled plasma atomic emission spectrometric method.
- NF ISO 23166:2019 Alliages de nickel - Détermination du tantale - Méthode par spectrométrie d'émission optique avec source à plasma induit par haute fréquence
- NF A08-702*NF EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
- NF EN 10361:2016 Aciers alliés - Détermination du Nickel - Méthode par spectrométrie d'émission optique avec source à plasma induit
European Committee for Standardization (CEN), Ion sputtering + gold
- EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
Danish Standards Foundation, Ion sputtering + gold
- DS/EN 15605:2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
Lithuanian Standards Office , Ion sputtering + gold
- LST EN 15605-2010 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
AENOR, Ion sputtering + gold
- UNE-EN 15605:2011 Copper and copper alloys - Inductively coupled plasma optical emission spectrometry
- UNE 38863:2012 Titanium and titanium alloys. Determination of iron. Inductively coupled plasma atomic emission spectrometry.
KR-KS, Ion sputtering + gold
- KS D ISO TS 18223-2018 Nickel alloys — Determination of Nickel content — Inductively coupled plasma atomic emission spectrometric method
- KS D ISO 22033-2021 Nickel alloys — Determination of niobium — Inductively coupled plasma/atomic emission spectrometric method