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remote semiconductor film

remote semiconductor film, Total:215 items.

In the international standard classification, remote semiconductor film involves: Testing of metals, Semiconductor devices, Insulating fluids, Capacitors, Electromechanical components for electronic and telecommunications equipment, Integrated circuits. Microelectronics, Semiconducting materials, Vacuum technology, Graphical symbols, Valves, Piezoelectric and dielectric devices, Electronic display devices.

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, remote semiconductor film

GB/T 6616-2023 Non-contact eddy current method for testing semiconductor wafer resistivity and semiconductor film sheet resistance
GB/T 6616-1995 Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage
GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge

ECIA - Electronic Components Industry Association, remote semiconductor film

401-1973 Paper@ Paper/Film@ Film Dielectric Capacitors for Power Semiconductor Applications

National Metrological Verification Regulations of the People's Republic of China, remote semiconductor film

JJG(核工) 4-1991 Verification Regulations for Semiconductor Telescopes (Working Class)

British Standards Institution (BSI), remote semiconductor film

BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
BS EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
BS IEC 62951-3:2018 Semiconductor devices. Flexible and stretchable semiconductor devices - Evaluation of thin film transistor characteristics on flexible substrates under bulging
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
BS EN 62374:2008 Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
BS EN 62374:2007 Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
BS IEC 60748-23-5:2003 Semiconductor devices. Integrated circuits - Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approval
BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
BS IEC 62047-30:2017 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
BS EN 62047-14:2012 Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
19/30404655 DC BS EN IEC 63229. Semiconductor devices. The classification of defects in gallium nitride epitaxial film on silicon carbide substrate
BS EN 62047-8:2011 Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices - Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
BS QC 760200:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
BS QC 760100:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
BS IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
BS EN 62047-17:2015 Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
BS QC 760201:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
BS QC 760101:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
BS IEC 60748-23-5:2004 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval
BS IEC 60748-23-4:2002 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification
BS EN 62047-12:2011 Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
BS IEC 60748-23-3:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification. Manufacturers' self-audit checklist and report
BS IEC 60748-23-2:2002 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
18/30383935 DC BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices. Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods

International Electrotechnical Commission (IEC), remote semiconductor film

IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
IEC 62951-3:2018 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
IEC 60748-20:1988/AMD1:1995 Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
IEC 62374:2007 Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
IEC 60748-22-1:1991 Semiconductor devices; integrated cirucits; part 22: section 1: blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
IEC 62047-14:2012 Semiconductor devices - Microelectromechanical devices - Part 14: Forming limit measuring method of metallic film materials
IEC 62047-37:2020 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
IEC 62047-36:2019 Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures; Manufacturing line certification; Generic specification
IEC 60748-23-5:2003 Semiconductor devices - Integrated circuits - Part 23-5: Hybrid integrated circuits and film structures; Manufacturing line certification; Procedure for qualification approval
IEC 62047-12:2011 Semiconductor devices - Microelectromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
IEC 60748-23-4:2002 Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures; Manufacturing line certification; Blank detail specification
IEC 60748-21:1997 Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
IEC 60748-23-2:2002 Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures; Manufacturing line certification; Internal visual inspection and special tests
IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
IEC 60748-23-3:2002 Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures; Manufacturing line certification; Manufacturers' self-audit checklist and report

American National Standards Institute （ANSI), remote semiconductor film

ANSI/EIA 401:1973 Paper, Paper/Film Dielectric Capacitors for Power Semiconductor Applications

Korean Agency for Technology and Standards (KATS), remote semiconductor film

KS C IEC 62951-1:2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
KS C IEC 60748-20:2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-1:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits－Section 1：Requirements for internal visual examination
KS C IEC 60748-20:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 62047-18:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-8:2015 Semiconductor devices ― Micro-electromechanical devices ― Part 8: Strip bending test method for tensile property measurement of thin films
KS C IEC 60748-20-1-2003(2019) Semiconductor devices — Integrated circuits — Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits — Section 1: Requirements for internal visual examination
KS C IEC 62047-8-2015(2020) Semiconductor devices ― Micro-electromechanical devices ― Part 8: Strip bending test method for tensile property measurement of thin films
KS C IEC 60748-23-1:2004 Semiconductor devices-Integrated circuits-Part 23-1:Hybrid integrated circuits and film structures-Manufacturing line certification-Generic specification
KS C IEC 60748-23-1-2004(2019) Semiconductor devices－Integrated circuits－Part 23－1：Hybrid integrated circuits and film structures－Manufacturing line certification－Generic specification
KS C IEC 60748-23-3:2004 Semiconductor devices-Integrated circuits-Part 23-3:Hybrid integrated circuits and film structures-Manufacturing line certification-Manufacturers’ self-audit checklist and report
KS C IEC 60748-23-3-2004(2019) Semiconductor devices－Integrated circuits－Part 23－3：Hybrid integrated circuits and film structures－Manufacturing line certification－Manufacturers’ self－audit checklist and report

KR-KS, remote semiconductor film

KS C IEC 62951-1-2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
KS C IEC 60748-20-2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 62047-18-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials

Danish Standards Foundation, remote semiconductor film

DS/IEC 748-20:1990 Semiconductor devices. Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
DS/IEC 748-21:1993 Semiconductor devices. Integrated circuits. Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure
DS/EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
DS/EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
DS/IEC 748-21-1:1993 Semiconductor devices. Integrated circuits. Part 21: Secdtion one: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure
DS/IEC 748-22-1:1993 Semiconductor devices. Integrated circuits. Part 22: Secdtion one: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
DS/EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
DS/EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
DS/EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
DS/EN 62047-12:2012 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

CZ-CSN, remote semiconductor film

CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Group Standards of the People's Republic of China, remote semiconductor film

T/GVS 005-2022 Testing specification for contrast method of absolute pressure capacitance diaphragm vacuum gauge in the semiconductor equipment

Association Francaise de Normalisation, remote semiconductor film

NF C86-433:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS (APPROVAL PROCEDURES). SECTIONAL SPECIFICATION. SPECIFICATION CECC 64 200.
NF EN 62374:2008 Dispositifs à semiconductors - Essai de rupture diélectrique en fonction du temps (TDDB) pour films diélectriques de grille
NF C86-434:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS (APPROVAL PROCEDURES). (SPECIFICATION CECC 64 201).
NF EN 62047-2:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 2 : méthodes d'essais de traction des matériaux en couche mince
NF EN 62047-18:2014 Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18 : méthodes d'essai de flexion des matériaux en couche mince
NF C86-411:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 100).
NF C96-017*NF EN 62374:2008 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
NF C96-050-18*NF EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials
NF EN 62047-3:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 3 : éprouvettes d'essai normalisée en couche mince pour l'essai de traction
NF C96-050-2*NF EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2 : tensile testing methods of thin film materials.
NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
NF EN 62047-6:2010 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6 : méthodes d'essais de fatigue axiale des matériaux en couche mince
NF C96-050-21*NF EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials
NF C96-050-6*NF EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials
NF EN 62047-21:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21 : méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
NF C96-050-22*NF EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates
NF EN 62047-22:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 22 : méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples
NF C86-412:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 101).
NF C86-413:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 200).
NF C96-050-14*NF EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14 : forming limit measuring method of metallic film materials
NF C96-050-17*NF EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films
NF EN 62047-17:2015 Dispositifs à semiconducteurs - Dispositifs-microélectromécaniques - Partie 17 : méthode d'essai de renflement pour la mesure des propriétés mécaniques des couches minces
NF C96-050-8*NF EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8 : strip bending test method for tensile property measurement of thin films.
NF C86-430:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FIXED FILM RESISTORS NETWORKS. GENERIC SPECIFICATION. SPECIFICATION CECC 64 000.
NF EN 62047-8:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 8 : méthode d'essai de la flexion de bandes en vue de la mesure des propriétés de traction des couches minces
NF C86-414:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 201).
NF C86-431:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FIXED FILM RESISTORS NETWORKS. SECTIONAL SPECIFICATION. SPECIFICATION CECC 64 100.
NF C86-432:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 64 101).
NF C96-050-12*NF EN 62047-12:2012 Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.
NF C96-050-16*NF EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
NF EN 62047-16:2015 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16 : méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS - Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux

German Institute for Standardization, remote semiconductor film

DIN EN 62374:2008-02 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007); German version EN 62374:2007
DIN EN 62047-2:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62374:2008 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007); German version EN 62374:2007
DIN EN 62047-18:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
DIN EN 62047-3:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62047-6:2010-07 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 62047-17:2015-12 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
DIN EN 62047-14:2012-10 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
DIN EN 62047-22:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
DIN EN 62047-8:2011-12 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
DIN EN 62047-21:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
DIN EN 62047-12:2012-06 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
DIN EN 62047-22:2015 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
DIN EN 62047-21:2015 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
DIN EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
DIN EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
DIN EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
DIN EN 62047-16:2015-12 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
DIN EN 62047-12:2012 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011

Defense Logistics Agency, remote semiconductor film

DLA DSCC-DWG-89100 REV B-2002 SEMICONDUCTOR DEVICE, POWER SWITCHING REGULATOR ASSEMBLY
DLA SMD-5962-88645 REV D-2007 MICROCIRCUIT, DIGITAL, CMOS, REMOTE TERMINAL MULTI-PROTOCOL, MONOLITHIC SILICON
DLA SMD-5962-89971-1992 MICROCIRCUIT, DIGITAL, HMOS, REMOTE UNIVERSAL PERIPHERAL INTERFACE, MONOLITHIC SILICON
DLA SMD-5962-88628 REV E-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER REMOTE TERMINAL MONOLITHIC SILICON
DLA SMD-5962-89577 REV J-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER, REMOTE TERMINAL AND MONITOR, MONOLITHIC SILICON
DLA SMD-5962-89501 REV D-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER REMOTE TERMINAL MULTI-PROTOCOL, MONOLITHIC SILICON

IECQ - IEC: Quality Assessment System for Electronic Components, remote semiconductor film

QC 760200-1992 Semiconductor Devices Integrated Circuits Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IEC 748-22 ED 1)
QC 760000-1988 Semiconductor Devices Integrated Circuits Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits (IEC 748-20 ED 1)
QC 760101-1991 Semiconductor Devices - Integrated Circuits Part 21: Section One: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of Qualification Approval Procedure (IEC 748-21-1 ED 1)
QC 760201-1991 Semiconductor Devices Integrated Circuits Part 22: Section One: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IEC 748-22-1 ED l)
QC 760100-1997 Semiconductor Devices - Integrated Circuits - Part 21: Sectional Specification for Film Integrated Circuits on the Basis of Qualification Approval Procedures (ED 2; IEC 60748-21: 1997 ED 2)
QC 760000-1990 Semiconductor Devices Integrated Circuits Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits (IEC 748-20: 1988; AMD 6754; September 1991; AMD 9331 January 15@ 1997)
QC 763000-1994 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Intergrated Circuits and Hybrid Film Intergrated Circuits - Section 1: Requirements for Internal Visual Examination (IEC 748-20-1 ED 1)

United States Navy, remote semiconductor film

NAVY QPL-15508-13-2006 VALVES, REMOTE CONTROL, DIAPHRAGM ACTUATED (FLUID SYSTEMS, 150 AND 250 P.S.I. W.P. 140 DEG. F MAXIMUM)

European Committee for Electrotechnical Standardization（CENELEC）, remote semiconductor film

EN 62374:2007 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
EN 62047-2:2006 Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
EN 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

ES-UNE, remote semiconductor film

UNE-EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
UNE-EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)
UNE-EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
UNE-EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (Endorsed by AENOR in June of 2012.)
UNE-EN 301908-11 V3.2.1:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 300417-5-1 V1.1.3:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (Endorsed by AENOR in September of 2011.)
UNE-EN 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (Endorsed by AENOR in February of 2012.)
UNE-EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)

Japanese Industrial Standards Committee (JISC), remote semiconductor film

JIS C 5630-3:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing
JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials
JIS C 5630-18:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
JIS C 5630-6:2011 Semiconductor devices -- Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials
JIS C 5630-12:2014 Semiconductor devices.Micro-electromechanical devices.Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Lithuanian Standards Office , remote semiconductor film

LST EN 62374-2008 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007)
LST EN 62047-3-2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006)
LST EN 62047-2-2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006)
LST EN 62047-6-2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009)
LST EN 62047-14-2012 Semiconductor devices - Micro-electromechanical devices -- Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012)
LST EN 62047-8-2011 Semiconductor devices - Micro-electromechanical devices -- Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
LST EN 62047-12-2011 Semiconductor devices - Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)

未注明发布机构, remote semiconductor film

BS IEC 60748-23-5:2003(2004) Semiconductor devices — Integrated circuits — Part 23 - 5 : Hybrid integrated circuits and film structures — Manufacturing line certification — Procedure for qualification approval

American Society for Testing and Materials (ASTM), remote semiconductor film

ASTM F1711-96(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
ASTM F1844-97(2002) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
ASTM F1844-97 Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
ASTM F1844-97(2008) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage

国家市场监督管理总局、中国国家标准化管理委员会, remote semiconductor film

GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures