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Half wave plate preparation

Half wave plate preparation, Total:498 items.

In the international standard classification, Half wave plate preparation involves: Integrated circuits. Microelectronics, Protection against fire, Pipeline components and pipelines, Printed circuits and boards, Semiconductor devices, Electric filters, Materials for aerospace construction, Soil quality. Pedology, Cutting tools, Meat, meat products and other animal produce, Welding, brazing and soldering, Wastes, Analytical chemistry, Electromagnetic compatibility (EMC), Veterinary medicine, Fasteners, Equipment for the rubber and plastics industries, Audio, video and audiovisual engineering, Plastics, Photography, Electromechanical components for electronic and telecommunications equipment, Safety of machinery, Industrial automation systems, Electrical engineering in general, Components for electrical equipment, Electronic display devices, Manufacturing processes in the rubber and plastics industries, Products of the chemical industry, Fibre optic communications, Processes in the food industry, Technical drawings, Document imaging applications, Rubber and plastics products, Graphic technology, Mechanical structures for electronic equipment, Power transmission and distribution networks, Radiocommunications, Materials and components for railway engineering, Switchgear and controlgear, Plant and equipment for the food industry, Optical equipment, Telecommunication systems, Rubber, Electricity. Magnetism. Electrical and magnetic measurements, Equipment for the metallurgical industry, Cinematography, Manufacturing forming processes, Pulps, Packaging and distribution of goods in general, Electrical accessories, Surface treatment and coating, Adhesives, Pharmaceutics, Bottles. Pots. Jars, Telecontrol. Telemetering, Iron and steel products, Petroleum products in general, Lubricants, industrial oils and related products, Vocabularies, Geology. Meteorology. Hydrology, Refractories, Valves, Agricultural machines, implements and equipment, Refrigerating technology, Construction materials, Products of non-ferrous metals, Telecommunications in general, Quality, Aircraft and space vehicles in general, Paints and varnishes, Non-destructive testing, Burners. Boilers, Compressors and pneumatic machines, Acoustics and acoustic measurements.

RO-ASRO, Half wave plate preparation

STAS 9528/1-1986 WOODEN SEMI-PRODUCTS FOR CORRUGATED DOWELS
STAS 8990/2-1980 Refrigerating plants GASKETS FOR STEEL FLANGES FOR VALVES AND PIPES Dimensions
STAS 9804/1-1989 Refrigerating equipment OPFN TYPE PISTON REFRIGERATING COMPRESSORS AND SEMI- HERMETICAL PISTON MOTOR- COMPRESSORS General technical requirements for quality

Defense Logistics Agency, Half wave plate preparation

DLA MIL-M-38510/600 VALID NOTICE 4-2012 Microcircuits, Digital, Bipolar, Semicustom (Gate Array) Devices, Monolithic Silicon
DLA KKK-L-370 D NOTICE 3-2001 LINING, FRICTION, (CLUTCH AND BRAKE, METALLIC, METAL-CERAMIC AND SEMI-METALLIC)
DLA KKK-L-370 D-1988 LINING, FRICTION, (CLUTCH AND BRAKE, METALLIC, METAL-CERAMIC AND SEMI-METALLIC)
DLA SMD-5962-90504 REV C-1997 MICROCIRCUIT, DIGITAL, CMOS, BINARY FILTER AND TEMPLATE MATCHER, MONOLITHIC SILICON
DLA SMD-5962-89483 REV D-1996 MICROCIRCUIT, LINEAR, CMOS, QUAD, UNIVERSAL FILTER BUILDING BLOCK, MONOLITHIC SILICON
DLA SMD-5962-84069 REV F-2005 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-89638-1989 MICROCIRCUIT, LINEAR, CMOS CURRENT MODE CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-89725 REV A-1995 MIRCOCIRCUIT, DIGITAL, CMOS, ASYNCHRONOUS, SERIAL CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-89982 REV B-2004 MICROCIRCUIT, DIGITAL, CHMOS, 16-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-90657 REV A-2006 MICROCIRCUIT, DIGITAL, CMOS, UNIVERSAL SERIAL CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-94513 REV C-2006 MICROCIRCUIT, LINEAR, LOW POWER, PULSE WIDTH MODULATOR, MONOLITHIC SILICON
DLA SMD-5962-90544 REV A-2003 MICROCIRCUIT, DIGITAL, CMOS, HIGH PERFORMANCE MICROCONTROLLER MONOLITHIC SILICON
DLA SMD-5962-89947 REV A-2005 MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 12-STAGE RIPPLE-CARRY BINARY COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-85015 REV E-2005 MICROCIRCUIT, DIGITAL, CMOS, SERIAL CONTROLLER INTERFACE, MONOLITHIC SILICON
DLA SMD-5962-77058 REV G-2005 MICROCIRCUIT, DIGITAL, CMOS, 12-BIT BINARY COUNTER, MONOLITHIC SILICON
DLA SMD-5962-94709-1994 MICROCIRCUIT, LINEAR, CMOS, BANG-BANG CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-90543 REV D-2006 MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE DMA CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-85030 REV H-2007 MICROCIRCUIT, HYBRID, LINEAR, PRECISION VOLTAGE REFERENCES, THIN FILM
DLA SMD-5962-88599-1988 MICROCIRCUITS, DIGITAL, CMOS, TIMING CONTROL UNIT, MONOLITHIC SILICON
DLA SMD-5962-96628 REV D-2010 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, RIPPLE CARRY BINARY COUNTER/DIVIDER, MONOLITHIC SILICON
DLA SMD-5962-89596 REV D-2004 MICROCIRCUIT, DIGITAL, NMOS, 16-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-87734 REV B-1992 MICROCIRCUIT, DIGITAL, CMOS, CLOCK GENERATOR AND READY INTERFACE, MONOLITHIC SILICON
DLA SMD-5962-88628 REV E-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER REMOTE TERMINAL MONOLITHIC SILICON
DLA SMD-5962-89514 REV A-2006 MICROCIRCUIT, DIGITAL, CMOS PARALLEL I/O CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-96727 REV B-2001 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-81016 REV F-2006 MICROCIRCUIT, DIGITAL, CMOS, PRESETTABLE BINARY/DECADE UP/DOWN COUNTER, MONOLITHIC SILICON
DLA SMD-5962-95749 REV B-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED HIGH SPEED CMOS, DUAL DECADE RIPPLE COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-89947 REV B-2011 MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 12-STAGE RIPPLE-CARRY BINARY COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96630 REV C-2003 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, BCD-TO-DECIMAL DECODER, MONOLITHIC SILICON
DLA SMD-5962-95737 REV A-1998 MICROCIRCUIT, DIGITAL, RADIATION HARDENED HIGH SPEED CMOS, 4-BIT BINARY RIPPLE COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-88655-1989 MICROCIRCUIT, DIGITAL, FAST, CMOS, OCTAL D-TYPE, FLIP-FLOP, MONOLITHIC SILICON
DLA SMD-5962-89516-1989 MICROCIRCUITS, DIGITAL, CMOS DUAL SERIAL I/O CONTROLLER MONOLITHIC SILICON
DLA SMD-5962-96670 REV B-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, BCD RATE MULTIPLIER, MONOLITHIC SILICON
DLA SMD-5962-97504-1997 MICROCIRCUIT, DIGITAL, CMOS, DUAL 8-TAP FIR FILTER, MONOLITHIC SILICON
DLA SMD-5962-77047 REV G-2005 MICROCIRCUIT, DIGITAL, CMOS, DUAL BINARY TO 1-OF-4 DECODER/DEMULTIPLEXER, MONOLITHIC SILICON
DLA SMD-5962-77048 REV F-2005 MICROCIRCUIT, DIGITAL, CMOS, DUAL BINARY TO 1-OF- 4 DECODER/DEMULTIPLEXER, MONOLITHIC SILICON
DLA SMD-5962-89577 REV J-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER, REMOTE TERMINAL AND MONITOR, MONOLITHIC SILICON
DLA SMD-5962-88775 REV A-1991 MICROCIRCUITS, FAST, CMOS, OCTAL TRANSCEIVER/REGISTER, MONOLITHIC SILICON
DLA SMD-5962-89749 REV B-2008 MICROCIRCUITS, DIGITAL, ADVANCED CMOS, UP/DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK, MONOLITHIC SILICON
DLA SMD-5962-89561 REV B-2004 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, SYNCHRONOUS PRESETTABLE BINARY COUNTER, MONOLITHIC SILICON
DLA SMD-5962-91566 REV C-1996 MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-89501 REV D-2007 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER REMOTE TERMINAL MULTI-PROTOCOL, MONOLITHIC SILICON
DLA SMD-5962-88702 REV A-2003 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL D-TYPE FLIP-FLOP WITH CLOCK ENABLE, MONOLITHIC SILICON
DLA SMD-5962-90564 REV D-2006 MICROCIRCUIT, DIGITAL, CHMOS, SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY, MONOLITHIC SILICON
DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
DLA SMD-5962-89733 REV B-1992 MICROCIRCUITS, DIGITAL, FAST CMOS, UP/DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK, TTL COMPATIBLE, MONOLITHIC SILICON
DLA SMD-5962-96775 REV A-2003 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT INCIDENT-WAVE SWITCHING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-89469 REV B-1994 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-89476-1992 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-84094 REV B-1988 MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, 4-BIT SYNCHRONOUS BCD COUNTER WITH SYNCHRONOUS RESET, MONOLITHIC SILICON
DLA SMD-5962-87756 REV D-2005 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL D-TYPE FLIP-FLOP WITH MASTER RESET, MONOLITHIC SILICON
DLA SMD-5962-88639 REV C-2006 MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL TRANSPARENT LATCH WITH THREESTATE OUTPUTS, TTL COMPATIBLE, MONOLITHIC SILICON
DLA SMD-5962-88718 REV B-2006 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX INVERTER WITH OPEN-DRAIN OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-96648 REV B-1997 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, DECADE COUNTER/DIVIDER, MONOLITHIC SILICON
DLA SMD-5962-87807 REV B-2005 MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, OCTAL D-TYPE FLIP FLOPS WITH ENABLE, MONOLITHIC SILICON
DLA SMD-5962-96604 REV A-1998 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, 10 LINE TO 4 LINE BCD PRIORITY ENCODER, MONOLITHIC SILICON
DLA SMD-5962-95806 REV A-1998 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS, BCD DECADE SYNCHRONOUS COUNTER, MONOLITHIC SILICON
DLA SMD-5962-95808 REV A-1998 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS, SYNCHRONOUS BCD DECADE UP/DOWN COUNTER, MONOLITHIC SILICON
DLA SMD-5962-92234-1993 MICROCIRCUIT, DIGITAL, FAST CMOS 8-BIT IDENTITY COMPARATOR WITH CHIP ENABLE, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON
DLA SMD-5962-87758 REV G-2007 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BIDIRECTIONAL TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-89513 REV B-2006 MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL D REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE, MONOLITHIC SILICON
DLA SMD-5962-95820 REV A-2007 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS STATIC CLOCK CONTROLLER/GENERATOR, MONOLITHIC SILICON
DLA SMD-5962-86009 REV D-2008 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, DUAL BINARY COUNTER, MONOLITHIC SILICON
DLA SMD-5962-96666 REV B-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, BCD-TO-7 SEGMENT LATCH DECODER DRIVERS, MONOLITHIC SILICON
DLA SMD-5962-95718 REV B-2007 MICROCIRCUIT, DIGITAL, CMOS, LATCHUP RESISTANT PRIORITY INTERRUPT CONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-91726 REV A-2008 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUFFER, THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/03612 REV B-2008 MICROCIRCUIT, DIGITAL, CMOS, THREE-PORT CABLE TRANSCEIVER/ARBITER, MONOLITHIC SILICON
DLA SMD-5962-96562 REV A-2001 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, SYNCHRONOUS 4-BIT UP/DOWN BCD DECADE COUNTER, MONOLITHIC SILICON
DLA SMD-5962-96564 REV B-2002 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, SYNCHRONOUS 4-BIT UP/DOWN BINARY COUNTER, MONOLITHIC SILICON
DLA SMD-5962-89593 REV D-1995 MICROCIRCUIT, DIGITAL, CMOS, 32-BIT DMA CONTROLLER WITH INTEGRATED SYSTEM SUPPORT PERIPHERALS, MONOLITHIC SILICON
DLA SMD-5962-87809 REV B-2006 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, OCTAL INVERTING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-95655 REV C-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, OCTAL TRANSPARENT LATCH WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-88706 REV D-2005 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER, WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON

US-ACEI, Half wave plate preparation

IPC TM-650 2.1.1.2-1993 Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)

IPC - Association Connecting Electronics Industries, Half wave plate preparation

IPC TM-650 2.1.1.2A-2004 Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
IPC 9241-2016 Guidelines for Microsection Preparation

British Standards Institution (BSI), Half wave plate preparation

BS EN 60747-16-10:2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
BS 7855-1:1996 Metric rivets for the attachment of friction linings - Specification for semi-tubular rivets
BS EN 62333-3:2010 Noise suppression sheet for digital devices and equipment - Characterization of parameters of noise suppression sheet
BS 6221-12:1992 Printed wiring boards - Specification for mass lamination panels (semi-manufactured multilayer printed boards)
20/30414415 DC BS EN 60747-16-8. Semiconductor devices. Part 16-8. Microwave integrated circuits. Limiters
20/30431960 DC BS EN 60747-16-8. Semiconductor devices. Part 16-8. Microwave integrated circuits. Limiters
BS EN 60204-33:2011 Safety of machinery. Electrical equipment of machines. Requirements for semiconductor fabrication equipment
BS EN 62333-2:2006+A1:2015 Noise suppression sheet for digital devices and equipment - Measuring methods
BS 4584-103.1:1990 Metal-clad base materials for printed wiring boards - Special materials used in connection with printed circuits - Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
BS IEC 62801:2020 Measurement method of a half-wavelength voltage for Mach-Zehnder optical modulator in wireless communication and broadcasting systems
BS 5536:1988 Recommendations for preparation of technical drawings for microfilming
21/30445919 DC BS EN IEC 55011. Fragment 3. Requirements for radio beam wireless power transfer (WPTAAD) equipment
BS ISO 12647-2:1997 Graphic technology - Process control for the manufacture of half-tone colour separations, proof and production prints - Offset lithographic processes
DD IEC/PAS 62593:2008 Measurement method of a half-wavelength voltage for Mach-Zehnder optical modulators in wireless communication and broadcasting systems
BS 5424-2:1987 Low-voltage controlgear - Specification for semiconductor contactors (solid state contactors)
BS ISO 10110-14:2008 Optics and photonics - Preparation of drawings for optical elements and systems - Wavefront deformation tolerance
22/30430766 DC BS EN 60947-10. Low-voltage switchgear and controlgear - Part 10. Semiconductor Circuit-Breakers
BS EN 62333-2:2006 Noise suppression sheet for digital devices and equipment - Measuring methods
19/30397732 DC BS EN 61000-3-2 AMD1. Fragment 1. Electromagnetic compatibility (EMC). Part 3-2. Limits. Limits for harmonic current emissions (equipment input current ≤16 A per phase)
19/30395437 DC BS EN 61000-3-2 AMD1. Fragment 2. Electromagnetic compatibility (EMC). Part 3-2. Limits. Limits for harmonic current emissions (equipment input current ≤16 A per phase)
18/30383448 DC BS EN 60947-4-3. Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
18/30375223 DC BS EN 60947-4-3. Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
BS EN ISO 13000-2:2006 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Preparation of test specimens and determination of properties
BS ISO 12647-1:2013 Graphic technology. Process control for the production of half-tone colour separations, proof and production prints. Parameters and measurement methods
BS EN 60512-23-2:2010 Connectors for electronic equipment. Tests and measurements. Screening and filtering tests. Test 23b. Suppression characteristics of integral filters
CP 143-10:1973 Code of practice for sheet roof and wall coverings - Code of practice for sheet roof and wall coverings. Galvanized corrugated steel. Metric units
13/30266303 DC BS EN 62801. Measurement Method of a Half-Wavelength Voltage for Mach-Zehnder Optical Modulator in Wireless Communication and Broadcasting Systems
PD CEN/TR 10377:2023 Guidelines for the preparation of standard routine methods with wavelength-dispersive X-ray fluorescence spectrometry
BS EN 60947-4-2:2012 Low-voltage switchgear and controlgear. Contactors and motor-starters. AC semiconductor motor controllers and starters
BS EN IEC 60947-4-2:2023 Low-voltage switchgear and controlgear - Contactors and motor-starters. Semiconductor motor controllers, starters and soft-starter
BS ISO/IEC 29103:2011 Information technology. Office equipment. Colour photo test pages for measurement of ink cartridge yield for colour photo printing
BS EN 62333-1:2006 Noise suppression sheet for digital devices and equipment - Definitions and general properties
BS ISO 4661-2:2018 Rubber, vulcanized. Preparation of samples and test pieces. Chemical tests
BS ISO 12647-1:1997 Graphic technology - Process control for the manufacture of half-tone colour separations, proof and production prints - Parameters and measurement methods
BS 7079-D3:1993 Preparation of steel substrates before application of paints and related products. Methods for surface preparation. Hand- and power-tool cleaning
BS EN 62802:2017 Measurement methods of a half-wavelength voltage and a chirp parameter for Mach-Zehnder optical modulators in high-frequency radio on fibre (RoF) systems
BS EN 60947-4-3:2000+A2:2011 Low-voltage switchgear and controlgear. Contactors and motor-starters. AC semiconductor controllers and contactors for non-motor loads
BS EN 60947-4-3:2014 Low-voltage switchgear and controlgear. Contactors and motor-starters. AC semiconductor controllers and contactors for non-motor loads
BS 7079-0:1990 Preparation of steel substrates before application of paints and related products - Introduction
BS 7079-A2:1996 Preparation of steel substrates before application of paints and related products - Visual assessment of surface cleanliness - Preparation grades of previously coated steel substrates after localized removal of previous coatings
BS EN IEC 61000-3-2:2019+A1:2021 Electromagnetic compatibility (EMC) - Limits. Limits for harmonic current emissions (equipment input current ≤16 A per phase)
BS EN 13604:2002 Copper and copper alloys - Products of high conductivity copper for electronic tubes, semiconductor devices and vacuum applications
BS EN ISO 13000-2:2021 Tracked Changes. Plastics. Polytetrafluoroethylene (PTFE) semi-finished products. Preparation of test specimens and determination of properties
BS ISO 12926:2013 Aluminium fluoride for industrial use. Determination of trace elements. Wavelength dispersive X-ray fluorescence spectrometric method using pressed powder tablets
DD IEC/TS 61000-3-5:2009 Electromagnetic compatibility (EMC) - Limits. Limitation of voltage fluctuations and flicker in low-voltage power supply systems for equipment with rated current greater than 75 A
BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
BS 6498:2002 Guide to preparation of microfilm and other microforms that may be required as evidence
17/30364674 DC BS EN 60947-4-2. Low-voltage switchgear and controlgear. Part 4-2. Contactors and motor-starters. AC semiconductor motor controllers and starters
BS EN 61000-3-2:2006+A2:2009 Electromagnetic compatibility (EMC) — Part 3-2: Limits — Limits for harmonic current emissions (equipment input current k 16 A per phase)
BS EN 61000-3-2:2014 Electromagnetic compatibility (EMC). Limits. Limits for harmonic current emissions (equipment input current 16 A per phase)
BS EN 62047-7:2011 Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
BS EN ISO 23553-1:2014 Safety and control devices for oil burners and oil-burning appliances. Particular requirements. Automatic and semi-automatic valves

AR-IRAM, Half wave plate preparation

IRAM OFICIAL 4020 N.I.O.-1956

Association Francaise de Normalisation, Half wave plate preparation

NF S61-706:1966 Fire fighting equipment. Positioning of the lugs or jaws on guillemin-type and self-sealing symmetrical couplings.
NF EN IEC 60747-16-8:2023 Dispositifs à semiconducteurs - Partie 16-8 : circuits intégrés hyperfréquences - Limiteurs
NF C96-016-10*NF EN 60747-16-10:2005 Semiconductor devices - Part 16-10 : Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
NF EN 60747-16-10:2005 Dispositifs à semiconducteurs - Partie 16-10 : format-cadre pour agrément de technologie (TAS) pour circuits intégrés monolithiques hyperfréquences
NF V04-417:1999 Viandes et produits à base de viande - Préparation d'une coupe histologique - Technique en paraffine.
NF C93-305-3*NF EN 62333-3:2012 Noise suppression sheet for digital devices and equipment - Part 3 : characterization of parameters of noise suppression sheet
NF C96-050-7*NF EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection
NF C96-013-6-6*NF EN 60191-6-6:2002 Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
NF EN 60204-33:2012 Sécurité des machines - Équipement électrique des machines - Partie 33 : exigences pour les équipements de fabrication des semi-conducteurs
NF F80-151:1980 Railway transport equipment - Cold fulding radii for flat products - Minimum folding radii for non-ferrous rolled products.
NF EN 62276:2018 Tranches monocristallines pour applications utilisant des dispositifs à ondes acoustiques de surface (OAS) - Spécifications et méthodes de mesure
NF T76-201:1982 Adhesives. Preparation of metallic substrates for testpieces intended for laboratory tests.
NF A09-341:1991 Non-destructive testing - Ultrasonic testing - Monitoring of equipment - Setting using control cards
NF T35-504-1:2001 Preparation of steel substrates before application of paints and related products - Surface preparation methods - Part 1 : general principles.
NF T35-504-2:2001 Preparation of steel substrates before application of paints and related products - Surface preparation methods - Part 2 : abrasive blast-cleaning.
XP A06-379*XP CR 10299:1999 Guidelines for the preparation of standard routine methods with wavelength-dispersive X-ray fluorescence spectrometry
NF EN 62047-7:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 7 : filtre et duplexeur BAW MEMS pour la commande et le choix des fréquences radioélectriques
NF T35-520:1997 Paints and varnishes - Preparation of steel substrates already coated - High-pressure water jetting cleaning
NF T51-550-2:2006 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2 : preparation of test specimens and determination of properties.
NF X20-217:1986 Gas analysis. Preparation of calibration gas mixtures. Dynamic volumetric methods. Part 6 : sonic orifices.
NF C93-305-2*NF EN 62333-2:2006 Noise suppression sheet for digital devices and equipment - Part 2 : measuring methods
NF C63-112*NF EN 60947-4-2:2012 Low-voltage switchgear and controlgear - Part 4-2 : contactors and motor-starters - AC semiconductor motor controllers and starters
NF T51-550-2*NF EN ISO 13000-2:2021 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2 : preparation of test specimens and determination of properties
NF EN 61249-4-17:2014 Matériaux pour cartes imprimées et autres structures d'interconnexion - Partie 4-17 : série de spécifications intermédiaires pour matériaux pré-imprégnés, non plaqués (pour la fabrication des cartes multicouches) - Tissu de verre époxyde pr...
NF EN 61249-4-15:2014 Matériaux pour cartes imprimées et autres structures d'interconnexion - Partie 4-15 : série de spécifications intermédiaires pour matériaux pré-imprégnés, non plaqués (pour la fabrication des cartes multicouches) - Tissu de verre époxyde pr...
NF EN 61249-4-16:2014 Matériaux pour cartes imprimées et autres structures d'interconnexion - Partie 4-16 : série de spécifications intermédiaires pour matériaux pré-imprégnés, non plaqués (pour la fabrication des cartes multicouches) - Tissu de verre époxyde pr...
NF EN ISO 17664-1:2021 Traitement de produits de soins de santé - Informations relatives au traitement des dispositifs médicaux à fournir par le fabricant du dispositif - Partie 1 : dispositifs médicaux critiques et semi-critiques
NF P98-622:1991 Horizontal road marking. Markings applied on the roads. Analysis of binders by semi-preparative gel adsorption chromatography.
NF EN ISO 13000-2:2021 Plastiques - Semi-produits en polytétrafluoroéthylène (PTFE) - Partie 2 : préparation des éprouvettes et détermination des propriétés
NF C93-400-23-2*NF EN 60512-23-2:2011 Connectors for electronic equipment - Tests and measurements - Part 23-2 : screening and filtering tests - Test 23b : suppression characteristics of integral filters
NF T35-504-3:2001 Preparation of steel substrates before application of paints and related products - Surface preparation methods - Part 3 : hand- and power-tool cleaning.
NF C93-305-1*NF EN 62333-1:2006 Noise suppression sheet for digital devices and equipment - Part 1 : definitions and general properties
NF C63-113/A2:2011 Low-voltage switchgear and controlgear - Part 4-3 : contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads.
NF C63-113*NF EN 60947-4-3:2014 Low-voltage switchgear and controlgear - Part 4-3 : contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
NF C96-013-1*NF EN 60191-1:2013 Mechanical standardization of semiconductor devices - Part 1 : general rules for the preparation of outline drawings of discrete devices
NF S31-123:1986 Acoustics. Noise emitted by refrigeration equipments with hermetic and accessible hermetic compressors. Test code for measuring the sound power.
NF C91-003-2*NF EN IEC 61000-3-2:2019 Electromagnetic compatibility (EMC) - Part 3-2 : limits - Limits for harmonic current emissions (equipment input current less than or equal to 16 A per phase)
NF C91-003-2/A1*NF EN IEC 61000-3-2/A1:2021 Electromagnetic compatibility (EMC) - Part 3-2 : limits - Limits for harmonic current emissions (equipment input current less than or equal to 16 A per phase)

Korean Agency for Technology and Standards (KATS), Half wave plate preparation

KS C 6454-1995 General rules of prepreg for multilayer printed wiring boards
KS C IEC 60204-33-2010(2020) Safety guideline for semiconductor fabrication equipment
KS M 3909-1987(2001) DIMENSIONS FOR PHOTOGRAPHIC SHEET FILMS FOR GENERAL USE
KS M 3909-1987 DIMENSIONS FOR PHOTOGRAPHIC SHEET FILMS FOR GENERAL USE
KS C IEC 60204-33:2010 Safety guideline for semiconductor fabrication equipment
KS M ISO 5269-1:2021 Pulps — Preparation of laboratory sheets for physical testing —Part 1: Conventional sheet-former method
KS M ISO 5269-1:2016 Pulps－Preparation of laboratory sheets for physical testing－Part 1：Conventional sheet-former method
KS C IEC 62047-7-2015(2020) SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
KS C IEC 62047-7:2015 SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
KS M ISO 4661-2:2009 Rubber, vulcanized-Preparation of samples and test pieces-Part 2:Chemical tests
KS M ISO 13000-2-2013(2018) Plastics ㅡ Polytetrafluoroethylene (PTFE) semi-finished products ㅡ Part 2: Preparation of test specimens and determination of properties
KS M ISO 13000-2:2013 Plastics ㅡ Polytetrafluoroethylene (PTFE) semi-finished products ㅡ Part 2: Preparation of test specimens and determination of properties
KS M ISO 13000-2:2011 Plastics-Polytetrafluoroethylene(PTFE) semi-finished products-Part 2:Preparation of test specimens and determination of properties
KS C 9610-3-2-2017 Electromagnetic compatibility(EMC) ― Part 3―2： Limits ― Limits for harmonic current emissions(equipment input current ≤ 16 A per phase
KS C IEC 62333-1:2008 Noise suppression sheet for digital devices and equipment－Part 1：Definitions and general properties
KS C IEC 60947-4-3:2012 Low-voltage switchgear and controlgear－Part 4-3：Contactors and motor-starters－AC semiconductor controllers and contactors for non-motor loads
KS C IEC 60947-4-3-2012(2022) Low-voltage switchgear and controlgear－Part 4-3：Contactors and motor-starters－AC semiconductor controllers and contactors for non-motor loads
KS C IEC 60947-4-3-2012(2017) Low-voltage switchgear and controlgear－Part 4-3：Contactors and motor-starters－AC semiconductor controllers and contactors for non-motor loads
KS B ISO 10110-14-2010(2020) Optics and photonics－Preparation of drawings for optical elements and systems－Part 14：Wavefront deformation tolerance

Professional Standard - Electron, Half wave plate preparation

SJ/T 11742-2019 Thermal conductive semi-solidifying sheets of non-prepreg for printed circuits
SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources

YU-JUS, Half wave plate preparation

JUS N.R1.520-1988 Seml?ouductor devices. Preparat ion of draurings
JUS M.C3.365-1989 Plain bearings. Methods of dimensional control. Peripheral . leugth checking of thin-walled half bearings

Group Standards of the People's Republic of China, Half wave plate preparation

T/GDEIIA 17-2021 Microwave Oven Special Chip Integrated Design Standard
T/NSSQ 008-2022 Specification for preparation of graphene surface acoustic wave filter structure
T/SDEPI 036-2023 Full/semi-automatic soil sample preparation method
T/CVMA 69-2021 Technical specification for animal blood smear preparation
T/QGCML 1339-2023 Specification for the preparation of antifungal flutrimazole shampoo preparations
T/CIRA 32-2022 Radiation processing of preparation of foamed sheet by electron beam
T/ZJATA 0017-2023 Chemical vapor deposition (CVD) epitaxy equipment for preparing silicon carbide semiconductor materials
T/CVMA 67-2021 Technical specification for acquisition and preparation of cytology specimen
T/SDAS 637-2023 Preparation process of micro-laminated gradient functional ceramic composite inserts
T/ZGM 014-2023 Technical specifications of degasification membrane products certification for ultrapure water in the semiconductor industry
T/ZGM 013-2023 Technical specifications of electrodeionization stacks products certification for ultrapure water in semiconductors industry
T/NJ 1363-2023 Specification for preparation of wear-resistant layer on the surface of cutting drum blades of silage harvester
T/ZGM 011-2023 Technical requirements for product certification of ultrafiltration membrane module for ultrapure water in the semiconductor industry
T/ZGM 012-2023 Technical specifications of spiral wound reverse osmosis membrane products certification for ultra pure water in semiconductors industry

Danish Standards Foundation, Half wave plate preparation

DS/EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
DS/EN 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
DS/EN 62333-3:2010 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet
DS/EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
DS/ISO 4661-1:1989 Rubber, vulcanized. Preparation of samples and test pieces. Part 1: Physical tests
DS/ISO 4661-2:1990 Rubber, vulcanized. Preparations of samples and test pieces. Part 2: Chemical tests
DS/ISO 13000-2:2021 Plastics – Polytetrafluoroethylene (PTFE) semi-finished products – Part 2: Preparation of test specimens and determination of properties
DS/EN 60947-4-2:2012 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters
DS/EN 61000-3-2/A2:2009 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current <= 16 A per phase)
DS/EN 61000-3-2/A1:2009 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current <= 16 A per phase)
DS/EN 61000-3-2:2006 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current <= 16 A per phase)
DS/ETS 300135:1994 Radio Equipment and Systems. Angle-modulated Citizens' Band radio equipment (CEPT PR 27 Radio Equipment). Technical characteristics and methods of measurement
DS/EN ISO 13000-2:2006 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties
DS/EN ISO 13000-2:2021 Plastics – Polytetrafluoroethylene (PTFE) semi-finished products – Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2021)
DS/EN 60947-4-3/A2:2011 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
DS/EN 60947-4-3/A1:2007 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
DS/EN 60947-4-3:2001 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
DS/EN 300135-1 V1.2.1:2008 Electromagnetic compatibility and Radio spectrum Matters (ERM); Land Mobile Service; Citizens' Band (CB) radio equipment; Angle-modulated Citizens' Band radio equipment (PR 27 Radio Equipment); Part 1: Technical characteristics and methods of measurement

European Committee for Electrotechnical Standardization（CENELEC）, Half wave plate preparation

EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
EN 60747-16-10:2004 Semiconductor devices Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
EN 62333-3:2010 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet
HD 147-1974 Preparation of Outline Drawings of Oscilloscope and Picture Tubes
FprEN IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
EN 60947-4-2:2012 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters
EN IEC 61000-3-2:2019/A1:2021 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current ≤16 A per phase)
EN 62802:2017 Measurement methods of a half-wavelength voltage and a chirp parameter for Mach-Zehnder optical modulators in highfrequency radio on fibre (RoF) Systems
EN IEC 60947-4-2:2023 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - Semiconductor motor controllers, starters and soft-starters
EN 60947-4-3:2014 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
EN 62333-2:2006 Noise suppression sheet for digital devices and equipment Part 2: Measuring methods

American National Standards Institute （ANSI), Half wave plate preparation

BS EN IEC 60747-16-8:2022 Semiconductor devices Microwave integrated circuits. Limiters (British Standard)
ANSI/EIA 540GAAA:1993 Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use with Electronic Equipment

U.S. Military Regulations and Norms, Half wave plate preparation

ARMY MIL-C-51540 A VALID NOTICE 2-2004 CONTROL MODULE (FOR THE M84 FILTER UNIT)
ARMY MIL-C-51540 A NOTICE 1-1995 CONTROL MODULE (FOR THE M84 FILTER UNIT)
ARMY MIL-C-51540 A-1994 CONTROL MODULE (FOR THE M84 FILTER UNIT)

HU-MSZT, Half wave plate preparation

German Institute for Standardization, Half wave plate preparation

DIN EN 60747-16-10:2005 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
DIN EN 60747-16-10:2005-03 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
DIN EN IEC 60747-16-8:2021-07 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 47E/735/CD:2020); Text in English / Note: Date of issue 2021-06-04
DIN EN 62333-3:2010-09 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet (IEC 62333-3:2010); German version EN 62333-3:2010
DIN 6774-5:1985 Technical drawings; principles of execution; principles for the preparation of drawings for working transparencies
DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN IEC 60747-16-8:2021 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 47E/735/CD:2020); Text in English
DIN 51460-1:2007-11 Testing of petroleum products - Method for sample preparation - Part 1: Microwave incineration
DIN ISO 11418-4:2005 Containers and accessories for pharmaceutical preparations - Part 4: Tablet glass bottles (ISO 11418-4:2005); text in German and English
DIN 51460-1:2007 Testing of petroleum products - Method for sample preparation - Part 1: Microwave incineration
DIN EN 62047-7:2012-02 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
DIN EN 62333-2:2007 Noise suppression sheet for digital devices and equipment - Part 2: Measuring methods (IEC 62333-2:2006); German version EN 62333-2:2006
DIN 16906:2015-01 Testing of plastic sheeting and plastic films - Sample and specimen - Preparation and conditioning
DIN EN 62333-3:2010 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet (IEC 62333-3:2010); German version EN 62333-3:2010
DIN EN 60947-4-2:2007 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters (IEC 60947-4-2:1999 + A1:2001 + A2:2006); German version EN 60947-4-2:2000 + A1:2002 + A2:2006
DIN EN 60191-6-6:2002 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version
DIN EN 60191-6-5:2002 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version
DIN EN 62801:2014 Measurement Method of a Half-Wavelength Voltage for Mach-Zehnder Optical Modulator in Wireless Communication and Broadcasting Systems (IEC 103/120/CDV:2013); English version FprEN 62801:2013
DIN EN ISO 13000-2:2021-11 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2021); German version EN ISO 13000-2:2021
DIN EN 62333-1:2007 Noise suppression sheet for digital devices and equipment - Part 1: Definitions and general properties (IEC 62333-1:2006); German version EN 62333-1:2006
DIN 8905-1:1983 Tubes for refrigerating systems with hermetic and semi-hermetic compressors; outside diameter up to 54 mm; technical delivery conditions

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Half wave plate preparation

GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures
GB/T 43136-2023 Superabrasive products: grinding wheels for precision scribing of semiconductor chips
GB/T 30244-2013 Oscillographic polarograph and its test solution
GB/T 42709.7-2023 Semiconductor devices microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
GB/T 29845-2013 Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment
GB 14048.6-1998 Low-voltage switchgear and controlgear. Contactors and motor-starters. Section 2: AC semiconductor motor controllers and starters
GB/T 17037.3-2003 Plastics--Injection moulding of test specimens of thermoplastic materials--Part 3: Small plates
GB/T 14048.12-2006 Low voltage switchgear and controlgear Part 4-3: Contactors and motor starters AC semiconductor controllers and contactors for non motor loads
GB/T 14048.12-2016 Low-voltage switchgear and controlgear Part 4-3: Contactors and motor starters for AC semiconductor controllers and contactors for non-motor loads
GB/Z 17624.4-2019 Electromagnetic compatibility—General—Historical rationale for the limitation of power-frequency conducted harmonic current emissions from equipment,in the frequency range up to 2 kHz
GB 14048.6-2008 Low-voltage switchgear and controlgear.Part 4-2:Contactors and motor-starters.AC semiconductor motor controllers and starters(including soft-starter)
GB/T 14048.6-2016 Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters)

International Electrotechnical Commission (IEC), Half wave plate preparation

IEC 60747-16-8:2022 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
IEC 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
IEC 62333-3:2010 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet
IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
IEC 60204-33:2009 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
IEC PAS 62593:2008 Measurement method of a half-wavelength voltage for Mach-Zehnder optical modulators in wireless communication and broadcasting systems
IEC 62801:2020 Measurement method of a half-wavelength voltage for Mach-Zehnder optical modulator in wireless communication and broadcasting systems
IEC 60158-2:1982 Low-voltage controlgear. Part 2 : Semiconductor contactors (solid state contactors)
IEC 62802:2017 Measurement method of a half-wavelength voltage and a chirp parameter for Mach-Zehnder optical modulator in high-frequency radio on fibre (RoF) systems
IEC 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
IEC 62333-2:2006 Noise suppression sheet for digital devices and equipment - Part 2: Measuring methods
IEC 60947-4-2/COR1:2002 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters; Corrigendum 1
IEC 60947-4-2/AMD1/COR1:2002 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters; Corrigendum 1
IEC 60947-4-2:2011 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters
IEC 60947-4-2:2007 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters
IEC 60947-4-2:2020 Low-voltage switchgear and controlgear – Part 4-2: Contactors and motor-starters – Semiconductor motor controllers, starters and soft-starters
IEC 60947-4-3:2011 Low-voltage switchgear and controlgear. Part 4-3: Contactors and motor-starters.AC semiconductor controllers and contactors for non-motor loads
IEC 60947-4-3:1999 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
IEC 60947-4-2/AMD1:2001 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters; AC semiconductor motor controllers and starters; Amendment 1
IEC 60947-4-3/COR1:2000 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads; Corrigendum 1
IEC 60947-4-3/AMD1:2006 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads; Amendment 1
IEC 60947-4-2/AMD2:2006 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters; Amendment 2
IEC 60947-4-2:2002 Low-voltage switchgear and controlgear-Part4-2:Contactors and motor-starters-AC semiconductor motor controllers and starters (including soft-starter)

ES-UNE, Half wave plate preparation

UNE-EN IEC 60747-16-8:2023 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (Endorsed by Asociación Española de Normalización in February of 2023.)
UNE-EN 60747-16-10:2004 Semiconductor devices -- Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (Endorsed by AENOR in November of 2004.)
UNE-EN 62333-3:2010 Noise suppression sheet for digital devices and equipment -- Part 3: Characterization of parameters of noise suppression sheet (Endorsed by AENOR in June of 2010.)
UNE-EN 60204-33:2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (Endorsed by AENOR in December of 2011.)
UNE-EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (Endorsed by AENOR in November of 2011.)
UNE-EN 60512-23-2:2010 Connectors for electronic equipment - Tests and measurements -- Part 23-2: Screening and filtering tests - Test 23b: Suppression characteristics of integral filters (Endorsed by AENOR in November of 2010.)
UNE-EN IEC 61000-3-2:2019 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current =16 A per phase)
UNE-EN IEC 61000-3-2:2019/A1:2021 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current =16 A per phase)
UNE-EN ISO 13000-2:2022 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2021)

Japanese Industrial Standards Committee (JISC), Half wave plate preparation

JIS C 6521:1996 Test methods of prepreg for multilayer printed wiring boards
JIS C 6520:1993 General rules of prepreg for multilayer printed wiring boards
JIS C 6522:1996 Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
JIS C 5569:1991 Method of measurement of speed fluctuations in sound recording and reproducing equipment
JIS B 9960-33:2012 Safety of machinery -- Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment
JIS C 6524:1995 Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth
JIS K 6250:2006 Rubber -- General procedures for preparing and conditioning test pieces for physical test methods
JIS K 6250:2019 Rubber -- General procedures for preparing and conditioning test pieces for physical test methods
JIS C 6523:1995 Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth
JIS K 7137-2:2001 Plastics -- Polytetrafluoroethylene (PTFE) semi-finished products -- Part 2: Preparation of test specimens and determination of properties

AIA/NAS - Aerospace Industries Association of America Inc., Half wave plate preparation

NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type

American Society for Testing and Materials (ASTM), Half wave plate preparation

ASTM E431-96(2016) Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices
ASTM D3183-02 Standard Practice for Rubber8212;Preparation of Pieces for Test Purposes from Products
ASTM D3183-09 Standard Practice for Rubberx2014;Preparation of Pieces for Test Purposes from Products
ASTM D3183-10(2015) Standard Practice for Rubber&x2014;Preparation of Pieces for Test Purposes from Products
ASTM D3183-07 Standard Practice for Rubber8212;Preparation of Product Pieces for Test Purposes from Products
ASTM B594-97 Standard Practice for Ultrasonic Inspection of Aluminum-Alloy Wrought Products for Aerospace Applications
ASTM B594-02 Standard Practice for Ultrasonic Inspection of Aluminum-Alloy Wrought Products for Aerospace Applications
ASTM B594-06 Standard Practice for Ultrasonic Inspection of Aluminum-Alloy Wrought Products for Aerospace Applications
ASTM B594-09 Standard Practice for Ultrasonic Inspection of Aluminum-Alloy Wrought Products for Aerospace Applications
ASTM B594-13 Standard Practice for Ultrasonic Inspection of Aluminum-Alloy Wrought Products
ASTM D3183-10 Standard Practice for Rubberx2014;Preparation of Pieces for Test Purposes from Products
ASTM D5166-97 Standard Practice for Laboratory Preparation of Gelled Vehicle Samples Using a Microwave Oven
ASTM D5166-97(2003) Standard Practice for Laboratory Preparation of Gelled Vehicle Samples Using a Microwave Oven
ASTM D5166-97(2008) Standard Practice for Laboratory Preparation of Gelled Vehicle Samples Using a Microwave Oven
ASTM D5166-97(2008)e1 Standard Practice for Laboratory Preparation of Gelled Vehicle Samples Using a Microwave Oven
ASTM D5166-97(2016) Standard Practice for Laboratory Preparation of Gelled Vehicle Samples Using a Microwave Oven
ASTM D1669/D1669M-07(2013)e1 Standard Practice for Preparation of Test Panels for Accelerated and Outdoor Weathering of Bituminous Coatings
ASTM D1669-01 Standard Practice for Preparation of Test Panels for Accelerated and Outdoor Weathering of Bituminous Coatings
ASTM D1669-07 Standard Practice for Preparation of Test Panels for Accelerated and Outdoor Weathering of Bituminous Coatings
ASTM D1669-07(2013) Standard Practice for Preparation of Test Panels for Accelerated and Outdoor Weathering of Bituminous Coatings
ASTM E1645-21 Standard Practice for Preparation of Dried Paint Samples by Hotplate or Microwave Digestion for Subsequent Lead Analysis
ASTM E1645-20 Standard Practice for the Preparation of Dried Paint Samples by Hotplate or Microwave Digestion for Subsequent Lead Analysis
ASTM E1645-20a Standard Practice for the Preparation of Dried Paint Samples by Hotplate or Microwave Digestion for Subsequent Lead Analysis
ASTM D3182-15 Standard Practice for Rubber—Materials, Equipment, and Procedures for Mixing Standard Compounds and Preparing Standard Vulcanized Sheets
ASTM D3182-16 Standard Practice for Rubber&x2014;Materials, Equipment, and Procedures for Mixing Standard Compounds and Preparing Standard Vulcanized Sheets

Professional Standard - Agriculture, Half wave plate preparation

NY/T 232.3-1994 Rubber equipment basic parts hammer

Aerospace Industries Association, Half wave plate preparation

AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type

RU-GOST R, Half wave plate preparation

GOST R 56579-2015 Semi-prepared meat-contained ground products for children nutrition. Specifications
GOST 31936-2012 Semi-prepared poultry meat and poultry offal. General specifications
GOST R 55790-2013 Semi-prepared ground of poultry meat for children nutrition. Specifications
GOST 17227-1971 pH-measuring. Tablets for preparing the working buffer solutions
GOST 30146-1995 Machines and equipment for production of sausage products and meat semi-finished products. General specifications
GOST R 50638-1994 Electromagnetic compatibility of technical equipment. Semicondactor microvawe oscillator devices and modules. List of EMC parameters and requirements for them. Methods of measurement
GOST 33338-2015 Semi-prepared ground ready-to-heat-and-eat of poultry meat for children nutrition. Specifications
GOST IEC 60947-4-3-2014 Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor starters. AC semiconductor controllers and contactors for non-motor loads
GOST R 50396.0-2013 Poultry meat, edible offal and semi-prepared products from poultry meat. Sampling methods and preparing for microbiological examinations
GOST R 51317.3.2-2006 Electromagnetic compatibility of technical equipment. Harmonic current emissions (equipment input current <=16 A per phase). Limits and test methods
GOST R 51317.3.2-1999 Electomagnetic compatibility of technical equipment. Harmonic current emissions (equipment input current < 16 A per phase). Limits and test methods
GOST R 52745-2007 Complex quality control system. Quality control for materials and semi-finished products used in the process of production of articles of aviation, space and defence equipment and double application equipment at enterprises-suppliers. General requirements
GOST R 52745-2021 Complex quality control system. Conformity assessment of materials, semi-finished products and other products used in the process of manufacture of products for aircraft and other civil, defense and dual use equipment at enterprises-suppliers. General req
GOST R 51317.3.4-2006 Electromagnetic compatibility of technical equipment. Limitation of emission of harmonic currents in low-voltage power supply systems for equipment with rated current greater than 16 A. Limits and test methods
GOST R 51317.3.5-2006 Electromagnetic compatibility of technical equipment. Limitation of voltage fluctuations and flicker in low-voltage power supply systems for equipment with rated current greater than 16 A. Limits and test methods
GOST 21397-1981 Non-destructive testing. Set of standard samples for ultrasonic testing semi-finished and aluminium alloy products. Specifications

Association of German Mechanical Engineers, Half wave plate preparation

DVS 2216-5-1995
DVS 2216-6-2002 Ultrasonic joining of mouldings and semi-finished products made of amorphous thermoplastics in series fabrication
DVS 2216-6-2013 Ultrasonic joining of mouldings and semi-finished products made of amorphous thermoplastics in series fabrication
DVS 2216-1-1991
DVS 2216-2-1991
DVS 2216-3-1991
DVS 2216-6-2001
DVS 2216-1-1992 Ultrasonic joining of moulded parts and semi-finished parts of thermoplastic polymers in mass production - Machines and equipment - Function description and requirements
DVS 2216-4-1991
DVS 2216-3-1992 "Ultrasonic joining of moulded parts and semi-finished parts of thermoplastic polymers in mass production, forming with ultrasound, staking, swaging and tamping"

Professional Standard - Machinery, Half wave plate preparation

JB/T 11645-2013 Pulverization equipment of calcium carbide dreg for semi-dry flue gas desulphurization
JB/T 7659.4-2013 Accessorial equipment for freon refrigerant equipment.Part 4: Fin type heat exchanger

工业和信息化部, Half wave plate preparation

SJ/T 11762-2020 Semiconductor equipment manufacturing information labeling requirements
SJ/T 11763-2020 Specification for human-machine interface for semiconductor manufacturing equipment

Professional Standard - Coal, Half wave plate preparation

MT 116.3-1986 Preparation method of coal rock analysis sample Part 3 Preparation method of coal rock thin section and light thin section
MT 116.1-1986 Preparation method of coal rock analysis sample Part 1 Preparation method of coal brick light slice
MT 116.2-1986 Preparation method of coal rock analysis sample Part 2 Preparation method of block coal light slice

Beijing Provincial Standard of the People's Republic of China, Half wave plate preparation

DB11/ 078-1997 Beijing Industrial Rectification Equipment Harmonic Limitation

Electronic Components, Assemblies and Materials Association, Half wave plate preparation

ECA 540A000-A-1990 Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment

Professional Standard - Petrochemical Industry, Half wave plate preparation

SH/T 0218-1992 Anti-rust oil test piece preparation method
SH/T 0218-1993 Anti-rust oil test piece preparation method

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Half wave plate preparation

IPC TM-650 2.1.1.2-2004 Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate) Revision A

GOSTR, Half wave plate preparation

GOST 9284-1975 Slides for micropreparations. Specifications
GOST IEC 60947-4-3-2017 Low-voltage switchgear and controlgear. Part 4-3. Contactors and motor-starters. AC semiconductor controllers and contactors for non-motor loads
GOST IEC 60947-4-2-2017 Low-voltage switchgear and controlgear. Part 4-2. Contactors and motor-starters. AC semiconductor motor controllers and starters for AC electric motors

国家市场监督管理总局、中国国家标准化管理委员会, Half wave plate preparation

GB/T 36646-2018 Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy
GB/T 40675.3-2021 Noise suppression sheet for digital devices and equipment—Part 3: Characterization of parameters of noise suppression sheet
GB/T 41074-2021 Microbeam analysis—Method of specimen preparation for analysis of general powders using WDS and EDS
GB/T 39714.2-2020 Plastics—Polytetrafluoroethylene(PTFE) semi-finished products—Part 2:Preparation of test specimens and determination of properties
GB/T 40675.2-2021 Noise suppression sheet for digital devices and equipment—Part 2: Measuring methods
GB/T 40675.1-2021 Noise suppression sheet for digital devices and equipment—Part 1: Definitions and general properties

Building Officials and Code Administrators International(U.S.), Half wave plate preparation

BOCA ARTICLE 18 NFPC COMM-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials
BOCA ARTICLE 18 NFPC-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials Eighth Edition

Society of Automotive Engineers (SAE), Half wave plate preparation

SAE MA4812-2018 INSERT - THIN WALL, METRIC SHORT AND LONG HOLE PREPARATION FOR
SAE AMS3092B-2021 Release Agent, for Use During Form-in-Place Gasket Preparation
SAE AMS3092A-2015 Release Agent@ for Use During Form-In-Place Gasket Preparation

Liaoning Provincial Standard of the People's Republic of China, Half wave plate preparation

DB21/T 2080-2013 Preparation of polyethylene molded test pieces and test specimens

Lithuanian Standards Office , Half wave plate preparation

LST EN 60747-16-10-2004 Semiconductor devices. Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004)
LST EN 60747-16-3-2003/A1-2009 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A1:2009)
LST EN 62333-3-2010 Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet (IEC 62333-3:2010)
LST EN 60204-33-2011 Safety of machinery - Electrical equipment of machines -- Part 33: Requirements for semiconductor fabrication equipment (IEC 60204-33:2009, modified)
LST EN 62047-7-2011 Semiconductor devices - Micro-electromechanical devices -- Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011)
LST ETS 300 135-1997 Radio equipment and systems(RES). Angle modulated Citizens' Band radio equipment (CEPT PR 27 radio equipment). Technical characteristics and methods of measurement
LST ETS 300 135-1997/A1-1997 Radio equipment and systems(RES). Angle modulated Citizens' Band radio equipment (CEPT PR 27 radio equipment). Technical characteristics and methods of measurement
LST EN 60947-4-2-2012 Low-voltage switchgear and controlgear -- Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters (IEC 60947-4-2:2011)
LST EN 300 135-1 V1.2.1-2009 Electromagnetic compatibility and Radio spectrum Matters (ERM); Land Mobile Service; Citizens' Band (CB) radio equipment; Angle-modulated Citizens' Band radio equipment (PR 27 Radio Equipment); Part 1: Technical characteristics and methods of measurement
LST EN ISO 13000-2:2005 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2005)
LST EN 61000-3-2-2006 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current <= 16 A per phase) (IEC 61000-3-2:2005)

JP-JRA, Half wave plate preparation

JRA GL-07-2008 Guideline of limits for harmonic current emissions from refrigeration and air conditioning equipment

Professional Standard - Aviation, Half wave plate preparation

HB 5246-1993 Preparation method of standard test piece of room temperature vulcanization sealant

PL-PKN, Half wave plate preparation

PN T86161-1991 Method of measurement of speed fluctuations in sound recording and reproducing equipment
PN P50069-1974 Half-products of the paper industry Preparation of test samples for determination of optical proprieties
PN P50072-1965 Products of paper industry Laboratory preparation o? samples (shee?s) o? corrugated board for phisical ?esting

Standard Association of Australia （SAA）, Half wave plate preparation

AS 2279.2:1991 Disturbances in mains supply networks - Limitation of harmonics caused by industrial equipment
AS 2279.4:1991 Disturbances in mains supply networks - Limitation of voltage fluctuations caused by industrial equipment
AS/NZS 61000.3.2:2013
AS/NZS IEC 60947.4.2:2015
AS 60947.4.2:2004 Low-voltage switchgear and controlgear - Contactors and motor-starters - A.C. semiconductor motor controllers and starters
AS/NZS IEC 61000.3.2:2023 Electromagnetic compatibility (EMC), Part 3.2: Limits — Limits for harmonic current emissions (equipment input current ≤16 A per phase)
AS/NZS IEC 60947.4.3:2015
AS/NZS 3947.4.3:2000 Low-voltage switchgear and controlgear - Contactors and motor-starters - A.C. semiconductor controllers and contactors for non-motor loads

CENELEC - European Committee for Electrotechnical Standardization, Half wave plate preparation

EN 60204-33:2011 Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
EN IEC 61000-3-2:2019 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current ≤16 A per phase)
EN 60947-4-2:1996 Low-Voltage Switchgear and Controlgear Part 4: Contactors and Motor-Starters Section 2: AC Semiconductor Motor Controllers and Starters
EN 60947-4-2:2000 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters (Incorporates Amendment A1: 2002)

Institute of Electrical and Electronics Engineers (IEEE), Half wave plate preparation

IEEE Std 1687-2014 IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
IEEE 1687-2014 Access and Control of Instrumentation Embedded within a Semiconductor Device (IEEE Computer Society)
IEEE P1687/D1.62, September 2013 IEEE Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
IEEE P1687/D1.71, March 2014 IEEE Approved Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device

IN-BIS, Half wave plate preparation

IS 12866-1989

International Telecommunication Union (ITU), Half wave plate preparation

ITU-T G.230-1988 Measurement methods for noise produced by modulating equipment and through-connection filters
ITU-T G.230-1993 MEASURING METHODS FOR NOISE PRODUCED BY MODULATING EQUIPMENT AND THROUGH-CONNECTION FILTERS
ITU-T G.230 FRENCH-1993 MEASURING METHODS FOR NOISE PRODUCED BY MODULATING EQUIPMENT AND THROUGH-CONNECTION FILTERS
ITU-T G.230 SPANISH-1993 MEASURING METHODS FOR NOISE PRODUCED BY MODULATING EQUIPMENT AND THROUGH-CONNECTION FILTERS
ITU-T G.230-1989 Measuring Methods for Noise Produced by Modulating Equipment and Through-Connection Filters - International Analogue Carrier Systems Study Group 15

SAE - SAE International, Half wave plate preparation

SAE EIA-4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges

Association for Information and Image Management (AIIM), Half wave plate preparation

AIIM MS29-1992 Micrographics - Cores and Spools for Microfilm Recording Equipment - Dimensions

Conference of European Post Telecommunication (CEPT), Half wave plate preparation

CEPT/ERC/REC 01-07 E-1995 Harmonised Regime for Exemption from Licensing of Radio Equipment (Bonn 1995)

International Organization for Standardization (ISO), Half wave plate preparation

ISO 5269-1:1979 Pulps — Preparation of laboratory sheets for physical testing — Part 1: Conventional sheet-former method
ISO 4661-2:1987 Rubber, vulcanized; Preparation of samples and test pieces; Part 2 : Chemical tests
ISO 4661-2:2018 Rubber, vulcanized - Preparation of samples and test pieces - Part 2: Chemical tests
ISO/TR 21828:2010 Guidance on standards available for preparation and testing of monolithic, unshaped refractory products
ISO 13000-2:2005 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties
ISO 13000-2:2021 Plastics — Polytetrafluoroethylene (PTFE) semi-finished products — Part 2: Preparation of test specimens and determination of properties
ISO 4661-1:1993 Rubber, vulcanized or thermoplastic; preparation of samples and test pieces; part 1: physical tests

KR-KS, Half wave plate preparation

KS M ISO 5269-1-2021 Pulps — Preparation of laboratory sheets for physical testing —Part 1: Conventional sheet-former method
KS M ISO 5269-1-2016 Pulps－Preparation of laboratory sheets for physical testing－Part 1：Conventional sheet-former method

CZ-CSN, Half wave plate preparation

CSN 35 4102-1997 Low-voltage controlgear Part 2: Semiconductor contactors (solid state contactors)

European Committee for Standardization (CEN), Half wave plate preparation

HD 419.2 S1-1987 Low-voltage controlgear; part 2: semiconductor contactors (solid state contactors)
CEN/TR 10377:2023 Guidelines for the preparation of standard routine methods with wavelength-dispersive X-ray fluorescence spectrometry
EN ISO 13000-2:1997 Plastics - Polytetrafluoroethylene (PTFE) Semi-Finished Products - Part 2: Preparation of Specimens and Determination of Properties ISO 13000-2:1997
EN ISO 13000-2:2021 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2021)

IEC - International Electrotechnical Commission, Half wave plate preparation

PAS 62593-2008 Measurement method of a half-wavelength voltage for Mach-Zehnder optical modulators in wireless communication and broadcasting systems (Edition 1.0)
PAS 62240-2001 Use of Semiconductor Devices Outside Manufacturer's Specified Temperature Ranges (Edition 1.0)
TS 61994-4-4-2018 Piezoelectric@ dielectric and electrostatic devices and associated materials for frequency control@ selection and detection - Glossary - Part 4-4: Piezoelectric materials - Single crystal wafers for surface acoustic wave (SAW) devices (Edition 3.0)
TS 61994-4-4 (REDLINE + STANDARD)-2018 Piezoelectric@ dielectric and electrostatic devices and associated materials for frequency control@ selection and detection - Glossary - Part 4-4: Piezoelectric materials - Single crystal wafers for surface acoustic wave (SAW) devices (Edition 3.0)

Professional Standard - Civil Aviation, Half wave plate preparation

MH/T 4017-2004 S band primary surveillance radar technical specification for ATC

NEMA - National Electrical Manufacturers Association, Half wave plate preparation

NEMA LC 1-2007 Test Procedure for Compatibility Of Hearing Aids and Ultrasonic Lighting Control Devices

Yunnan Provincial Standard of the People's Republic of China, Half wave plate preparation

DB53/T 656.3-2014 Complete set of equipment for non-ferrous metal electric lead refining system part 3: lead flake preparation unit

AENOR, Half wave plate preparation

UNE-EN 61000-3-2:2014 Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current emissions (equipment input current
UNE-EN 60947-4-2:2013 Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters - AC semiconductor motor controllers and starters
UNE-EN 1514-4:1997 FLANGES AND THEIR JOINTS. DIMENSIONS OF GASKETS FOR PN-DESIGNATED FLANGES. PART 4: CORRUGATED, FLAT OR GROOVED METALLIC AND FILLED METALLIC GASKETS FOR USE WITH STEEL FLANGES.
UNE-EN 60947-4-3:2014 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
UNE-EN ISO 13000-2:2006 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2005)

Taiwan Provincial Standard of the People's Republic of China, Half wave plate preparation

CNS 14502-2001 Steel and steel products-Location and preparation of samples and test pieces for mechanical testing
CNS 15101-2007 Rubber - General procedures for preparing and conditioning test pieces for physical test methods
CNS 14934.2-2005 Electromagnetic compatibility (EMC) - Limits - Part 2: Limits for harmonic current emissions (equipment input current ≦16A per phase)
CNS 14934-2-2005 Electromagnetic compatibility (EMC) - Limits - Part 2: Limits for harmonic current emissions (equipment input current ≦16A per phase)

Professional Standard - Ferrous Metallurgy, Half wave plate preparation

YB/T 036.10-1992 Ultrasonic flaw detection method for steel forgings in general technical conditions for metallurgical equipment manufacturing

North Atlantic Treaty Organization Standards Agency, Half wave plate preparation

STANAG 2604-1986 BRAKING SYSTEMS BETWEEN TRACTORS, DRAW-BAR TRAILER AND SEMI-TRAILER EQUIPMENT COMBINATIONS FOR MILITARY USE

未注明发布机构, Half wave plate preparation

BS 5424-2:1987(1999) Low - voltage controlgear — Part 2 : Specification for semiconductor contactors (solid state contactors)
BS CECC 13:1985(1999) Harmonized system of quality assessment for electronic components : Basic specification : Scanning electron microscope inspection of semiconductor dice

ZA-SANS, Half wave plate preparation

SANS 4661-2:2003 Rubber, vulcanized - Preparation of samples and test pieces Part 2: Chemical tests

国家质量监督检验检疫总局, Half wave plate preparation

SN/T 4564-2016 Preparation method of metallographic specimens for identification of grain orientation of electrical steel sheets (strips)

European Telecommunications Standards Institute (ETSI), Half wave plate preparation

ETSI PRETS 300 135-1990 Radio Equipment and Systems Angle Modulated Citizens' Band Radio Equipment (CEPT PR 27 Radio Equipment) Technical Characteristics and Methods of Measurement

CU-NC, Half wave plate preparation

NC 15-57-1986 Cool Technique, Commercial and Industrial Equipment. Thermal-Charge Calculation Sheet for Air-conditioning Installations

GM North America, Half wave plate preparation

GM GM9615P-1988 Panel Preparation for Weld Compatibility Test for a Sheet Metal Forming Lubricant

SSPC - The Society for Protective Coatings, Half wave plate preparation

VIS 1-2002 Guide and Reference Photographs for Steel Surfaces Prepared by Dry Abrasive Blast Cleaning (TEXT ONLY)

SE-SIS, Half wave plate preparation

SIS SS-ETS 300 135-1991 Radio Equipment and Systems — Angle- modulated Citizens' Band radio equipment (CEPT PR 27 Radio Equipment) — Technical characteristics and methods of measure-ment

IT-UNI, Half wave plate preparation

UNI EN ISO 13000-2:2021 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties

CO-ICONTEC, Half wave plate preparation

ICONTEC 2766-1990

Underwriters Laboratories (UL), Half wave plate preparation

UL 60947-4-2 BULLETIN-2015 UL Standard for Safety Low-Voltage Switchgear and Controlgear – Part 4-2: Contactors and Motor-Starters – AC Semiconductor Motor Controllers and Starters

ETSI - European Telecommunications Standards Institute, Half wave plate preparation

ETSI EN 300 135-1:2007 Electromagnetic compatibility and Radio spectrum Matters (ERM); Land Mobile Service; Citizens' Band (CB) radio equipment; Angle-modulated Citizens' Band radio equipment (PR 27 Radio Equipment); Part 1: Technical characteristics and methods of measurement
ETSI EN 300 135-1:2008 Electromagnetic compatibility and Radio spectrum Matters (ERM); Land Mobile Service; Citizens' Band (CB) radio equipment; Angle-modulated Citizens' Band radio equipment (PR 27 Radio Equipment); Part 1: Technical characteristics and methods of measurement

CH-SNV, Half wave plate preparation

SN EN ISO 13000-2:2021 Plastics - Polytetrafluoroethylene (PTFE) semi-finished products - Part 2: Preparation of test specimens and determination of properties (ISO 13000-2:2021)

National Association of Corrosion Engineers (NACE), Half wave plate preparation

NACE RP0775-1999 Preparation, Installation, Analysis, and Interpretation of Corrosion Coupons in Oilfield Operations Item No:21017